摘要:
There are provided a carrier substrate, a temperature sensing resistor film formed directly on the carrier substrate, first and second conductive patterns formed on the carrier substrate and connected to both ends of the temperature sensing resistor film respectively, and a semiconductor chip mounting region portion formed on the carrier substrate.
摘要:
Transmitter and receiver for wireless communications with improved accuracy and stability in radio frequency control. A transmitter mixes an information-carrying signal (first signal) and a non-modulated wave signal (second signal) with a carrier signal, thereby producing a first and second radio frequency signals for radio wave transmission. A receiver mixes those two radio frequency signals to extract the original information signal. While the received radio frequency signals contain some frequency fluctuations and phase noises that have been introduced at the sending end, such unstable components nullf will cancel out at the receiving end.
摘要:
A clock signal correction circuit which corrects duty cycle distortions of a clock signal in a simple and accurate way. A frequency divider divides the frequency of a given input clock signal by a natural number n, thereby producing a divided clock signal. The phase of this divided clock signal is identified by a phase detector. By adding an appropriate delay to the divided clock signal according to the identified signal phase, a delay unit produces a delayed divided clock signal. A logical operator creates an output clock signal by performing a logical operation on the original divided clock signal and the delayed divided clock signal.
摘要:
In an amplifier circuit 20A, outputs of two transistors 23A and 23B are connected in parallel through a power superimposition circuit 27, one ends of drain bias transmission lines 29A and 29B each having a length of null/4, where null denotes a signal wavelength, are connected to the outputs of the transistors 23A and 23B, respectively, the ends of the drain bias transmission lines 29A and 29B are connected not only to the capacitors 30A and 30B for signal grounding but also to one ends of bias supply lines 32A ad 32B, respectively, a jumper 34 is connected between the other ends of the bias supply lines 32A and 32B, and the one end of the bias supply line 32B is connected to a drain bias input terminal DB. The drain bias transmission lines 29A and 29B and the power superimposition circuit 27 are each disposed in the shape folded in one direction, and the bias supply lines 32A and 32B each extend in a straight line along a direction perpendicular to the folded direction.
摘要:
An input buffer circuit 11X is a source follower circuit and comprises a load 114 and enhancement FETs 111 and 112A connected in series between power supply lines VDD and VSS. A DC bias VB1 is applied to the gate of the FET 112A to act it as a current source, and an AC current component of the drain potential VD of the FET 111 is provided through a capacitor 113 to the gate of the FET 112A. If an inductor as an matching circuit is connected in series to the capacitor 113, a band pass filter is constructed, and the gain of the circuit 11X becomes especially high at the resonance frequency thereof. At high frequencies, the interconnection coupled to the capacitor 113 has a parasitic inductance, and the output waveform of the circuit 11X has a high frequency noise. In this case, a damping transistor is connected between the capacitor 113 and the gate of the FET 112A to obtain a flat gain by adjusting the gate potential thereof.
摘要:
A semiconductor photodetection device includes a photodetection layer formed of an alternate and repetitive stacking of an optical absorption layer accumulating therein a compressive strain and a stress-compensating layer accumulating therein a compensating tensile strain, wherein the optical absorption layer has a thickness larger than a thickness of the stress-compensating layer.
摘要:
An optical semiconductor device includes a package body, a laser diode accommodated in the package body, a temperature regulation block connected thermally to the laser diode, an optical filter connected thermally to the temperature regulation block, a photodetector receiving the laser beam from the laser diode via the optical filter, a feeder feeding a driving power to the laser diode, and a thermal conducting body provided separately to the feeder, wherein the thermal conducting body transmits the temperature of the package body to the laser diode.
摘要:
A negative resistance circuit having an output terminal is connected to a first terminal of a strip shaped resonator. Anode of a variable capacitance diode is connected to a second terminal of the strip shaped resonator via a capacitor 1null. Cathode of the variable capacitance diode is grounded. One terminal of a high impedance strip shaped line is connected to the anode of the variable capacitance diode. Other terminal of the strip shaped line is grounded via a capacitor 4. The capacitor 4 has sufficiently low impedance at an oscillation frequency.
摘要:
A microwave monolithic integrated circuit comprises a T-shaped gate electrode including a Schottky gate electrode formed on a first region of a compound semiconductor substrate, a pair of ohmic electrodes making an ohmic contact with a surface of the substrate in the first region at respective sides of the T-shaped gate electrode, a lower capacitor electrode pattern formed on a second region of the compound semiconductor substrate with a composition substantially identical with a low-resistance, top electrode constituting the T-shaped gate electrode on the Schottky gate electrode, a dielectric film formed on the lower electrode pattern, and an upper electrode pattern formed on the dielectric film.
摘要:
A semiconductor light-receiving device includes: a semi-insulating substrate; a semiconductor layer of a first conduction type that is formed on the semi-insulating substrate; a buffer layer of the first conduction type that is formed on the semi-insulating substrate and has a lower impurity concentration than the semiconductor layer of the first conduction type; a light absorption layer that is formed on the buffer layer and generates carriers in accordance with incident light; a semiconductor layer of a second conduction type that is formed on the light absorption layer; and a semiconductor intermediate layer that is interposed between the buffer layer and the light absorption layer, and has a forbidden bandwidth within a range lying between the forbidden bandwidth of the buffer layer and the forbidden bandwidth of the light absorption layer.