Filler metal installation position checking method and filler metal installation position checking system
    64.
    发明授权
    Filler metal installation position checking method and filler metal installation position checking system 失效
    填料金属安装位置检查方法和填充金属安装位置检查系统

    公开(公告)号:US08718358B2

    公开(公告)日:2014-05-06

    申请号:US12292382

    申请日:2008-11-18

    IPC分类号: G06K9/00

    摘要: The present invention is a filler metal installation position checking method and a filler metal installation position checking system for confirming difference between installation position and designed position of a filler metal embedded in a wall surface. A standard surface target 16 having known actual dimension and position to a wall surface 12 is provided to the wall surface 12 where a filler metal 14 is installed. The wall surface 12 is photographed together with the standard surface target 16 to create image data 18. Using actual position and dimension of the standard surface target 16 and position and dimension of the standard surface target 16 on an image displayed by the image data 18, the image data 18 is converted into corrected image data 20 displaying an image corrected in a manner that the image is photographed from front of the wall surface. Design CAD data 22 showing actual designed position of the filler metal is read out and the images shown by the corrected image data 20 and the design CAD data 22 are outputted as images on one same display.

    摘要翻译: 本发明是一种填充金属安装位置检查方法和填充金属安装位置检查系统,用于确认嵌入壁表面中的填充金属的安装位置和设计位置之间的差异。 具有已知的实际尺寸和位置的壁表面12的标准表面目标16被提供给安装有填充金属14的壁表面12。 与标准表面目标16一起拍摄壁表面12以产生图像数据18.使用标准表面目标16的实际位置和尺寸以及标准表面目标16的位置和尺寸在由图像数据18显示的图像上, 图像数据18被转换成校正图像数据20,其显示以从壁表面的前方拍摄图像的方式校正的图像。 读取显示填充金属的实际设计位置的设计CAD数据22,并且将校正图像数据20和设计CAD数据22所示的图像作为图像输出在同一显示器上。

    ELECTROMAGNETIC CONTACTOR, ELECTROMAGNETIC CONTACTOR GAS ENCAPSULATING METHOD, AND ELECTROMAGNETIC CONTACTOR MANUFACTURING METHOD
    65.
    发明申请
    ELECTROMAGNETIC CONTACTOR, ELECTROMAGNETIC CONTACTOR GAS ENCAPSULATING METHOD, AND ELECTROMAGNETIC CONTACTOR MANUFACTURING METHOD 审中-公开
    电磁接触器,电磁接触器气体封装方法和电磁接触器制造方法

    公开(公告)号:US20130234813A1

    公开(公告)日:2013-09-12

    申请号:US13814158

    申请日:2011-10-25

    IPC分类号: H01H33/60

    摘要: An electromagnetic contactor has a base plate having an aperture hole; an arc extinguishing chamber having a fixed terminal and a pipe; and a bottomed tubular cap in which one end thereof is open. An arc extinguishing chamber connection portion is formed by the arc extinguishing chamber and a first connection member having a tube portion connected to the arc extinguishing chamber and a flange portion contacting with the base plate. A cap connection portion is formed by the cap and a second connection member having a tube portion connected to the cap and a flange portion connected to the base plate. The flange portions of the first and second connection members are attached to one surface and the other surface of the base plate accordingly. The arc extinguishing chamber connection portion and the cap connection portion are in communication through the aperture hole of the base plate.

    摘要翻译: 电磁接触器具有具有孔眼的基板; 具有固定端子和管道的灭弧室; 以及其一端敞开的有底管状帽。 灭弧室连接部由灭弧室形成,第一连接部件具有与灭弧室连接的管部和与基板接触的凸缘部。 帽盖连接部分由盖子形成,第二连接部件具有连接到盖子的管部分和连接到基板的凸缘部分。 第一和第二连接构件的凸缘部分相应地附接到基板的一个表面和另一个表面。 灭弧室连接部和盖连接部通过基板的孔径连通。

    Particle beam therapy system
    66.
    发明授权
    Particle beam therapy system 有权
    粒子束治疗系统

    公开(公告)号:US08405042B2

    公开(公告)日:2013-03-26

    申请号:US12864002

    申请日:2010-01-28

    IPC分类号: G21K1/08

    摘要: The objective of the present invention is to reduce the effect of the hysteresis of a scanning electromagnet so as to obtain a particle beam therapy system that realizes high-accuracy beam irradiation. There are included an irradiation management apparatus (32) that controls the scanning electromagnet (3), based on target irradiation position coordinates (Pi) of a charged particle beam (1b), and a position monitor (7) that measures measurement position coordinates (Ps) of the charged particle beam (1b). The irradiation management apparatus (32) has a command value creator (25) that outputs a control input (Io (Ir)) to the scanning electromagnet (3), based on the target irradiation position coordinates (Pi) and correction data (Ia) created on the basis of the measurement position coordinates (Ps), measured by the position monitor (7) in the preliminary irradiation in which the excitation pattern of the scanning electromagnet is the same as that of the main irradiation plan, and the target irradiation position coordinates (Pi).

    摘要翻译: 本发明的目的是减少扫描电磁体的滞后效果,以获得实现高精度光束照射的粒子束治疗系统。 包括基于带电粒子束(1b)的目标照射位置坐标(Pi)来控制扫描电磁体(3)的照射管理装置(32)和测量位置坐标( Ps)的带电粒子束(1b)。 照射管理装置(32)具有基于目标照射位置坐标(Pi)和校正数据(Ia)向扫描电磁体(3)输出控制输入(Io(Ir))的指令值生成器(25) 基于由扫描电磁体的激励图案与主照射平面的激励图案相同的预备照射中的位置监视器(7)测量的测量位置坐标(Ps)和目标照射位置 坐标(Pi)。

    Substrate processing system and substrate transfer method
    69.
    发明授权
    Substrate processing system and substrate transfer method 有权
    基板处理系统和基板转印方法

    公开(公告)号:US08046095B2

    公开(公告)日:2011-10-25

    申请号:US12302857

    申请日:2007-06-15

    申请人: Yuichi Yamamoto

    发明人: Yuichi Yamamoto

    IPC分类号: G06F19/00

    摘要: A substrate processing system (100) includes a main transfer line (20) configured to transfer wafers (W) over the entire system, and an auxiliary transfer line (30) configured to transfer wafers (W) inside a photolithography process section (1a). The photolithography process section (1a) is arranged such that a resist coating process apparatus (2) and a developing process apparatus (5) are disposed separately from each other, a first light exposure process apparatus (3a) and a first PEB process apparatus (4a) are disposed adjacent to each other, and a second light exposure process apparatus (3b) and a second PEB process apparatus (4b) are disposed adjacent to each other.

    摘要翻译: 基板处理系统(100)包括配置成在整个系统上传送晶片(W)的主传输线(20)和被配置为在光刻处理部分(1a)内转移晶片(W)的辅助传输线(30) 。 光刻处理部分(1a)被布置成使得抗蚀剂涂覆处理装置(2)和显影处理装置(5)彼此分开设置,第一曝光处理装置(3a)和第一PEB处理装置 4a)彼此相邻地设置,并且第二曝光处理装置(3b)和第二PEB处理装置(4b)彼此相邻地设置。

    Substrate treatment apparatus
    70.
    发明授权
    Substrate treatment apparatus 有权
    基板处理装置

    公开(公告)号:US08043039B2

    公开(公告)日:2011-10-25

    申请号:US12207809

    申请日:2008-09-10

    IPC分类号: H01L21/677

    摘要: A substrate treatment apparatus is disclosed. The substrate treatment apparatus includes: a cassette loading portion on which a cassette for containing a substrate is loaded when the cassette is carried to/from outside of the substrate treatment apparatus; a substrate treatment portion for performing a treatment on the substrate; a substrate carrying portion for carrying the substrate in the cassette loaded on the cassette loading portion to the substrate treatment portion, and carrying the substrate that has been subjected to the treatment by the substrate treatment portion to the cassette on the cassette loading portion; a vacant cassette loading portion on which the cassette caused to be vacant by carrying the substrate to the substrate treatment portion is temporarily loaded; and a vacant cassette transfer mechanism for transferring the vacant cassette between the vacant cassette loading portion and the cassette loading portion.

    摘要翻译: 公开了一种基板处理装置。 所述基板处理装置包括:盒装载部,当将所述盒搬运到所述基板处理装置的外部时,装载用于容纳基板的盒; 用于对所述基板进行处理的基板处理部; 用于将装载在所述盒装载部分上的所述盒中的所述基板运送到所述基板处理部分的基板承载部分,以及将已经被所述基板处理部分处理的所述基板运送到所述盒装载部分上的所述盒; 临时装载通过将基板运送到基板处理部而使盒空置的空置盒装载部; 以及用于在空的盒装载部分和盒装载部分之间传送空盒的空的盒传送机构。