摘要:
A multichip module buck converter 10 has a high side power mosfet 12, a low side power mosfet 22 and a pre-molded leadframe 40 between the two mosfets for connecting the source of mosfet 12 to the drain of mosfet 22. Clips 14, 16, 18 and 26 carry the source, gate and drain terminals of the mosfet from planes parallel but spaced apart to a common plane.
摘要:
A buck converter module includes a high side (HS) die having source, drain, and gate bonding pads on a front side of the HS die, a low side (LS) die having a first section thereof with a plurality of through silicon vias (TSVs) extending from a back side to a front side of the LS die, the LS die having source, drain, and gate bonding pads located on a front side of a second section separate from the first section, the drain bonding pad electrically connected to the back side of the LS die in the second section. The HS die and the LS die are bonded together such that the source bonding pad of the HS die is electrically connected to the back side of the LS die, and each of the drain and gate bonding pads are electrically connected to separate TSVs in the LS die.
摘要:
A method of reading code symbols using a digital image capture and processing system which includes: an image formation and detection subsystem; an illumination subsystem; an illumination control subsystem; a digital image processing subsystem; and an input/output subsystem; and a system control subsystem. In the illustrative embodiment, a micro-computing platform implements the digital image processing subsystem, the input/output subsystem and the system control subsystem. The micro-computing platform includes a microprocessor, a memory architecture, and a multi-tier modular software architecture responsive to the generation of a triggering event within the system. Triggering events can be generated by an automatic object detector or by a manually actuated trigger switch.
摘要:
In a wireless communication system wherein communication devices exchange information utilizing data units that conform to a first format, a beamforming training (BFT) data unit that conforms to a second format is transmitted, wherein a length of the BFT data unit is shorter than lengths supported by the first format, wherein the BFT data unit is for transmitting PHY beamforming training information. Information to indicate the BFT data unit conforms to the second format is transmitted to a receiving device. The BFT data unit is generated according to the second format, wherein the BFT data unit includes BFT information elements. The BFT data unit is then transmitted to the receiving device.
摘要:
A routing requesting method to transmit data to a device of a different piconets in a scatternet including at least two piconets which have a master device and at least one slave device controlled by the master device. A source device generates as a single packet an information inquiring a first radio resource used in each device of the piconet and an information requesting the routing. The source device broadcasts the packet to adjacent devices. The adjacent device, which receives the generated packet, sends the packet to a destination device by repeating the above process. The destination device assigns itself the master device, generates a RREP message including a clock information, and sends the generated RREP message to an adjacent device. The source device becomes aware of devices along the route using the information contained in the RREP message.
摘要:
Semiconductor die packages, methods of making said packages, and systems using said packages are disclosed. An exemplary package comprises at least one semiconductor die disposed on one surface of a leadframe and electrically coupled to at least one conductive region of the leadframe, and at least one passive electrical component disposed on the other surface of a leadframe and electrically coupled to at least one conductive region of the leadframe. Molding material is disposed over the at least one passive electrical component to provide a molded passive component.
摘要:
A semiconductor die package. The semiconductor includes a premolded substrate. The premolded substrate includes (i) a leadframe structure, (ii) a first semiconductor die comprising a first die surface and a second die surface, attached to the leadframe structure, and (iii) a molding material covering at least a portion of the leadframe structure and the first semiconductor die. The premolded substrate includes a first premolded substrate surface and a second premolded substrate surface. A second semiconductor die is stacked on the second premolded substrate surface of the premolded substrate. A housing material is on at least a portion of the second semiconductor die and the second premolded substrate surface of the premolded substrate. One of the first semiconductor die and the second semiconductor die includes a transistor while the other includes an integrated circuit.
摘要:
A digital-imaging based code symbol reading system comprising an image sensing array with a field of view (FOV), an illumination subsystem with an LED illumination array, an automatic illumination measurement subsystem, an illumination control subsystem, and programmed imager processor supporting an image-processing based illumination metering program. The automatic illumination measurement subsystem, employing a photodetector operating independently from the image sensing array, is used to automatically measure the illumination level at a particular region of the FOV and determine the illumination duration necessary to achieve a desired spatial intensity in the detected digital image. The illumination metering program automatically analyzes and measures, in real-time, the spatial intensity distribution of the digital image and determines whether or not a corrected illumination duration is required or desired when detecting the next or subsequent digital images, during the current or subsequent object illumination and imaging cycle. The previously determined illumination duration is over-written with the corrected illumination duration, which is used to drive the illumination subsystem and form and detect subsequent digital images of the illuminated object.
摘要:
An apparatus and method for testing large area substrates is described. The large area substrates include patterns of displays and contact points electrically coupled to the displays. The apparatus includes a prober assembly that is movable relative to the large area substrate and may be configured to test various patterns of displays and contact points. The prober assembly is also configured to test fractional sections of the large area substrate. The apparatus also includes a test chamber configured to store at least two prober assemblies within an interior volume.
摘要:
A semiconductor die package. The semiconductor die package includes a leadframe structure, a first semiconductor die comprising a first surface attached to a first side of the leadframe structure, and a second semiconductor die attached to a second side of the leadframe structure. The second semiconductor die comprises an integrated circuit die. A housing material is formed over at least a portion of the leadframe structure, the first semiconductor die, and the second semiconductor die. An exterior surface of the molding material is substantially coplanar with the first surface of the semiconductor die.