公开(公告)号：US09070615B2

公开(公告)日：2015-06-30

申请号：US14289512

申请日：2014-05-28

Applicant: Infineon Technologies AG

Inventor： Klaus Elian ,  Guenther Ruhl ,  Horst Theuss ,  Irmgard Escher-Poeppel

IPC: H01L29/06 ,  H01L29/16 ,  G01N27/12 ,  H01L23/31 ,  H01L21/56 ,  H01L23/28 ,  H01L23/29 ,  H01L23/00 ,  G01N33/00

CPC classification number: H01L29/1606 ,  G01N27/127 ,  G01N33/0059 ,  H01L21/561 ,  H01L21/568 ,  H01L23/28 ,  H01L23/293 ,  H01L23/3135 ,  H01L23/315 ,  H01L23/49562 ,  H01L24/13 ,  H01L24/16 ,  H01L24/24 ,  H01L24/48 ,  H01L24/49 ,  H01L24/94 ,  H01L24/96 ,  H01L2224/02379 ,  H01L2224/0346 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05548 ,  H01L2224/12105 ,  H01L2224/13022 ,  H01L2224/13024 ,  H01L2224/13111 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/24011 ,  H01L2224/24105 ,  H01L2224/24226 ,  H01L2224/48245 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/94 ,  H01L2224/96 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2224/11 ,  H01L2924/01082 ,  H01L2924/01047 ,  H01L2924/01029 ,  H01L2924/01028 ,  H01L2924/01079 ,  H01L2924/01083 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2924/00012

Abstract: A graphene layer is generated on a substrate. A plastic material is deposited on the graphene layer to at least partially cover the graphene layer. The substrate is separated into at least two substrate pieces.

Abstract translation: 在基板上产生石​​墨烯层。 在石墨烯层上沉积塑料材料以至少部分地覆盖石墨烯层。 将基板分成至少两个基片。

公开(公告)号：US20150132614A1

公开(公告)日：2015-05-14

申请号：US14077362

申请日：2013-11-12

Applicant: Infineon Technologies AG

Inventor： Klaus Elian ,  Jochen Dangelmaier ,  Franz Michael Darrer ,  Thomas Müller ,  Mathias Vaupel ,  Manfred Fries ,  Günther Ruhl ,  Horst Theuss

IPC: H01M10/48

CPC classification number: H01M10/48 ,  H01M10/0525 ,  H01M10/486 ,  H04Q9/00 ,  H04Q2209/40 ,  H04Q2209/823 ,  Y02T10/7011

Abstract: A sensor arrangement according to an embodiment comprises a transmitter to be arranged inside a battery cell and to transmit a signal based on at least one sensed operational parameter of the battery cell wirelessly.

Abstract translation: 根据实施例的传感器装置包括要布置在电池单元内的发射器，并且基于无线地基于电池单元的至少一个感测的操作参数发送信号。

公开(公告)号：US20150004451A1

公开(公告)日：2015-01-01

申请号：US14311489

申请日：2014-06-23

Applicant: Infineon Technologies AG

Inventor： Klaus Elian ,  Jochen Dangelmaier ,  Manfred Fries ,  Juergen Hoegerl ,  Georg Meyer-Berg ,  Thomas Mueller ,  Guenther Ruhl ,  Horst Theuss ,  Mathias Vaupel

IPC: G01R31/36 ,  H01M10/48

CPC classification number: H01M10/48 ,  G01R31/3689 ,  H01M6/505 ,  H01M10/488

Abstract: An apparatus for determining a state of a rechargeable battery or of a battery has a sensor device and an evaluation device. The sensor device brings about an interaction between an optical signal and a part of the rechargeable battery or of the battery, which part indicates optically acquirable information about a state of the rechargeable battery or of the battery, and detects an optical signal caused by the interaction. The sensor device furthermore provides a detection signal having information about the detected optical signal. The evaluation device determines information about a state of the rechargeable battery or of the battery on the basis of the information of the detection signal. Furthermore, the evaluation device provides a state signal having the information about the determined state.

Abstract translation: 用于确定可再充电电池或电池的状态的装置具有传感器装置和评估装置。 该传感器装置引起光信号与可再充电电池或电池的一部分之间的相互作用，该部分指示关于可再充电电池或电池的状态的光学上可获取的信息，并检测由相互作用引起的光信号 。 传感器装置还提供具有关于检测到的光信号的信息的检测信号。 评估装置基于检测信号的信息来确定关于可再充电电池或电池的状态的信息。 此外，评估装置提供具有关于所确定的状态的信息的状态信号。

公开(公告)号：US20250060338A1

公开(公告)日：2025-02-20

申请号：US18939121

申请日：2024-11-06

Applicant: Infineon Technologies AG

Inventor： Derek Debie ,  Klaus Elian ,  Ludwig Heitzer ,  David Tumpold ,  Jens Pohl ,  Cyrus Ghahremani ,  Thorsten Meyer ,  Christian Geissler ,  Andreas Allmeier

IPC: G01N29/22 ,  G01N25/00 ,  G01N29/02 ,  G01N29/24

Abstract: A radiation source device includes at least one membrane layer, a radiation source structure to emit electromagnetic or infrared radiation, a substrate and a spacer structure, wherein the substrate and the at least one membrane form a chamber, wherein a pressure in the chamber is lower than or equal to a pressure outside of the chamber, and wherein the radiation source structure is arranged between the at least one membrane layer and the substrate.

公开(公告)号：US12228728B2

公开(公告)日：2025-02-18

申请号：US17659749

申请日：2022-04-19

Applicant: Infineon Technologies AG

Inventor： Horst Theuss ,  Klaus Elian ,  Cyrus Ghahremani

IPC: G02B26/08 ,  G02B7/182 ,  G02B26/10 ,  G02B27/14

Abstract: One example implementation of a mirror system comprises a carrier, and a first chip package arranged on a surface of the carrier and comprising a first MEMS mirror. Furthermore, the mirror system comprises a second chip package arranged on the surface of the carrier and comprising a second MEMS mirror. The mirror system furthermore comprises a reflective element arranged over the surface of the carrier and above the first chip package and the second chip package in such a way that a radiation that is incident in the mirror system and is reflected by the first MEMS mirror in the direction of the reflective element is reflected by the reflective element in the direction of the second MEMS mirror.

公开(公告)号：US12157145B2

公开(公告)日：2024-12-03

申请号：US17865504

申请日：2022-07-15

Applicant: Infineon Technologies AG

Inventor： Klaus Elian ,  Matthias Eberl ,  Fabian Merbeler

IPC: B06B1/02 ,  B06B1/06 ,  G01H11/06 ,  H10N30/20

Abstract: A sensor system for attachment to a casing includes at least one sensor element, where the sensor element is configured for detecting an environment property of an environment which, with the sensor system attached to the casing, is situated on the opposite side of the casing with respect to the sensor system. The sensor system also includes an encapsulation layer, where the sensor element is embedded in the encapsulation layer, and where the encapsulation layer has a contact surface for attaching the sensor system to the casing.

公开(公告)号：US20230194478A1

公开(公告)日：2023-06-22

申请号：US18050178

申请日：2022-10-27

Applicant: Infineon Technologies AG

Inventor： Derek Debie ,  Klaus Elian ,  Ludwig Heitzer ,  David Tumpold ,  Jens Pohl ,  Cyrus Ghahremani ,  Thorsten Meyer ,  Christian Geissler ,  Andreas Allmeier

IPC: G01N29/22 ,  G01N29/02 ,  G01N25/00 ,  G01N29/24

CPC classification number: G01N29/222 ,  G01N29/02 ,  G01N25/00 ,  G01N29/2425 ,  G01N2291/021

Abstract: A radiation source device includes at least one membrane layer, a radiation source structure to emit electromagnetic or infrared radiation, a substrate and a spacer structure, wherein the substrate and the at least one membrane form a chamber, wherein a pressure in the chamber is lower than or equal to a pressure outside of the chamber, and wherein the radiation source structure is arranged between the at least one membrane layer and the substrate.

公开(公告)号：US11275110B2

公开(公告)日：2022-03-15

申请号：US16849868

申请日：2020-04-15

Applicant: Infineon Technologies AG

Inventor： Klaus Elian ,  Rainer Markus Schaller

IPC: G01R31/28 ,  G01R31/52

Abstract: The disclosure describes techniques for detecting failures or performance degradation of a device including an integrated circuit (IC) components in the field by including additional contacts, i.e. terminals, along with functional contacts of the circuit used for connecting the circuit to a system in which the circuit is a part. These additional contacts may be internal external to the package surface and may be used to measure dynamic changing electrical characteristics over time e.g. voltage, current, capacity, temperature and impedance. These electrical characteristics may be representative of one or more failure modes and may be treated as indicator for device state-of-health (SOH).

公开(公告)号：US20210325454A1

公开(公告)日：2021-10-21

申请号：US16849868

申请日：2020-04-15

Applicant: Infineon Technologies AG

Inventor： Klaus Elian ,  Rainer Markus Schaller

IPC: G01R31/28 ,  G01R31/52

Abstract: The disclosure describes techniques for detecting failures or performance degradation of a device including an integrated circuit (IC) components in the field by including additional contacts, i.e. terminals, along with functional contacts of the circuit used for connecting the circuit to a system in which the circuit is a part. These additional contacts may be internal external to the package surface and may be used to measure dynamic changing electrical characteristics over time e.g. voltage, current, capacity, temperature and impedance. These electrical characteristics may be representative of one or more failure modes and may be treated as indicator for device state-of-health (SOH).

公开(公告)号：US10852363B2

公开(公告)日：2020-12-01

申请号：US15864313

申请日：2018-01-08

Applicant: Infineon Technologies AG

Inventor： Klaus Elian ,  Rainer Markus Schaller

IPC: G01R15/20 ,  G01R33/02 ,  G01R33/00 ,  G01R19/00 ,  H01F7/02

Abstract: A semiconductor package may include a sensor chip to measure an amount of electrical current in a current medium. The sensor chip may include a first magnetic sensing element and a second magnetic sensing element. The semiconductor package may include a magnet that produces a magnetic field. The magnet may be arranged asymmetrically with respect to the first magnetic sensing element and the second magnetic sensing element such that a strength of the magnetic field at the first magnetic sensing element is different from a strength of the magnetic field at the second magnetic sensing element.