摘要:
The present invention provides a low cost device that has a true die to external fiber optic connection. Specifically, the present invention relates to an optical device package joined to a semiconductor device package. In some cases, the combination is joined using wirebond studs and an adhesive material. In other cases, the combination is joined using an anisotropic conductive film. Yet, in other cases, the combination is joined using solder material. Each of these joining mechanisms provides high levels of thermal, electrical and optical performance. The joining mechanisms can apply to optical sub-assembly and chip sub-assembly interfaces in transceivers, transmitters, as well as receivers for opto-electronic packages.
摘要:
A method embodiment of the invention includes a scheme for trimming and compensation of a laser emitter in a fiber optic link. A laser emitter is provided. Also a reference optical power value is determined using data models of laser emitter performance generated by statistical analysis of sample population of lasers that are similar to the subject laser emitter. The performance of the subject laser is measured and qualified optical power levels for the subject laser emitter are determined using the reference operating power value and measured performance of the subject laser emitter. The driving current of the subject laser emitter is adjusted to compensate for changes in temperature until the optical power of the subject laser emitter obtains a desired qualified optical power level. Related methods of determining qualified optical power levels for a laser emitter in a fiber optic link are also disclosed. As are methods of determining a reference optical power value for a laser emitter to be coupled in a fiber optic link. Fiber optic links capable of trimming and compensation in open and closed loop configurations are also disclosed.
摘要:
A connectorized silicon bench and ferrule that aids in the passive alignment of optical fibers to optical components on the bench. The apparatus includes a bench having an optical component, a groove formed in the bench, the groove configured to accommodate an optical fiber; and a ferrule, including a recess region to accommodate the optic fiber when the ferrule is mounted onto the bench. The groove and the ferrule cooperate to passively align the optical fiber and the optical component on the bench. A connector sleeve, which accommodates the silicon bench and ferrule, includes a receptacle that is configured to receive a plug-in connector which optically couples the optical fiber to an optical network or link.
摘要:
The present invention provides a technique for manufacturing a low cost device that provides a true die to external fiber optic connection. Specifically, the present invention relates to several techniques for joining an optical device package to a semiconductor device package. The first technique involves using wirebond studs and an adhesive material, the second technique involves the use of an anisotropic conductive film, and the third technique involves the use of solder material. Each of these techniques provides high levels of thermal, electrical and optical performance. The methods apply to optical sub-assembly and chip sub-assembly interfaces in transceivers, transmitters, as well as receivers for opto-electronic packages.
摘要:
The present invention pertains to using a leadless leadframe package as the semiconductor device package component of an opto-electronic combinational device. Leadless leadframe packages (LLPs) have very small form factors that allow an opto-electronic device to also have a small overall form factor.
摘要:
A method and apparatus for processing multiple signals at a common frequency combined into a single radio frequency cable and subsequently recovering the signals without significant losses, distortion, or cross-talk. The method and apparatus includes processing multiple signals at a common frequency fed through a single radio frequency (RF) cable with or without one or more amplifiers and utilized for either forward or reverse link transmissions. The invention enables a single power amplifier to amplify multiple RF signals that occupy a common frequency channel and after amplification splitting these signals into amplified copies of the originals. The amplified signals may be sent to different antenna ports to illuminate different base station sectors if required. The signal splitting function is performed at the antenna masthead such that this method reduces the number of feeder cables running up the antenna tower by a factor of N, where N is the number of common frequency signals (e.g., the number of sectors) amplified by the single power amplifier. This invention enables a single power amplifier to simultaneously provide all the radio frequency signals necessary to feed a general N input phased array antenna system and form multiple antenna beams uniquely for several individual users simultaneously.
摘要:
Systems and methods for use in CDMA antenna systems are provided in which signals each having a common overhead component are transmitted on a set of adjacent beams of a sector with a micro-timing offset between signals transmitted on adjacent pairs of beams which is large enough that destructive cancellation substantially does not occur between the pair of beams.
摘要:
A two terminal ESD protection structure formed by an alternating arrangement of adjacent p-n-p-n-p semiconductor regions provides protection against both positive and negative ESD pulses. When an ESD pulse appears across the two terminals of the ESD protection structure, one of the inherent n-p-n-p thyristors is triggered into a snap-back mode thereby to form a low impedance path to discharge the ESD current.Some embodiments of the ESD protection structure of the present invention have an enhanced current handling capability and are formed by combining a number of standard cells. The standard cells include a corner cell, a center cell and an edge cell which are arranged adjacent each other to form an ESD protection structure which provides for current flow from across many locations therein.Some embodiments of the ESD protection structure of the present invention include a network consisting of a pair of current sources, e.g. back-to-back zener diodes, each connected in series with a resistor to control the trigger voltage of the ESD protection structure.
摘要:
A beamformer is arranged to receive an input from a first antenna element and from at least one other antenna element and to generate at least a first and second output beam. The first and second output beams are combined at a connecting port such that signals received at the first antenna element are constructively combined at the connecting port and signals received at another antenna element or elements are destructively combined at the connecting port, so that a receiver connected to the connecting port may receive signals from the first antenna element and may not receive signals from the other antenna element or elements. The arrangement may also be used to transmit a signal which is fed into the connecting point from the first antenna element and not from the other antenna element or elements.
摘要:
A two-terminal ESD protection structure formed by an arrangement of five adjacent semiconductor regions (112, 114, 116, 118, and 120) of alternating conductivity type provides protection against both positive and negative ESD voltages. The middle semiconductor region electrically floats. When the two terminals (A and K) of the ESD protection structure are subjected to an ESD voltage, the structure goes into operation by triggering one of its two inherent thyristors (170 and 180) into a snap-back mode that provides a low impedance path through the structure for discharging the ESD current.