公开(公告)号：US07900809B2

公开(公告)日：2011-03-08

申请号：US12146798

申请日：2008-06-26

申请人： Glenn G. Daves ,  David L. Edwards ,  Mukta G. Farooq ,  Frank L. Pompeo

发明人： Glenn G. Daves ,  David L. Edwards ,  Mukta G. Farooq ,  Frank L. Pompeo

IPC分类号： B23K31/02

CPC分类号： B23K3/0638 ,  B23K2101/40 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01322 ,  H01L2924/15311 ,  H05K3/301 ,  H05K3/303 ,  H05K3/305 ,  H05K2201/0209 ,  H05K2201/09909 ,  H05K2201/10234 ,  H05K2201/10734 ,  H05K2201/10977 ,  H05K2201/2018 ,  H05K2201/2036 ,  Y02P70/613 ,  Y10T29/49144 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/0401

摘要： A method for assembling, and the resultant electronic module, includes attaching a chip to a substrate using a first solder interconnection array, and attaching a board to the substrate using a second solder interconnection array, which may be a single-melt or a dual-melt solder array. The second solder interconnection array resides entirely within a space defined between the board and substrate. A creep resistant structure is provided within this space for maintaining the defined space and optimizing integrity of the second solder interconnection array. The creep resistant structure may include an underfill material, balls, brackets, frames, collars or combinations thereof. Wherein the creep resistant structure is an underfill material, it is crucial that the substrate be attached to the board before either entirely encapsulating the second interconnection array with underfill material, or partially encapsulating the second solder interconnection array at discrete locations with underfill material.

摘要翻译： 一种用于组装的方法，并且所得到的电子模块包括使用第一焊料互连阵列将芯片附接到衬底，并且使用第二焊料互连阵列将衬底附接到衬底，第二焊料互连阵列可以是单熔体或双 - 熔融焊料阵列。 第二焊料互连阵列完全位于限定在板和衬底之间的空间内。 在该空间内设有抗蠕变结构，用于维持限定的空间并优化第二焊料互连阵列的完整性。 抗蠕变结构可以包括底部填充材料，球，支架，框架，套环或其组合。 其中抗蠕变结构是底部填充材料，在将基底完全用底部填充材料完全封装第二互连阵列之前，或者在具有底部填充材料的离散位置部分地封装第二焊料互连阵列之前，衬底附着到板上是至关重要的。

公开(公告)号：US20100099584A1

公开(公告)日：2010-04-22

申请号：US12253143

申请日：2008-10-16

申请人： Shaun T. Mesher ,  David L. Edwards

发明人： Shaun T. Mesher ,  David L. Edwards

IPC分类号： C09K8/52

CPC分类号： C09K8/74 ,  C09K8/52 ,  C09K8/54 ,  C09K8/72

摘要： A method of acidizing and cleaning up a formation is disclosed, the formation being above 150 degrees C. The formation is treated with a mutual solvent system comprising a mutual solvent of oil and water, an aqueous acid, a corrosion inhibitor, and an iron control agent. In some embodiments, the iron control agent is present in an amount of less than 1% by weight of the mutual solvent system. In some embodiments, the corrosion inhibitor may be present in an amount of less than 10% by weight of the mutual solvent system. In some embodiments, the mutual solvent system further comprises an intensifier.

摘要翻译： 公开了一种酸化和清理地层的方法，其形成高于150℃。该地层用包括油和水的互溶剂，酸水溶液，腐蚀抑制剂和铁控制剂的互溶剂体系 代理商 在一些实施方案中，铁控制剂的存在量小于互溶体系的1重量％。 在一些实施方案中，腐蚀抑制剂可以以相互溶剂体系重量的小于10％的量存在。 在一些实施例中，互溶体系还包括增压器。

公开(公告)号：US07700615B2

公开(公告)日：2010-04-20

申请号：US11345132

申请日：2006-02-01

申请人： David L. Edwards ,  Michael E. Berens ,  Christian Beaudry

发明人： David L. Edwards ,  Michael E. Berens ,  Christian Beaudry

IPC分类号： A61K31/47 ,  A61K31/45

CPC分类号： G01N33/5011 ,  A61K31/00 ,  A61K31/192 ,  A61K31/215 ,  A61K31/381 ,  A61K31/4745 ,  A61K31/549 ,  A61K38/193 ,  A61K39/00 ,  A61K45/06 ,  G01N2500/10 ,  A61K2300/00

摘要： Methods for treating an individual having cancer are provided. The method may include administering a cell migration inhibitor and a chemotherapeutic agent to the individual to inhibit migration of cancer cell. Inhibiting cell migration may increase cell division. In this manner, the cell migration inhibitor and the chemotherapeutic agent in combination may have increased efficacy compared to the chemotherapeutic agent alone due to the increased cell division. The cell migration inhibitor may include any of the inhibitors described herein. For example, the cell migration inhibitor may be an organic molecule having a molecular weight of less than about 700, a monoclonal antibody, or a natural product.

摘要翻译： 提供了治疗患有癌症的个体的方法。 该方法可以包括向个体施用细胞迁移抑制剂和化学治疗剂以抑制癌细胞的迁移。 抑制细胞迁移可能增加细胞分裂。 以这种方式，由于细胞分裂增加，细胞迁移抑制剂和化学治疗剂的组合可能与单独的化学治疗剂相比具有增加的功效。 细胞迁移抑制剂可以包括本文所述的任何抑制剂。 例如，细胞迁移抑制剂可以是分子量小于约700的有机分子，单克隆抗体或天然产物。

公开(公告)号：US20080299707A1

公开(公告)日：2008-12-04

申请号：US11955598

申请日：2007-12-13

申请人： David L. Edwards ,  Sushumna Iruvanti ,  Hilton T. Toy ,  Wei Zou

发明人： David L. Edwards ,  Sushumna Iruvanti ,  Hilton T. Toy ,  Wei Zou

IPC分类号： H01L21/52

CPC分类号： H01L23/04 ,  H01L23/10 ,  H01L23/3675 ,  H01L23/42 ,  H01L24/32 ,  H01L2224/16225 ,  H01L2224/26175 ,  H01L2224/27013 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2224/83051 ,  H01L2224/83385 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/16152 ,  H01L2924/16153 ,  H01L2924/1616 ,  Y10S257/924

摘要： A semiconductor module structure and a method of forming the semiconductor module structure are disclosed. The structure incorporates a die mounted on a substrate and covered by a lid. A thermal compound is disposed within a thermal gap between the die and the lid. A barrier around the periphery of the die extends between the lid and the substrate, contains the thermal compound, and flexes in response to expansion and contraction of both the substrate and the lid during cycling of the semiconductor module. More particularly, either the barrier is formed of a flexible material or has a flexible connection to the substrate and/or to the lid. The barrier effectively contains the thermal compound between the die and the lid and, thereby, provides acceptable and controlled coverage of the thermal compound over the die for heat removal.

摘要翻译： 公开了半导体模块结构和形成半导体模块结构的方法。 该结构包括安装在基板上并被盖子覆盖的模具。 热化合物设置在模具和盖子之间的热间隙内。 围绕模具周边的屏障在盖和基板之间延伸，包含热化合物，并且在半导体模块循环期间响应于基板和盖的膨胀和收缩而弯曲。 更具体地，屏障由柔性材料形成或具有与基底和/或盖的柔性连接。 屏障有效地包含了模具和盖子之间的热化合物，从而提供可靠和可控的覆盖模具上的热化合物以进行散热。

公开(公告)号：US07445141B2

公开(公告)日：2008-11-04

申请号：US10711501

申请日：2004-09-22

申请人： Glenn G. Daves ,  David L. Edwards ,  Mukta G. Farooq ,  Frank L. Pompeo

发明人： Glenn G. Daves ,  David L. Edwards ,  Mukta G. Farooq ,  Frank L. Pompeo

IPC分类号： B23K31/02

CPC分类号： B23K3/0638 ,  B23K2101/40 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01322 ,  H01L2924/15311 ,  H05K3/301 ,  H05K3/303 ,  H05K3/305 ,  H05K2201/0209 ,  H05K2201/09909 ,  H05K2201/10234 ,  H05K2201/10734 ,  H05K2201/10977 ,  H05K2201/2018 ,  H05K2201/2036 ,  Y02P70/613 ,  Y10T29/49144 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/0401

摘要： A method for assembling, and the resultant electronic module, includes attaching a chip to a substrate using a first solder interconnection array, and attaching a board to the substrate using a second solder interconnection array, which may be a single-melt or a dual-melt solder array. The second solder interconnection array resides entirely within a space defined between the board and substrate. A creep resistant structure is provided within this space for maintaining the defined space and optimizing integrity of the second solder interconnection array. The creep resistant structure may include an underfill material, balls, brackets, frames, collars or combinations thereof. Wherein the creep resistant structure is an underfill material, it is crucial that the substrate be attached to the board before either entirely encapsulating the second interconnection array with underfill material, or partially encapsulating the second solder interconnection array at discrete locations with underfill material.

摘要翻译： 一种用于组装的方法，并且所得到的电子模块包括使用第一焊料互连阵列将芯片附接到衬底，并且使用第二焊料互连阵列将衬底附接到衬底，第二焊料互连阵列可以是单熔体或双 - 熔融焊料阵列。 第二焊料互连阵列完全位于限定在板和衬底之间的空间内。 在该空间内设有抗蠕变结构，用于维持限定的空间并优化第二焊料互连阵列的完整性。 抗蠕变结构可以包括底部填充材料，球，支架，框架，套环或其组合。 其中抗蠕变结构是底部填充材料，在将基板完全用底部填充材料完全封装第二互连阵列之前，或者在具有底部填充材料的不连续位置部分地封装第二焊料互连阵列之前，衬底附着到板上是至关重要的。

公开(公告)号：US07328508B2

公开(公告)日：2008-02-12

申请号：US11160665

申请日：2005-07-05

申请人： David L. Edwards ,  Thomas Fleischman ,  Paul A. Zucco

发明人： David L. Edwards ,  Thomas Fleischman ,  Paul A. Zucco

IPC分类号： B21D51/16 ,  B28B1/00

CPC分类号： H01L23/3733 ,  H01L21/4871 ,  H01L23/3732 ,  H01L23/3736 ,  H01L23/427 ,  H01L2924/0002 ,  Y10T29/4935 ,  Y10T29/49808 ,  Y10T428/13 ,  Y10T428/234 ,  Y10T428/236 ,  H01L2924/00

摘要： A heat spreading apparatus for use in cooling of semiconductor devices includes a frame having a plurality of individual cells formed therein, each of the cells configured for filling with a material of selected thermal conductivity therein. The selected thermal conductivity of material within a given one of the cells corresponds to a thermal profile of the semiconductor device to be cooled.

摘要翻译： 用于冷却半导体器件的散热装置包括具有形成在其中的多个单个电池的框架，每个电池单元被配置为在其中填充选择的热导率的材料。 给定的一个单元内的材料的选择的热导率对应于待冷却的半导体器件的热分布。

公开(公告)号：US07250576B2

公开(公告)日：2007-07-31

申请号：US10908615

申请日：2005-05-19

申请人： Evan G. Colgan ,  David L. Edwards ,  Benjamin V. Fasano ,  Kamal K. Sikka ,  Jeffrey A. Zitz ,  Wei Zou

发明人： Evan G. Colgan ,  David L. Edwards ,  Benjamin V. Fasano ,  Kamal K. Sikka ,  Jeffrey A. Zitz ,  Wei Zou

IPC分类号： H05K1/16

CPC分类号： H01L23/04 ,  H01L23/3675 ,  H01L23/433 ,  H01L24/31 ,  H01L2224/16225 ,  H01L2224/27013 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/83051 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/16195 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/0401

摘要： A chip package including a chip extension for containing thermal interface material (TIM) and improves chip cooling, and a related method, are disclosed. In particular, the chip package includes a chip, a cooling structure coupled to the chip via a TIM, and a chip extension may be thermally coupled to an outer edge of the chip. A TIM placed between the chip and the cooling structure is contained during thermal cycling by the chip extension such that void formation at the edge of the chip, which can move between the chip and cooling structure, is suppressed. The chip extension also improves lateral heat dissipation by providing a greater thermal contact area between the cooling structure and the chip and, if needed, the substrate at a much lower cost than using larger die with lower production unit output from a wafer.

摘要翻译： 公开了一种包括用于包含热界面材料（TIM）并提高芯片冷却的芯片延伸的芯片封装以及相关方法。 特别地，芯片封装包括芯片，经由TIM耦合到芯片的冷却结构，并且芯片延伸部可热耦合到芯片的外边缘。 放置在芯片和冷却结构之间的TIM被芯片延伸部的热循环期间包含，从而可以抑制可在芯片和冷却结构之间移动的芯片边缘处的空隙形成。 芯片延伸还通过在冷却结构和芯片之间提供更大的热接触面积，并且如果需要，以比使用具有较低的晶片生产单位输出的较大模具的成本低得多的成本来改善侧向散热。

公开(公告)号：US07012100B1

公开(公告)日：2006-03-14

申请号：US10161843

申请日：2002-06-04

申请人： David L. Edwards ,  Michael E. Berens ,  Christian Beaudry

发明人： David L. Edwards ,  Michael E. Berens ,  Christian Beaudry

IPC分类号： A01N33/22 ,  A01N33/20 ,  A01N33/18 ,  A01N33/16 ,  A01N33/00

CPC分类号： G01N33/5011 ,  A61K31/00 ,  A61K31/192 ,  A61K31/215 ,  A61K31/381 ,  A61K31/4745 ,  A61K31/549 ,  A61K38/193 ,  A61K39/00 ,  A61K45/06 ,  G01N2500/10 ,  A61K2300/00

摘要： Methods for treating an individual having cancer are provided. The method may include administering a cell migration inhibitor and a chemotherapeutic agent to the individual to inhibit migration of cancer cell. Inhibiting cell migration may increase cell division. In this manner, the cell migration inhibitor and the chemotherapeutic agent in combination may have increased efficacy compared to the chemotherapeutic agent alone due to the increased cell division. The cell migration inhibitor may include any of the inhibitors described herein. For example, the cell migration inhibitor may be an organic molecule having a molecular weight of less than about 700, a monoclonal antibody, or a natural product.

公开(公告)号：US06451155B1

公开(公告)日：2002-09-17

申请号：US08735925

申请日：1996-10-24

申请人： Hilton T. Toy ,  David L. Edwards ,  Da-Yuan Shih ,  Ajay P. Giri

发明人： Hilton T. Toy ,  David L. Edwards ,  Da-Yuan Shih ,  Ajay P. Giri

IPC分类号： C09J10100

CPC分类号： H01L23/3675 ,  F28F3/02 ,  H01L23/10 ,  H01L23/3736 ,  H01L23/3737 ,  H01L23/42 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2924/01004 ,  H01L2924/0102 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15312 ,  H01L2924/16152 ,  H01L2924/19105 ,  H01L2924/3011 ,  Y10S165/905 ,  Y10T428/12562 ,  Y10T428/12569

摘要： A heat sink assembly and method for attaching a multi-chip module cap to a polymeric heat sink adhesive by means of a thin adhesion-promoting metal film layer, which provides an interfacial bond between the cap and polymeric adhesive meeting package performance and reliability requirements. There is also a method of promoting adhesion between a silicon-containing polymeric adhesive and a metal surface using the thin adhesion-promoting metal film layer and the products thereof.

摘要翻译： 一种散热器组件和方法，用于通过薄的促进粘附的金属膜层将多芯片模块盖连接到聚合物散热片粘合剂上，该薄膜层在盖和聚合物粘合剂之间提供界面结合，满足包装性能和可靠性要求。 还有一种使用薄粘附促进金属膜层及其产品来促进含硅聚合物粘合剂和金属表面之间的粘附的方法。

公开(公告)号：US06275381B1

公开(公告)日：2001-08-14

申请号：US09208790

申请日：1998-12-10

申请人： David L. Edwards ,  Glenn G. Daves ,  Shaji Farooq ,  Sushumna Iruvanti ,  Frank L. Pompeo

发明人： David L. Edwards ,  Glenn G. Daves ,  Shaji Farooq ,  Sushumna Iruvanti ,  Frank L. Pompeo

IPC分类号： H05K720

CPC分类号： H05K7/20454 ,  H01L23/42 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2924/16152

摘要： The present invention relates generally to a new apparatus and method for introducing thermal paste into semiconductor packages. More particularly, the invention encompasses an apparatus and a method that uses at least one preform of thermal paste for the cooling of at least one chip in a sealed semiconductor package. The thermal paste preform is subcooled, and is transferred onto a module component from a separable transfer sheet, or is placed onto the module component using an attached and/or imbedded mesh. The preform of thermal paste may be of simple or complex shape, and enables cooling of one or more chips in a module.

摘要翻译： 本发明一般涉及将热膏引入半导体封装的新设备和方法。 更具体地说，本发明包括使用至少一个热糊状物预制件来冷却密封半导体封装中的至少一个芯片的装置和方法。 将热糊预制件过冷，并从可分离转印片材转移到模块组件上，或者使用附接和/或嵌入的网格放置在模块部件上。 热糊状物的预制件可以是简单或复杂的形状，并且能够冷却模块中的一个或多个芯片。