Two-dimensional condensation for uniaxially strained semiconductor fins
    63.
    发明授权
    Two-dimensional condensation for uniaxially strained semiconductor fins 有权
    用于单轴应变半导体翅片的二维冷凝

    公开(公告)号:US09159835B2

    公开(公告)日:2015-10-13

    申请号:US13488238

    申请日:2012-06-04

    IPC分类号: H01L29/66 H01L29/78

    摘要: Techniques are disclosed for enabling multi-sided condensation of semiconductor fins. The techniques can be employed, for instance, in fabricating fin-based transistors. In one example case, a strain layer is provided on a bulk substrate. The strain layer is associated with a critical thickness that is dependent on a component of the strain layer, and the strain layer has a thickness lower than or equal to the critical thickness. A fin is formed in the substrate and strain layer, such that the fin includes a substrate portion and a strain layer portion. The fin is oxidized to condense the strain layer portion of the fin, so that a concentration of the component in the strain layer changes from a pre-condensation concentration to a higher post-condensation concentration, thereby causing the critical thickness to be exceeded.

    摘要翻译: 公开了用于实现半导体翅片的多面冷凝的技术。 这些技术可以用于例如制造基于鳍的晶体管。 在一个示例的情况下,在体基板上设置应变层。 应变层与取决于应变层的部件的临界厚度相关联,并且应变层具有低于或等于临界厚度的厚度。 在基板和应变层中形成翅片,使得翅片包括基板部分和应变层部分。 将翅片氧化以冷凝翅片的应变层部分,使得应变层中的组分的浓度从预凝结浓度变为较高的缩合后浓度,从而超过临界厚度。