公开(公告)号：US20080141527A1

公开(公告)日：2008-06-19

申请号：US11861650

申请日：2007-09-26

Applicant: CHENG-HSIEN LIN ,  WEN-CHIN LEE

Inventor： CHENG-HSIEN LIN ,  WEN-CHIN LEE

IPC: H05K3/46

CPC classification number: H05K3/4611 ,  H05K1/0393 ,  H05K3/281 ,  H05K3/386 ,  H05K3/4635 ,  H05K3/4638 ,  H05K3/4652 ,  H05K3/4679 ,  H05K2201/09063 ,  H05K2203/068 ,  H05K2203/1476 ,  H05K2203/166 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49155

Abstract: The present inventions relates to a method for manufacturing a multilayer FPCB. The method includes the steps of providing three copper clad laminates and two binder layers, each of the copper clad laminates includes a dielectric layer and at least one patterned conductive layer formed on the dielectric layer; stacking the copper clad laminates and the binder layers alternately one on another; aligning the copper clad laminates and the binder layers; and compressing the copper clad laminates and the binder layers together thereby obtaining a multilayer flexible printed circuit board.

Abstract translation: 本发明涉及一种多层FPCB的制造方法。 该方法包括以下步骤：提供三个覆铜层压板和两个粘合剂层，每个覆铜层压板包括介电层和形成在介电层上的至少一个图案化导电层; 将覆铜层压板和粘合剂层交替地堆叠在一起; 对准覆铜层压板和粘合剂层; 并且将覆铜层压板和粘合剂层压在一起，从而获得多层柔性印刷电路板。

公开(公告)号：US20080029219A1

公开(公告)日：2008-02-07

申请号：US11610642

申请日：2006-12-14

Applicant: WEN-CHIN LEE ,  CHENG-HSIEN LIN

Inventor： WEN-CHIN LEE ,  CHENG-HSIEN LIN

IPC: C23F1/00

CPC classification number: H05K3/068 ,  B05B1/205 ,  H05K2203/075 ,  Y10S134/902

Abstract: An apparatus (100) for spraying an etchant solution on a preformed printed circuit board (30) includes a number of feed pipes (40) for supplying the etchant solution and a number of nozzles (45) mounted on the feed pipes. Each of the feed pipes has a middle portion (402) and two end portions (401). The middle portions of the feed pipes are located on a first plane and the end portions of the feed pipes are located on a second plane parallel to the first plane. The number of nozzles are mounted on the middle portion and the two end portions of each feed pipe. The number of nozzles are in fluid communication with the feed pipes.

Abstract translation: 用于在预成型印刷电路板（30）上喷涂蚀刻剂溶液的装置（100）包括用于供应蚀刻剂溶液的多个进料管（40）和安装在进料管上的多个喷嘴（45）。 每个进料管具有中间部分（402）和两个端部（401）。 进料管的中间部分位于第一平面上，并且进料管的端部位于平行于第一平面的第二平面上。 喷嘴的数量安装在每个进料管的中间部分和两个端部。 喷嘴的数量与进料管流体连通。

公开(公告)号：US20070075386A1

公开(公告)日：2007-04-05

申请号：US11309294

申请日：2006-07-21

Applicant: CHIA-SHUO HSU

Inventor： CHIA-SHUO HSU

IPC: H01L29/82 ,  H01L27/14 ,  H01L29/84 ,  H01L21/00

CPC classification number: H05K3/002 ,  H01L21/67086 ,  H05K1/0393 ,  H05K2203/1545

Abstract: The present invention provides a film hole forming apparatus (400), which includes a chemical etching system (410) and a driving system (420). The driving system comprising a transmission belt, which pass through the chemical etching system. A material of the transmission belt being teflon, teflon-containing material, poly (vinylidene finoride), metal, or metal-sandwiched composite. The present invention also provides a method for forming film holes, which includes the following steps: providing a flexible printed circuit board to be etched, with copper holes pre-formed thereat and the copper holes expose base film (310) at corresponding positions; and transporting the flexible printed circuit boards into a chemical etching system by a transmission belt to form film holes in the base film.

Abstract translation: 本发明提供一种薄膜孔形成装置，其包括化学蚀刻系统（410）和驱动系统（420）。 驱动系统包括通过化学蚀刻系统的传动带。 传输带的材料是聚四氟乙烯，含特氟隆的材料，聚（偏二氟乙烯），金属或金属夹层的复合材料。 本发明还提供一种形成薄膜孔的方法，包括以下步骤：提供待蚀刻的柔性印刷电路板，其中预先形成有铜孔，铜孔在相应位置暴露基膜（310）; 并通过传动带将柔性印刷电路板输送到化学蚀刻系统中，以在基膜中形成薄膜孔。

公开(公告)号：US20110308082A1

公开(公告)日：2011-12-22

申请号：US13095877

申请日：2011-04-28

Applicant: YE-NING CHEN

Inventor： YE-NING CHEN

IPC: H05K3/42

CPC classification number: H05K3/0008 ,  H05K1/0266 ,  H05K3/429 ,  H05K3/4652 ,  H05K2201/0969 ,  Y10T29/49126 ,  Y10T29/49131 ,  Y10T29/49133 ,  Y10T29/49165

Abstract: A method for manufacturing multilayer printed circuit board includes steps below. A first copper clad laminate includes a central portion and a peripheral portion is provided. A group of concentric copper annular collars is formed by etching the peripheral portion. A second copper clad laminate and an adhesive layer is laminated on to the first copper clad laminate in a manner that the adhesive is sandwiched between the first copper clad laminate and the second copper clad laminate to form a multilayer substrate. A detection hole is formed run through the multilayer substrate. An offset distance is determined and plated through holes in the central portion of the multilayer substrate is formed based on the offset distance.

Abstract translation: 一种制造多层印刷电路板的方法包括以下步骤。 第一覆铜层压板包括中心部分和周边部分。 通过蚀刻周边部分形成一组同心铜环形环。 将第二覆铜层压板和粘合剂层以将粘合剂夹在第一覆铜层压板和第二覆铜层压板之间的方式层压到第一覆铜层压板上以形成多层基板。 穿过多层基板形成检测孔。 确定偏移距离，并且基于偏移距离形成多层基板的中心部分中的孔的电镀。

公开(公告)号：US20110302775A1

公开(公告)日：2011-12-15

申请号：US13116001

申请日：2011-05-26

Applicant: XUE-JUN CAI ,  ZHI-YONG LI ,  CHAO LIU

Inventor： XUE-JUN CAI ,  ZHI-YONG LI ,  CHAO LIU

IPC: H05K3/00

CPC classification number: H05K3/4697 ,  H05K3/462 ,  H05K3/4647 ,  H05K2203/061 ,  H05K2203/0733 ,  Y10T29/49124 ,  Y10T29/49128 ,  Y10T29/49155

Abstract: A method for manufacturing a printed circuit board with cavity includes following steps. First, a first substrate is provided. The first substrate includes a first electrically conductive layer defining an exposed portion and a laminating portion. Second, a second substrate is provided. The second substrate includes an unwanted portion corresponding to the exposed portion and a preserving portion. Third, a first annular bump surrounding the exposed portion is formed. Fourth, a second annular bump surrounding the unwanted portion is formed. Fifth, a first adhesive layer defining an opening is provided. Sixth, the first and second substrates are laminated to the first adhesive layer, the exposed portion and the unwanted portion are exposed in the opening, and the second annular bump is in contact with the first annular bump. Seventh, the unwanted portion is removed and a cavity is defined, the exposed portion is exposed in the cavity.

Abstract translation: 制造具有空腔的印刷电路板的方法包括以下步骤。 首先，提供第一基板。 第一衬底包括限定暴露部分的第一导电层和层压部分。 其次，设置第二基板。 第二基板包括对应于暴露部分的不期望部分和保留部分。 第三，形成围绕暴露部分的第一环形凸块。 第四，形成围绕不想要的部分的第二环形凸起。 第五，提供限定开口的第一粘合剂层。 第六，将第一和第二基板层叠到第一粘合剂层上，将暴露部分和不想要的部分暴露在开口中，并且第二环形凸块与第一环形凸起接触。 第七，去除不想要的部分并且限定空腔，暴露部分暴露在空腔中。

公开(公告)号：US20110274866A1

公开(公告)日：2011-11-10

申请号：US13186486

申请日：2011-07-20

Applicant: CHIH-KANG YANG ,  CHENG-HSIEN LIN

Inventor： CHIH-KANG YANG ,  CHENG-HSIEN LIN

IPC: B65D65/28

CPC classification number: H05K3/0097 ,  H05K1/0393 ,  H05K3/06 ,  H05K3/242 ,  H05K3/4611 ,  H05K3/4635 ,  H05K3/4652 ,  H05K3/4691 ,  H05K2201/055 ,  H05K2201/09036 ,  H05K2201/09063 ,  H05K2201/1028 ,  H05K2203/1536 ,  H05K2203/1545 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49135 ,  Y10T29/49165 ,  Y10T428/15

Abstract: An exemplary inner substrate for manufacturing multilayer printed circuit boards is provided. The inner substrate has a number of substrate units and a number of transverse folding portions alternately arranged along a longitudinal direction of the inner substrate. Each of the substrate units is configured for forming a unitary printed circuit board. Each of the folding portions is interconnected between neighboring substrate units. Each of the folding portions defines at least one line of weakness perpendicular to the longitudinal direction of the inner substrate for facilitating folding and unfolding the neighboring substrate units to each other. Each of the folding portions defines at least one groove in at least one side thereof along the at least one line of weakness.

Abstract translation: 提供了用于制造多层印刷电路板的示例性内基板。 内部基板具有多个基板单元和沿着内部基板的纵向方向交替排列的多个横向折叠部。 每个基板单元被构造成用于形成一体的印刷电路板。 每个折叠部分在相邻的基板单元之间互连。 每个折叠部分限定垂直于内部基板的纵向方向的至少一条弱线，以便于相邻的基板单元相互折叠和展开。 每个折叠部分沿着至少一条弱点在其至少一侧限定至少一个凹槽。

公开(公告)号：US20110269319A1

公开(公告)日：2011-11-03

申请号：US12979369

申请日：2010-12-28

Applicant: CHIEN-PANG CHENG

Inventor： CHIEN-PANG CHENG

IPC: H01R12/52

CPC classification number: H01R12/7082 ,  H01R12/721 ,  H01R12/73 ,  H05K1/144 ,  H05K1/147 ,  H05K3/365 ,  H05K2201/0133 ,  H05K2201/0311 ,  H05K2201/042 ,  H05K2201/10409 ,  H05K2201/2036

Abstract: A PCB module includes a first rigid PCB having a first edge connector, a second rigid PCB having a second edge connector, and a connecting mechanism. The connecting mechanism includes a flexible connecting board, an elastic member, and a fixing member. The flexible connecting has a number of connecting circuit traces isolated from each other. The flexible connecting board is bent in such a manner that a first end portion is in contact with the first edge connector, and a second end portion is in contact with the second edge connector. Thus, the first edge connector is electrically connected with the second edge connector by the traces. The elastic member is compressed between the end portions of the flexible connecting board. The fixing member is configured to fix the first rigid PCB to the second rigid PCB and compress the elastic member.

Abstract translation: PCB模块包括具有第一边缘连接器的第一刚性PCB，具有第二边缘连接器的第二刚性PCB以及连接机构。 连接机构包括柔性连接板，弹性部件和固定部件。 柔性连接具有彼此隔离的多个连接电路迹线。 柔性连接板弯曲成使得第一端部与第一边缘连接器接触，并且第二端部与第二边缘连接器接触。 因此，第一边缘连接器通过迹线与第二边缘连接器电连接。 弹性构件在柔性连接板的端部之间被压缩。 固定构件被构造成将第一刚性PCB固定到第二刚性PCB并压缩弹性构件。

公开(公告)号：US20110247207A1

公开(公告)日：2011-10-13

申请号：US13164776

申请日：2011-06-21

Applicant: JUN-QING ZHANG ,  CHIH-YI TU ,  SZU-MIN HUANG

Inventor： JUN-QING ZHANG ,  CHIH-YI TU ,  SZU-MIN HUANG

IPC: H05K3/46 ,  H05K3/40 ,  H05K3/36

CPC classification number: H05K3/4697 ,  H05K1/0393 ,  H05K3/4611 ,  H05K3/4635 ,  H05K2201/0394 ,  H05K2201/0909 ,  H05K2201/09127 ,  H05K2203/061 ,  H05K2203/063 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165

Abstract: A method for manufacturing a multilayer FPCB which includes providing a first substrate, a second substrate and a binder layer; defining an opening on the binder layer; defining a first slit in the dielectric layer of the first substrate; laminating the first substrate, the binder layer and the second substrate; forming a second slit in the conductive layer of the first substrate, the second slit being created so as to align with the first slit, cutting the first substrate, the binder layer and the second substrate thereby forming a multilayer flexible printed circuit board having different numbers of layers in different areas.

Abstract translation: 一种制造多层FPCB的方法，包括提供第一基板，第二基板和粘合剂层; 在粘合剂层上限定开口; 限定所述第一基板的介电层中的第一狭缝; 层压第一基板，粘合剂层和第二基板; 在所述第一基板的所述导电层中形成第二狭缝，所述第二狭缝被形成为与所述第一狭缝对准，切割所述第一基板，所述粘合剂层和所述第二基板，从而形成具有不同数量的多层柔性印刷电路板 的层次在不同的地区。

公开(公告)号：US20110240215A1

公开(公告)日：2011-10-06

申请号：US13046792

申请日：2011-03-14

Applicant: CHIEN-PANG CHENG

Inventor： CHIEN-PANG CHENG

IPC: B32B38/10

CPC classification number: H05K3/4691 ,  H05K2203/063 ,  H05K2203/068

Abstract: A method for manufacturing a rigid-flexible printed circuit boards includes following steps. First, a first rigid substrate is attached to a first adhesive layer. Second, a first opening through the combined first rigid substrate and the first adhesive layer is defined. Third, the first rigid substrate is laminated to a flexible substrate, the flexible substrate includes an exposed portion exposed via the first opening. Fourth, a second rigid substrate is attached to a second adhesive, a glass transition temperature of the second adhesive layer being lower than that of the first adhesive layer. Fifth, a second opening through the combined first rigid substrate and the first adhesive layer is defined. Sixth, the second rigid substrate is laminated to the flexible substrate in such a manner that the flexible substrate is sandwiched between the first and second adhesive layers, the exposed portion is exposed in the first and the second openings.

Abstract translation: 制造刚柔柔性印刷电路板的方法包括以下步骤。 首先，将第一刚性基板附接到第一粘合剂层。 其次，定义了通过组合的第一刚性基板和第一粘合剂层的第一开口。 第三，将第一刚性基板层压到柔性基板上，柔性基板包括经由第一开口露出的暴露部分。 第四，第二刚性基板附着到第二粘合剂上，第二粘合剂层的玻璃化转变温度低于第一粘合剂层的玻璃化转变温度。 第五，限定通过组合的第一刚性基板和第一粘合剂层的第二开口。 第六，将第二刚性基板以柔性基板夹在第一和第二粘合剂层之间的方式层压到柔性基板上，暴露部分暴露在第一和第二开口中。

公开(公告)号：US20110239222A1

公开(公告)日：2011-09-29

申请号：US12978429

申请日：2010-12-24

Applicant: XIAO-BIN WU

Inventor： XIAO-BIN WU

IPC: G06F9/50

CPC classification number: G05B19/042

Abstract: A computer and method obtains user input from an input device to determine applicable installation information of an apparatus according to resource consumption of the apparatus. The computer and method are capable of obtaining resource consumption information of an apparatus according to the installation material from an input device and operable to perform transformation processing to obtain installation data according to resource consumption information of the apparatus. Differences between the installation data and standard specifications are calculated and the specified standard specification corresponding to a difference which is the smallest number in the differences is found. The specified standard specification is outputted.

Abstract translation: 计算机和方法从输入设备获得用户输入，以根据设备的资源消耗来确定设备的适用安装信息。 计算机和方法能够根据来自输入设备的安装材料获得设备的资源消耗信息，并可操作以根据设备的资源消耗信息执行变换处理以获得安装数据。 计算安装数据和标准规格之间的差异，并找到与差异中最小数字的差异相对应的规定标准规格。 输出规定的标准规格。