公开(公告)号：US20090277680A1

公开(公告)日：2009-11-12

申请号：US12346804

申请日：2008-12-30

Applicant: WEN-CHIN LEE ,  CHENG-HSIEN LIN

Inventor： WEN-CHIN LEE ,  CHENG-HSIEN LIN

IPC: H05K9/00 ,  B32B27/06

CPC classification number: H05K3/4641 ,  B82Y10/00 ,  H05K1/056 ,  H05K9/0088 ,  H05K2201/026 ,  H05K2201/0323 ,  Y10S977/70 ,  Y10S977/701 ,  Y10S977/712 ,  Y10S977/734 ,  Y10T428/24116 ,  Y10T428/30 ,  Y10T442/10

Abstract: An insulating film includes a first polymer layer, a second polymer layer and an electromagnetic shielding layer sandwiched between the first polymer layer and the second polymer layer. The electromagnetic shielding layer includes a number of carbon nanotube films that are substantially parallel to the first and second polymer layer. Each of the carbon nanotube films includes a number of carbon nanotubes that are substantially parallel to each other. The insulating film can provide anti-EMI effect in printed circuit boards without employing additional electromagnetic shielding layers.

Abstract translation: 绝缘膜包括第一聚合物层，第二聚合物层和夹在第一聚合物层和第二聚合物层之间的电磁屏蔽层。 电磁屏蔽层包括大致平行于第一和第二聚合物层的多个碳纳米管薄膜。 每个碳纳米管膜包括基本上彼此平行的多个碳纳米管。 绝缘膜可以在印刷电路板中提供抗电磁效应，而不需要额外的电磁屏蔽层。

公开(公告)号：US20090050354A1

公开(公告)日：2009-02-26

申请号：US12057654

申请日：2008-03-28

Applicant: WEN-CHIN LEE ,  CHENG-HSIEN LIN

Inventor： WEN-CHIN LEE ,  CHENG-HSIEN LIN

IPC: H05K1/03

CPC classification number: H05K1/056 ,  H05K1/0393 ,  H05K2201/0355 ,  H05K2201/0382

Abstract: A printed circuit board substrate includes an insulation matrix and a waterproof layer. The insulation matrix includes a first surface and a second surface at an opposite side thereof to the first surface. The waterproof layer is formed in the insulation matrix and is arranged between the first surface and the second surface for blocking water from passing therethrough in a thicknesswise direction of the insulation matrix.

Abstract translation: 印刷电路板基板包括绝缘基体和防水层。 绝缘矩阵包括与第一表面相对的第一表面和第二表面。 防水层形成在绝缘基体中，并且布置在第一表面和第二表面之间，用于阻挡水在绝缘基体的厚度方向上穿过其中。

公开(公告)号：US20080264675A1

公开(公告)日：2008-10-30

申请号：US11847297

申请日：2007-08-29

Applicant: WEN-CHIN LEE ,  CHENG-HSIEN LIN

Inventor： WEN-CHIN LEE ,  CHENG-HSIEN LIN

IPC: H05K1/00 ,  B23K26/38

CPC classification number: H05K3/281 ,  B23K1/0016 ,  B23K26/361 ,  H05K3/0035 ,  H05K3/28 ,  H05K3/3452

Abstract: An exemplary method for manufacturing a printed circuit board is provided. In the method, firstly, a circuit substrate having a substrate and a number of soldering pads is provided. Secondly, a protective layer is formed onto the circuit substrate in a manner such that the soldering pads are entirely covered by the protective layer. Fourthly, a laser beam is applied onto portions of the protective layer spatially corresponding to the soldering pads in a manner such that the portions of the protective layer is removed, thereby exposing the soldering pads to an exterior. A printed circuit board having a protective layer with high precision of resolution is also provided.

Abstract translation: 提供了制造印刷电路板的示例性方法。 在该方法中，首先，提供具有基板和多个焊盘的电路基板。 其次，以使得焊盘完全被保护层覆盖的方式在电路基板上形成保护层。 第四，以保护层的部分被去除的方式将激光束施加到空间对应于焊盘的保护层的部分上，从而将焊盘暴露于外部。 还提供了具有高精度分辨率的保护层的印刷电路板。

公开(公告)号：US20080070429A1

公开(公告)日：2008-03-20

申请号：US11567593

申请日：2006-12-06

Applicant: WEN-CHIN LEE ,  CHENG-HSIEN LIN

Inventor： WEN-CHIN LEE ,  CHENG-HSIEN LIN

IPC: H05K1/00

CPC classification number: H05K3/3442 ,  H05K2201/09181 ,  H05K2201/10636 ,  H05K2201/10727 ,  Y02P70/611 ,  Y02P70/613

Abstract: An exemplary surface mounted electronic component has block body including a bottom soldering surface, a top surface and a peripheral wall having a first peripheral wall portion and a second peripheral wall portion. The bottom soldering surface defines a first soldering area and a second soldering area. The first peripheral wall portion adjoins the first soldering area and has at least a first cutout defined between the first peripheral wall portion and the first soldering area. The second peripheral wall portion adjoins the second soldering area and has at least a second cutout defined between the second peripheral wall portion and the second soldering area. When the surface mounted electronic component is soldered, the melting solder can climb up the cutouts of the sidewall due to capillary effect and ‘chimney effect’, thereby avoiding ‘tombstoning’.

Abstract translation: 示例性的表面安装电子部件具有块体，其包括底部焊接表面，顶表面和具有第一周壁部分和第二周壁部分的周壁。 底部焊接表面限定第一焊接区域和第二焊接区域。 所述第一周壁部分邻接所述第一焊接区域，并且至少具有限定在所述第一周壁部分和所述第一焊接区域之间的第一切口。 所述第二周壁部分邻接所述第二焊接区域，并且在所述第二周壁部分和所述第二焊接区域之间具有至少第二切口。 当表面安装的电子部件被焊接时，由于毛细管效应和“烟囱效应”，熔化焊料可以爬上侧壁的切口，从而避免“墓碑”。

公开(公告)号：US20070266559A1

公开(公告)日：2007-11-22

申请号：US11560787

申请日：2006-11-16

Applicant: WEN-CHIN LEE ,  CHENG-HSIEN LIN

Inventor： WEN-CHIN LEE ,  CHENG-HSIEN LIN

IPC: H01K3/10 ,  H05K3/10

CPC classification number: H05K3/4652 ,  H05K3/0035 ,  H05K3/421 ,  H05K3/429 ,  H05K2201/096 ,  H05K2201/09845 ,  H05K2203/0554 ,  H05K2203/1476 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49165

Abstract: An exemplary method for forming stacked via-holes in a multilayer printed circuit board includes the steps of: providing a base circuit board; attaching a first copper-coated-substrate having a first substrate and a first copper layer thereon and a second copper-coated-substrate having a second substrate and a second copper layer thereon onto the base circuit board in a manner such that; forming at least one first window in the second copper layer, making at least one first hole in the second substrate through the at least one first window, forming at least one second window in the first copper layer through the at least one first hole, and making at least one second hole in the first substrate though the at least one second window, thus forming at least one part-finished stacked via-hole; and plating the at least one part-finished stacked via-hole thereby forming at least one stacked via-hole.

Abstract translation: 在多层印刷电路板中形成堆叠的通孔的示例性方法包括以下步骤：提供基底电路板; 将其上具有第一基板和第一铜层的第一铜涂覆基板和其上具有第二基板和第二铜层的第二铜涂覆基板以如下方式附接到基板电路板上; 在所述第二铜层中形成至少一个第一窗口，通过所述至少一个第一窗口在所述第二基板中形成至少一个第一孔，通过所述至少一个第一孔在所述第一铜层中形成至少一个第二窗口，以及 通过所述至少一个第二窗口在所述第一基板中形成至少一个第二孔，从而形成至少一个部分精加工的堆叠通孔; 以及对所述至少一个部分精加工的堆叠通孔进行电镀，从而形成至少一个堆叠的通孔。

公开(公告)号：US20080141527A1

公开(公告)日：2008-06-19

申请号：US11861650

申请日：2007-09-26

Applicant: CHENG-HSIEN LIN ,  WEN-CHIN LEE

Inventor： CHENG-HSIEN LIN ,  WEN-CHIN LEE

IPC: H05K3/46

CPC classification number: H05K3/4611 ,  H05K1/0393 ,  H05K3/281 ,  H05K3/386 ,  H05K3/4635 ,  H05K3/4638 ,  H05K3/4652 ,  H05K3/4679 ,  H05K2201/09063 ,  H05K2203/068 ,  H05K2203/1476 ,  H05K2203/166 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49155

Abstract: The present inventions relates to a method for manufacturing a multilayer FPCB. The method includes the steps of providing three copper clad laminates and two binder layers, each of the copper clad laminates includes a dielectric layer and at least one patterned conductive layer formed on the dielectric layer; stacking the copper clad laminates and the binder layers alternately one on another; aligning the copper clad laminates and the binder layers; and compressing the copper clad laminates and the binder layers together thereby obtaining a multilayer flexible printed circuit board.

Abstract translation: 本发明涉及一种多层FPCB的制造方法。 该方法包括以下步骤：提供三个覆铜层压板和两个粘合剂层，每个覆铜层压板包括介电层和形成在介电层上的至少一个图案化导电层; 将覆铜层压板和粘合剂层交替地堆叠在一起; 对准覆铜层压板和粘合剂层; 并且将覆铜层压板和粘合剂层压在一起，从而获得多层柔性印刷电路板。

公开(公告)号：US20080029219A1

公开(公告)日：2008-02-07

申请号：US11610642

申请日：2006-12-14

Applicant: WEN-CHIN LEE ,  CHENG-HSIEN LIN

Inventor： WEN-CHIN LEE ,  CHENG-HSIEN LIN

IPC: C23F1/00

CPC classification number: H05K3/068 ,  B05B1/205 ,  H05K2203/075 ,  Y10S134/902

Abstract: An apparatus (100) for spraying an etchant solution on a preformed printed circuit board (30) includes a number of feed pipes (40) for supplying the etchant solution and a number of nozzles (45) mounted on the feed pipes. Each of the feed pipes has a middle portion (402) and two end portions (401). The middle portions of the feed pipes are located on a first plane and the end portions of the feed pipes are located on a second plane parallel to the first plane. The number of nozzles are mounted on the middle portion and the two end portions of each feed pipe. The number of nozzles are in fluid communication with the feed pipes.

Abstract translation: 用于在预成型印刷电路板（30）上喷涂蚀刻剂溶液的装置（100）包括用于供应蚀刻剂溶液的多个进料管（40）和安装在进料管上的多个喷嘴（45）。 每个进料管具有中间部分（402）和两个端部（401）。 进料管的中间部分位于第一平面上，并且进料管的端部位于平行于第一平面的第二平面上。 喷嘴的数量安装在每个进料管的中间部分和两个端部。 喷嘴的数量与进料管流体连通。

公开(公告)号：US20120237721A1

公开(公告)日：2012-09-20

申请号：US13461006

申请日：2012-05-01

Applicant: CHENG-HSIEN LIN ,  YAO-WEN BAI ,  WEN-CHIN LEE ,  RUI ZHANG ,  KAI-LI JIANG ,  CHEN FENG

Inventor： CHENG-HSIEN LIN ,  YAO-WEN BAI ,  WEN-CHIN LEE ,  RUI ZHANG ,  KAI-LI JIANG ,  CHEN FENG

IPC: B32B5/12 ,  B82Y30/00

CPC classification number: H05K9/009 ,  B29C70/882 ,  B29C70/885 ,  B29K2105/167 ,  C08L2666/76 ,  H05K9/0083 ,  H05K9/0088 ,  Y10S977/784 ,  Y10S977/789 ,  Y10T428/24132 ,  Y10T428/249979

Abstract: An electromagnetic shielding composite includes a polymer and a carbon nanotube film structure. The carbon nanotube structure includes a number of carbon nanotubes disposed in the polymer. The number of carbon nanotubes are parallel with each other.

Abstract translation: 电磁屏蔽复合材料包括聚合物和碳纳米管薄膜结构。 碳纳米管结构包括设置在聚合物中的多个碳纳米管。 碳纳米管的数量彼此平行。

公开(公告)号：US20090107706A1

公开(公告)日：2009-04-30

申请号：US12135842

申请日：2008-06-09

Applicant: WEN-CHIN LEE ,  CHENG-HSIEN LIN

Inventor： WEN-CHIN LEE ,  CHENG-HSIEN LIN

IPC: H05K1/00

CPC classification number: H05K3/4641 ,  H05K3/386 ,  H05K2201/0382 ,  Y10S428/901 ,  Y10T428/24917

Abstract: A multilayer printed circuit board includes a first printed circuit board, a second printed circuit board, an adhesive film, and a function layer. The adhesive film is sandwiched between the first printed circuit board and the second printed circuit board. The function layer is disposed between the first printed circuit board and the second printed circuit board for blocking water from passing therethrough and for screening electromagnetic interference between the first printed circuit board and the second printed circuit board.

Abstract translation: 多层印刷电路板包括第一印刷电路板，第二印刷电路板，粘合膜和功能层。 粘合膜夹在第一印刷电路板和第二印刷电路板之间。 功能层设置在第一印刷电路板和第二印刷电路板之间，用于阻止水从其中通过，并用于屏蔽第一印刷电路板和第二印刷电路板之间的电磁干扰。

公开(公告)号：US20090050602A1

公开(公告)日：2009-02-26

申请号：US12135843

申请日：2008-06-09

Applicant: CHENG-HSIEN LIN ,  WEN-CHIN LEE ,  KAI-LI JIANG

Inventor： CHENG-HSIEN LIN ,  WEN-CHIN LEE ,  KAI-LI JIANG

IPC: H01B13/00

CPC classification number: H05K3/0038 ,  B82Y10/00 ,  H05K2201/0112 ,  H05K2201/026 ,  H05K2201/0323

Abstract: A method for forming holes in making a printed circuit board includes the step of: providing a copper clad laminate including an insulation layer and a copper layer laminated on the insulation layer; forming a carbon nano-material on the copper layer of the copper clad laminate; and applying a laser beam onto a portion of the carbon nano-material to define a hole in the copper clad laminate beneath the portion of the carbon nano-material.

Abstract translation: 一种在制造印刷电路板中形成孔的方法包括以下步骤：提供层压在绝缘层上的包括绝缘层和铜层的覆铜层压板; 在覆铜层压板的铜层上形成碳纳米材料; 以及将激光束施加到所述碳纳米材料的一部分上以在所述碳纳米材料部分之下的所述覆铜层压板中限定出一个孔。