公开(公告)号：US4934582A

公开(公告)日：1990-06-19

申请号：US410171

申请日：1989-09-20

Applicant: Michael J. Bertram ,  Daniel M. Andrews

Inventor： Michael J. Bertram ,  Daniel M. Andrews

IPC: B23K1/018 ,  H05K13/04

CPC classification number: B23K1/018 ,  H05K13/0486

Abstract: A method and apparatus are described for the removal of solder mounted surface mount electronic components which includes the removal of old solder, broken leads, and the electronic component without damaging other devices on the substrate. A desoldering braid is shaped to cover each of the electronic component's outer lead bonds without contacting the component's base. The desoldering braid is heated and brought in contact with the bonds until the solder flows into the desoldering braid and any broken outer leads attach to the desoldering braid. Upon removal of the desoldering braid the electronic component can be lifted off the surface. The desoldered solder joints will contain a thin uniform coating of solder less than approximately 50 micro inches thick. This allows for removal and replacement of solder mounted electronic components with leads on center lines spaced less than 0.020 inches.

Abstract translation: 描述了用于去除焊接安装的表面贴装电子部件的方法和装置，其包括去除旧焊料，断开的引线和电子部件，而不损坏基板上的其它器件。 脱焊编织物被成形为覆盖电子部件的外引线键合中的每一个，而不接触部件的基部。 脱焊编织物被加热并与粘合物接触，直到焊料流入脱焊编织物中，并且任何断裂的外引线附着到脱焊编织物上。 在去除脱焊编织物后，电子部件可以从表面上提起。 脱模的焊点将包含小于约50微英寸厚的焊料的薄均匀涂层。 这允许在距离小于0.020英寸的中心线上引线去除和更换焊接安装的电子元件。

公开(公告)号：US4926241A

公开(公告)日：1990-05-15

申请号：US157778

申请日：1988-02-19

Applicant: David H. Carey

Inventor： David H. Carey

IPC: H05K3/46 ,  H01L23/538 ,  H05K1/11

CPC classification number: H01L23/5384 ,  H01L23/5383 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2224/73253 ,  H01L2924/01014 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/15312 ,  H05K1/112

Abstract: A substrate for attaching electrical devices having an interconnect wiring structure and a support for the interconnect, the support having a number of vias, or throughholes, extending therethrough and electrically connected to the interconnect. The substrate allows for attachment of the electrical devices on the side of the support opposite the interconnect at the vias, rather than on the interconnect itself. By so doing, the chips can be packed more densely since the area between the chips normally reserved for engineering change pads, test pads and the like is not required, these functions being performed on the interconnect on the opposite side of the substrate.

公开(公告)号：US4904340A

公开(公告)日：1990-02-27

申请号：US264564

申请日：1988-10-31

Applicant: Robert F. Miracky ,  Kantesh Doss ,  Bryan Seppala

Inventor： Robert F. Miracky ,  Kantesh Doss ,  Bryan Seppala

IPC: C23F1/02 ,  H05K3/06 ,  H05K3/22 ,  H05K3/38 ,  H05K3/46

CPC classification number: H05K3/06 ,  C23F1/02 ,  H05K2203/0361 ,  H05K2203/107 ,  H05K2203/175 ,  H05K3/225 ,  H05K3/388 ,  H05K3/467

Abstract: A process for laser-assisted liquid phase etching of copper conductors which includes the use of a solution of sulfuric acid and hydrogen peroxide in contact with an integrated circuit substrate and the provision of a laser beam to select substrate areas having copper conductors to be etched. Also disclosed is an apparatus for the laser-assisted etching.

Abstract translation: 一种用于铜导体的激光辅助液相蚀刻的方法，其包括使用与集成电路基板接触的硫酸和过氧化氢溶液，以及提供激光束以选择具有要被蚀刻的铜导体的衬底区域。 还公开了一种用于激光辅助蚀刻的装置。

公开(公告)号：US4882654A

公开(公告)日：1989-11-21

申请号：US288363

申请日：1988-12-22

Applicant: Richard D. Nelson ,  Omkarnath R. Gupta ,  Dennis J. Herrell

Inventor： Richard D. Nelson ,  Omkarnath R. Gupta ,  Dennis J. Herrell

IPC: H05K7/20 ,  H01L23/433 ,  H01L23/473

CPC classification number: H01L23/433 ,  H01L2924/0002

Abstract: A fluid heat exchanger for mating with an electronic component is supported from a fixed support. A connection between the fixed support and the heat exchanger is initially flexible for adjusting the position of the heat exchanger to accommodate variations in the height or attitude of the electronic component for providing a good thermal interface. Thereafter, the connection changes to a rigid connection to provide good structural suppport for the heat exchanger which allows the support to withstand vibration or shock without overloading the electronic component. The flexibility of the connection may be reversible for later readjusting the position of the heat exchanger relative to the electronic component.

公开(公告)号：US4874493A

公开(公告)日：1989-10-17

申请号：US174054

申请日：1988-03-28

Applicant: Ju-Don T. Pan

Inventor： Ju-Don T. Pan

IPC: C23C14/04 ,  C23C14/46 ,  H05K3/40

CPC classification number: C23C14/046 ,  C23C14/46 ,  H05K3/4076

Abstract: A process for filling cavities in a flat surface on a substrate by metal deposition which includes depositing a film of metal onto the flat surface and cavities in a substantially perpendicular direction to the surface, and simultaneously re-sputtering and deposited film on the flat surface by ion beam milling at an angle to the surface of the substrate for achieving the deposition of metal into the cavities and filling the cavities without leaving any film on the flat surface.

Abstract translation: 一种用于通过金属沉积在基板上的平坦表面中填充空腔的方法，该方法包括：在平坦表面上沉积金属膜，并在大致垂直于该表面的方向上沉积空腔，同时通过在平坦表面上重新溅射和沉积膜 离子束铣削与衬底的表面成一定角度，以实现金属沉积到空腔中并填充空腔而不在平坦表面上留下任何膜。

公开(公告)号：US4833766A

公开(公告)日：1989-05-30

申请号：US222489

申请日：1988-07-21

Applicant: Dennis J. Herrell ,  Omkarnath R. Gupta ,  Claude Hilbert

Inventor： Dennis J. Herrell ,  Omkarnath R. Gupta ,  Claude Hilbert

IPC: H01L23/367 ,  H01L23/467

CPC classification number: H01L23/467 ,  F28F3/02 ,  H01L23/3672 ,  H01L2924/0002 ,  H01L2924/3011 ,  Y10T29/4935 ,  Y10T29/49378 ,  Y10T29/49996

Abstract: A plurality of thin flat parallel positioned thermal conductive fins adapted to be connected to an object and a gas passageway passing between adjacent fins and extending between the top of the fins and opposite sides. Gas guides are positioned between adjacent fins at the center of the plurality of fins and redirect the outlet end of the passageways normal to the inlet ends of the passageways. Alternately positioned fins face in opposing directions. The fins may be integrally formed or individually formed. A thermal conductive base may be provided at the bottom of the plurality of fins for connection to an electronic package.

Abstract translation: 多个薄平行平行放置的导热翅片，其适于连接到物体和通过相邻翅片之间的气体通道，并且在翅片的顶部和相对侧之间延伸。 气体引导件位于多个翅片中心的相邻翅片之间，并且将通道的出口端垂直于通道的入口端重新定向。 替代的翅片面向相反的方向。 翅片可以一体形成或单独形成。 可以在多个翅片的底部设置导热基座，用于连接到电子封装。

公开(公告)号：US4758926A

公开(公告)日：1988-07-19

申请号：US846087

申请日：1986-03-31

Applicant: Dennis J. Herrell ,  David A. Gibson

Inventor： Dennis J. Herrell ,  David A. Gibson

IPC: H01L23/40 ,  H01L23/473 ,  H05K7/20 ,  H02B1/00

CPC classification number: H01L23/473 ,  H01L2924/0002

Abstract: A package for enclosing, protecting and cooling semiconductor integrated circuit chips. The package includes a generally planar substrate with the chips positioned thereon. Signal connections are provided between at least some of the chips. A heat sink is positioned in contact with the chips and includes microchannels through which a cooling fluid flows for purposes of transferring heat generated by the chips to such fluid. Manifolds are provided to direct the fluid to and from the microchannels, and microcapillary slots may be formed on the heat sink surface adjacent the chips to receive liquid to generate attractive forces between the heat sink and chips to facilitate heat transfer. Circuitry is provided to distribute power through the package and to the chips.

Abstract translation: 封装，保护和冷却半导体集成电路芯片的封装。 该封装包括具有位于其上的芯片的大致平面的基板。 在至少一些芯片之间提供信号连接。 散热器定位成与芯片接触，并且包括微通道，冷却流体流过该通道用于将由芯片产生的热传递到这种流体。 提供歧管以将流体引导到微通道和从微通道引导流体，并且微毛细管狭槽可以形成在与芯片相邻的散热器表面上以接收液体以在散热器和芯片之间产生吸引力以促进热传递。 提供电路以通过封装和芯片分配电力。

公开(公告)号：US5600200A

公开(公告)日：1997-02-04

申请号：US479268

申请日：1995-06-07

Applicant: Nalin Kumar ,  Chenggang Xie

Inventor： Nalin Kumar ,  Chenggang Xie

IPC: H01J1/304 ,  H01J9/02 ,  H01J31/12 ,  H01J61/067 ,  H01J63/00 ,  H01J63/06 ,  H01J1/30

CPC classification number: H01J63/06 ,  H01J1/304 ,  H01J1/3042 ,  H01J31/127 ,  H01J61/0677 ,  H01J63/00 ,  H01J9/027 ,  H01J2201/304 ,  H01J2201/30426 ,  H01J2201/30457 ,  H01J2329/00 ,  H01J2329/8625 ,  Y10T428/292

Abstract: A field emission cathode for use in flat panel displays comprises a layer of conductive material and a layer of amorphic diamond film, functioning as a low effective work-function material, deposited over the conductive material to form emission sites. The emission sites each contain at least two sub-regions having differing electron affinities. The cathode may be used to form a computer screen or a fluorescent light source.

Abstract translation: 用于平板显示器的场发射阴极包括沉积在导电材料上以形成发射部位的导电材料层和用作低有效功函数材料的非晶金刚石膜层。 发射部位各自含有至少两个具有不同电子亲和力的亚区域。 阴极可用于形成计算机屏幕或荧光光源。

公开(公告)号：US5548185A

公开(公告)日：1996-08-20

申请号：US458854

申请日：1995-06-02

Applicant: Nalin Kumar ,  Chenggang Xie

Inventor： Nalin Kumar ,  Chenggang Xie

IPC: H01J1/304 ,  H01J1/316 ,  H01J9/02 ,  H01J31/12 ,  H01J61/067 ,  H01J63/06 ,  H01J19/24

CPC classification number: H01J1/3042 ,  H01J1/304 ,  H01J1/316 ,  H01J31/127 ,  H01J61/0677 ,  H01J63/06 ,  H01J9/027 ,  H01J2201/30426 ,  H01J2201/30457 ,  H01J2201/3165 ,  H01J2201/319 ,  H01J2329/8625

Abstract: A flat panel display of a field emission type having a triode (three terminal) structure and useful as a device for displaying visual information is disclosed. The display includes a plurality of corresponding light-emitting anodes and field-emission cathodes, each of the anodes emitting light in response to emission from each of the corresponding cathodes, each of the cathodes including a layer of low work function material having a relatively flat emission surface which includes a plurality of distributed localized electron emission sites and a grid assembly positioned between the corresponding anodes and cathodes to thereby control emission levels to the anodes from the corresponding cathodes. In the preferred embodiment of the invention, the layer of low work function material is amorphic diamond film. The grid assembly includes a conductive layer deposited between the plurality of anodes and cathodes and over interstices between the cathodes, the conductive layer having apertures therein, the cathodes aligned with, and of the same size as, the apertures.

Abstract translation: 公开了一种具有三极管（三端子）结构的场发射型平板显示器，并且可用作显示视觉信息的装置。 显示器包括多个对应的发光阳极和场发射阴极，每个阳极响应于每个相应阴极的发射而发光，每个阴极包括具有相对平坦的低功函数材料层 发射表面，其包括多个分布的局部电子发射位点和位于相应阳极和阴极之间的栅格组件，从而控制来自相应阴极的阳极的发射水平。 在本发明的优选实施例中，低功函数材料层是非晶金刚石膜。 栅格组件包括沉积在多个阳极和阴极之间的导电层以及阴极之间的间隙，导电层在其中具有孔，阴极与孔对准并具有与孔相同的尺寸。

公开(公告)号：US5544018A

公开(公告)日：1996-08-06

申请号：US227315

申请日：1994-04-13

Applicant: Scott C. Sommerfeldt ,  Thomas W. Rudwick, III ,  Robert F. Miracky

Inventor： Scott C. Sommerfeldt ,  Thomas W. Rudwick, III ,  Robert F. Miracky

IPC: H01L23/538 ,  H05K1/00 ,  H05K3/46 ,  H05K1/11

CPC classification number: H01L23/5382 ,  H05K1/0287 ,  H05K1/029 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/19107 ,  H01L2924/30107 ,  H05K1/0298 ,  H05K2201/09345 ,  H05K2201/09945 ,  H05K2203/175 ,  H05K3/467

Abstract: Provided is an electrical interconnect cell intermittently spaced across a substrate to form an interconnect device or structure. The interconnect device is fully customizable or programmable upon the upper surface to accommodate various electrical components and connectivity to those components. The electrical interconnect device includes a plurality of intermittently spaced first pairs of upper and lower signal lines interwoven with a plurality of intermittently spaced second pairs of upper and lower signal lines. A bonding pad is arranged between adjacent upper and lower signal line pairs and can be connected thereto with conductive links placed upon the surface layer. Each bonding pad includes one or more pad vias which extend perpendicular to the upper surface to conductive structures arranged in lower layers. Approximately one-half of the array of bonding pads are connected to potential conductors. The pairs of upper signal lines can not only be linked, but also can be cut to form a more direct routing between target locations. Moreover, the upper and lower signal lines are connected in order for traces to extend across the entire interconnect structure for ease of testability.

Abstract translation: 提供了间隔地跨越衬底以形成互连装置或结构的电互连电池。 互连设备在上表面上是完全可定制的或可编程的，以适应各种电气部件和与这些部件的连接。 电互连装置包括多个间歇间隔的第一对上，下信号线，与多个间歇间隔的第二对上，下信号线交织。 接合焊盘布置在相邻的上部和下部信号线对之间，并且可以与放置在表面层上的导电连接件连接。 每个焊盘包括一个或多个衬垫通孔，其垂直于上表面延伸到布置在较低层中的导电结构。 大约一半的焊盘阵列连接到电位导体。 上层信号线对不仅可以链接，而且可以被切割，以在目标位置之间形成更直接的路由。 此外，上下信号线被连接以使得迹线在整个互连结构上延伸以便易于测试。