公开(公告)号：US20210040344A1

公开(公告)日：2021-02-11

申请号：US16968179

申请日：2019-01-16

申请人： NAMICS CORPORATION

发明人： Tomoyuki TAKAHASHI

IPC分类号： C09D11/52 ,  C09D11/037 ,  H05K1/09 ,  A41D31/04 ,  C09D11/102 ,  H01B1/22

摘要： An electrically conductive paste contains (A) metal-coated particles each composed of titanium oxide and a metal coating layer formed on the surface of the titanium oxide and (B) a resin. The titanium oxide has a columnar form having a particle length and a particle shorter diameter and the particle length of the titanium oxide is longer than the particle shorter diameter. Each of the metal-coated particles has a columnar form having a particle length and a particle shorter diameter and the particle length of each of the metal-coated particles is longer than the particle shorter diameter.

公开(公告)号：US10770601B2

公开(公告)日：2020-09-08

申请号：US15579815

申请日：2016-06-03

申请人： NAMICS CORPORATION

发明人： Seiya Konno

IPC分类号： H01L31/0224 ,  C03C8/18 ,  H01B1/22 ,  H01L21/288 ,  H01L31/0272 ,  C03C8/10 ,  C03C8/14 ,  C03C3/074

摘要： An electro-conductive paste which includes an electro-conductive powder, a multiple oxide containing tellurium oxide, and an organic vehicle. The electro-conductive paste contains 0.1 parts by weight to 10 parts by weight of the multiple oxide based on 100 parts by weight of the electro-conductive powder, and the content ratio of the tellurium oxide in 100% by weight of the multiple oxide as TeO2 is 3% by weight to 30% by weight.

公开(公告)号：US10672942B2

公开(公告)日：2020-06-02

申请号：US15557324

申请日：2016-03-15

申请人： Namics Corporation

发明人： Hideyo Iida

IPC分类号： H01L31/044 ,  H01L31/18 ,  H01L31/0224 ,  H01L31/05

摘要： A method for producing a solar cell module is obtained that allows a wiring material to be wired by a highly productive wiring method when a solar cell module is formed by arranging the wiring material on an electrode of a solar cell. The method for producing a solar cell module includes preparing a plurality of solar cells having an electrode on at least one of a first main surface and a second main surface, arranging the plurality of solar cells so that the first main surfaces of the plurality of solar cells face roughly in the same direction, connecting the linear conductor for electrically connecting one of the electrode on the first main surface and the electrode on the second main surface of each solar cell with one continuous linear conductor, and electrically disconnecting the continuous linear conductor after the connecting the linear conductor so that the electrodes of at least one pair of adjacent solar cells among the plurality of solar cells are connected in series.

公开(公告)号：US10590319B2

公开(公告)日：2020-03-17

申请号：US15746954

申请日：2016-07-15

申请人： NAMICS CORPORATION

发明人： Cathy Shaw Trumble ,  Maciej Patelka ,  Noriyuki Sakai ,  Nicholas C. Krasco

IPC分类号： C09J183/04 ,  C08K3/08 ,  C08L83/04 ,  C08L83/00 ,  C09J11/04 ,  C08G77/04

摘要： A composition including (a) 20 to 85 wt % of a thermally conductive silver component containing silver nano-particles having a particle diameter of 5 to 500 nanometers; (b) a polyorgano-silsesquioxane component, the polyorganosilsesquioxane component selected from the group consisting of (i) 0.5 to 12 wt % of a polyorganosilsesquioxane fine powder, (ii) 0.5 to 8 wt % of a copolymer powder containing an interlacing polymer network of (I) a polyorganosilsesquioxane and (II) a polydiorganosiloxane; and (iii) 0.5 to 12 wt % of a combination of the polyorgano-silsesquioxane fine powder and the copolymer powder; and (c) 3 to 12 wt % of a total solvent content in the form of (i) one or more solvents, (ii) a vehicle containing one or more solvents, or (iii) a combination thereof.

公开(公告)号：US20200058577A1

公开(公告)日：2020-02-20

申请号：US16487929

申请日：2018-02-20

申请人： NAMICS CORPORATION

发明人： Masaki YOSHIDA ,  Satoko OHASHI

IPC分类号： H01L23/498 ,  H05K1/02 ,  H05K1/03 ,  B32B15/08 ,  B32B15/092 ,  B32B15/082 ,  B32B15/20 ,  C09J9/02 ,  C09J7/29 ,  C09J11/08 ,  C09J7/38

摘要： A purpose of the present disclosure is to provide a multilayer wiring substrate capable of reducing transmission loss of electrical signals when using a fluororesin substrate, by using an adhesive layer capable of suppressing misalignment between layers and having excellent peel strength. Provided is a multilayer wiring substrate 1 including: a fluororesin substrate 30 having a conductor pattern 20 formed on at least one surface thereof; and an adhesive layer 10 for bonding the fluororesin substrate 30, wherein the adhesive layer 10 contains a cured product of a thermosetting resin, and has a breaking elongation rate of 20% or more and 300% or less.

公开(公告)号：US10472461B2

公开(公告)日：2019-11-12

申请号：US15556964

申请日：2016-03-09

申请人： NAMICS CORPORATION

发明人： Fuminori Arai

IPC分类号： C08G59/66 ,  C09J11/06 ,  C09J133/06 ,  C09J163/00 ,  H01L27/14 ,  C08G59/18 ,  C08G59/56 ,  C08G59/68 ,  C08K3/36 ,  C08K5/00 ,  C08K5/06 ,  C08G59/62 ,  G02B7/02 ,  G02B7/08 ,  G02B19/00 ,  H01L27/146 ,  C08K5/378

摘要： The present invention is intended to provide a semiconductor device including adherends bonded with a cured product of an adhesive, the semiconductor device being configured such that a decrease in bonding strength after curing in a moisture resistance test is suppressed. In this semiconductor device, at least two adherends 20 and 70, 70 and 60, 70 and 50 made of at least one material selected from the group consisting of engineering plastic, ceramics, and metal are bonded with a cured product 10 of an adhesive containing (A) thermosetting resin, (B) a particular thiol compound, and (C) a latent curing agent.

公开(公告)号：US10290601B2

公开(公告)日：2019-05-14

申请号：US15564674

申请日：2016-04-06

申请人： NAMICS CORPORATION

发明人： Raymond Dietz ,  Cathy Shaw Trumble ,  Maciej Patelka ,  Akito Yoshii ,  Noriyuki Sakai ,  Hiroshi Yamaguchi

IPC分类号： H01L21/00 ,  H01L23/00 ,  H01L23/40 ,  H01L21/52 ,  C03C4/14 ,  C03C8/02 ,  C03C8/08 ,  C03C8/24 ,  C03C10/00 ,  C03C3/12 ,  C03C3/14 ,  C03C3/21 ,  C03C8/18 ,  C03C27/04

摘要： A method of manufacturing a bonded body in which a first body and a second body are bonded using a glass paste. The glass paste includes a crystallized glass frit (A) and a solvent (B). A remelting temperature of the crystallized glass frit (A) is higher than a crystallization temperature thereof which is higher than a glass transition temperature thereof. The method includes: applying the glass paste on at least one of the first and second bodies, bonding the first and second bodies by interposing the glass paste therebetween, heating the bonded first and second bodies to a temperature that is not lower than the crystallization temperature and lower than the remelting temperature of the crystallized glass frit (A), and obtaining the bonded body by cooling the bonded first and second bodies to a temperature that is not higher than the glass transition temperature of the crystallized glass frit.

公开(公告)号：US20190043637A1

公开(公告)日：2019-02-07

申请号：US16074867

申请日：2017-02-15

申请人： NAMICS CORPORATION

发明人： Yoshiaki YOSHII

IPC分类号： H01B1/22 ,  H05K1/18 ,  H05K1/09 ,  H05K1/03 ,  H05K3/34 ,  H05K3/10 ,  C22C5/06 ,  C22C9/05

摘要： A conductive paste of the present invention includes (A) a silver powder, (B) a glass frit, (C) an organic binder and (E) an oxide of a platinum group element and/or a compound which can be converted to an oxide of a platinum group element. The conductive paste has excellent solder heat resistance and adhesion to a substrate.

公开(公告)号：US20180251663A1

公开(公告)日：2018-09-06

申请号：US15746954

申请日：2016-07-15

申请人： NAMICS CORPORATION

发明人： Cathy Shaw TRUMBLE ,  Maciej PATELKA ,  Noriyuki SAKAI ,  Nicholas C. KRASCO

IPC分类号： C09J183/04 ,  C09J11/04 ,  C08K3/08

CPC分类号： C09J183/04 ,  C08G77/045 ,  C08K3/08 ,  C08K2003/0806 ,  C08K2003/085 ,  C08K2201/003 ,  C08K2201/014 ,  C08L83/00 ,  C08L83/04 ,  C09J11/04

摘要： A composition including (a) 20 to 85 wt % of a thermally conductive silver component containing silver nano-particles having a particle diameter of 5 to 500 nanometers; (b) a polyorgano-silsesquioxane component, the polyorganosilsesquioxane component selected from the group consisting of (i) 0.5 to 12 wt % of a polyorganosilsesquioxane fine powder, (ii) 0.5 to 8 wt % of a copolymer powder containing an interlacing polymer network of (I) a polyorganosilsesquioxane and (II) a polydiorganosiloxane; and (iii) 0.5 to 12 wt % of a combination of the polyorgano-silsesquioxane fine powder and the copolymer powder; and (c) 3 to 12 wt % of a total solvent content in the form of (i) one or more solvents, (ii) a vehicle containing one or more solvents, or (iii) a combination thereof.

公开(公告)号：US09947604B2

公开(公告)日：2018-04-17

申请号：US15038939

申请日：2014-11-28

申请人： NAMICS CORPORATION

发明人： Kazuyuki Kohara ,  Tomoya Yamazawa ,  Kodai Okoshi ,  Nobuyuki Abe

IPC分类号： H01L23/29 ,  C09J163/00 ,  B32B27/38 ,  C08K3/36 ,  C08L63/00 ,  C08G59/24 ,  C08G59/50 ,  H01L23/00

CPC分类号： H01L23/295 ,  C08G59/245 ,  C08G59/50 ,  C08K3/36 ,  C08K9/06 ,  C08K2201/014 ,  C08L63/00 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/2929 ,  H01L2224/29387 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/83102 ,  H01L2224/8385 ,  H01L2224/83862 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/05442 ,  H01L2924/00012 ,  H01L2924/00

摘要： An epoxy resin composition includes: (A) epoxy resin; (B) a curing agent; (C) 0.1 to 10 mass % of silica filler with an average particle size of 10 nm or more and 100 nm or less; and (D) 40 to 75 mass % of silica filler with an average particle size of 0.3 μm or more and 5 μm or less. The component (C) and the component (D) are contained by 40.1 to 77 mass % in total.