公开(公告)号：US20150006132A1

公开(公告)日：2015-01-01

申请号：US14372333

申请日：2013-01-15

申请人： Takeshi Matsumura

发明人： Takeshi Matsumura

IPC分类号： G06F17/50

CPC分类号： G06F17/5009 ,  B60K28/02 ,  B60W40/09 ,  B60W2050/0018 ,  B60W2050/0029 ,  B60W2540/28 ,  G08G1/0112 ,  G08G1/0129 ,  G08G1/0145 ,  G08G1/095 ,  G08G1/096716 ,  G08G1/096741 ,  G08G1/096775 ,  G08G1/096791

摘要： A driving model generation device is provided that enables driving evaluation according to a traveling situation of a vehicle. A vehicle is provided with a vehicle state detector, which detects a vehicle state quantity that changes according to a driving operation by a driver. A model generator generates a driving model, which is a reference related to a specific driving operation, based on the vehicle state quantity at the time the driver starts the specific driving operation and the vehicle state quantity at the time the specific driving operation is finished. A driving evaluator evaluates the driving skill of the driver by comparing the driving operation of the driver presented by a detection result of the vehicle state detector to the driving model generated by the model generator.

摘要翻译： 提供了一种能够根据车辆的行驶状况进行驾驶评价的驾驶模型生成装置。 车辆设置有车辆状态检测器，其检测根据驾驶员的驾驶操作而改变的车辆状态量。 模型发生器基于驾驶员开始特定驾驶操作时的车辆状态量和特定驾驶操作完成时的车辆状态量，生成作为与具体驾驶操作有关的参考的驾驶模型。 驾驶评价者通过将由车辆状态检测器的检测结果呈现的驾驶员的驾驶操作与由模型发生器产生的驾驶模型进行比较来评估驾驶者的驾驶技能。

公开(公告)号：US20140095016A1

公开(公告)日：2014-04-03

申请号：US14005838

申请日：2012-03-19

申请人： Hideaki Suganuma ,  Takeshi Matsumura ,  Toshiro Hikita

发明人： Hideaki Suganuma ,  Takeshi Matsumura ,  Toshiro Hikita

IPC分类号： G07C5/00

CPC分类号： G07C5/00 ,  G05B23/0221 ,  G06F15/00

摘要： A vehicle data analysis apparatus analyzes vehicle data that indicates chronological change of a vehicle state. The vehicle data analysis apparatus is provided with a computing unit and a recognition unit. The computing unit is configured to make obvious data fluctuation accompanying the development, in the vehicle data, of mechanical or control-related fault in a vehicle control system. The recognition unit is configured to recognize the vehicle data to be considered during vehicle fault diagnosis on the basis of a result of computation by the computing unit.

摘要翻译： 车辆数据分析装置分析指示车辆状态的时间变化的车辆数据。 车辆数据分析装置具有计算单元和识别单元。 计算单元被配置为伴随车辆控制系统中的机械或控制相关故障的车辆数据的开发中的明显的数据波动。 识别单元被配置为基于计算单元的计算结果来识别在车辆故障诊断期间要考虑的车辆数据。

公开(公告)号：US08661097B2

公开(公告)日：2014-02-25

申请号：US13123251

申请日：2008-10-10

申请人： Ryoji Kato ,  Takeshi Matsumura ,  Shingo Murakami ,  Toshikane Oda ,  Shinta Sugimoto

发明人： Ryoji Kato ,  Takeshi Matsumura ,  Shingo Murakami ,  Toshikane Oda ,  Shinta Sugimoto

IPC分类号： G06F15/16

CPC分类号： H04L65/1016 ,  H04L65/1006 ,  H04L65/105

摘要： There is provided a service node that is capable of serving a first user node in a first network including a control node. The first network is capable of communicating with a second network including a second user node. The service node comprises: a request receiving unit that receives a first user identity that identifies the first user node and a second user identity that identifies the second user node; a determining unit that determines whether a received message includes the first user identity as a destination, or the message includes auxiliary information that corresponds to the first user identity; and a modifying unit that modifies the destination of the message to the second user identity and modifies the source of the message to the first user identity in accordance with the determination result by the determining unit.

摘要翻译： 提供了能够为包括控制节点的第一网络中的第一用户节点服务的服务节点。 第一网络能够与包括第二用户节点的第二网络进行通信。 所述服务节点包括：请求接收单元，其接收标识所述第一用户节点的第一用户身份和识别所述第二用户节点的第二用户身份; 确定单元，确定接收到的消息是否包括作为目的地的第一用户身份，或者该消息包括与第一用户身份相对应的辅助信息; 以及修改单元，其将消息的目的地修改为第二用户身份，并且根据确定单元的确定结果将消息的源修改为第一用户身份。

公开(公告)号：US08659157B2

公开(公告)日：2014-02-25

申请号：US13477349

申请日：2012-05-22

申请人： Yuta Kimura ,  Yasushi Inoue ,  Takeshi Matsumura

发明人： Yuta Kimura ,  Yasushi Inoue ,  Takeshi Matsumura

IPC分类号： H01L23/52 ,  H01L23/48 ,  H01L21/20 ,  H01L23/31

CPC分类号： H01L21/6836 ,  C08L33/12 ,  C09J133/08 ,  C09J163/00 ,  H01L24/29 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2924/01012 ,  H01L2924/01029 ,  H01L2924/351 ,  H01L2924/3512 ,  H01L2924/00 ,  C08L63/00 ,  C08L71/00

摘要： An object of the present invention is to provide an adhesive composition that can form an adhesive sheet for producing a semiconductor device capable of suppressing deterioration in ion scavengeability after the adhesive sheet goes through thermal history. It is an adhesive composition for producing a semiconductor device containing at least an organic complex-forming compound that forms a complex with cations, and the 5% weight loss temperature of the organic complex-forming compound measured by thermogravimetry is 180° C. or more.

摘要翻译： 本发明的目的是提供一种可以形成用于制造半导体器件的粘合片的粘合剂组合物，该半导体器件能够抑制粘合片经过热历史后的离子清除能力的劣化。 它是用于制造半导体器件的粘合剂组合物，其至少包含与阳离子形成络合物的有机络合物形成化合物，并且通过热重分析测量的有机络合物形成化合物的5重量％失重温度为180℃以上 。

公开(公告)号：US08645058B2

公开(公告)日：2014-02-04

申请号：US13203417

申请日：2009-03-03

申请人： Takeshi Matsumura ,  Yuki Yamada

发明人： Takeshi Matsumura ,  Yuki Yamada

IPC分类号： G06F7/00

CPC分类号： G01C21/26

摘要： In a vehicle drive support device 10a including an optical beacon communicator 11 that acquires exterior information on roads from an optical beacon communicator 100 on the roadside outside a subject vehicle, a navigation system 12 that acquires interior information on roads inside the subject vehicle and a vehicle drive support processing unit 24 that performs vehicle drive support of the subject vehicle using the exterior information acquired by the optical beacon communicator 11, the vehicle drive support processing unit 24 changes use aspects of the exterior information for the vehicle drive support in accordance with the interior information acquired by the navigation system 12. Accordingly, it becomes possible to perform the vehicle drive support by more efficiently using the information from outside of the subject vehicle.

摘要翻译： 在包含从本车辆外侧的路边的光学信标通信装置100取得道路的外部信息的光信标通信装置11的车辆用驱动支援装置10a中，获取本车辆内的道路内部信息的导航系统12， 驱动支持处理单元24，其使用由光学信标通信器11获取的外部信息来执行本车辆的车辆驱动支持，车辆驾驶支持处理单元24根据内部改变车辆驾驶支持的外部信息的使用方面 由导航系统12获取的信息。因此，可以通过更有效地使用来自本车辆外部的信息来执行车辆驾驶支持。

公开(公告)号：US08592260B2

公开(公告)日：2013-11-26

申请号：US12492641

申请日：2009-06-26

申请人： Masami Oikawa ,  Takeshi Matsumura ,  Sadahito Misumi

发明人： Masami Oikawa ,  Takeshi Matsumura ,  Sadahito Misumi

IPC分类号： H01L21/50

CPC分类号： H01L24/27 ,  C09J5/06 ,  C09J163/00 ,  C09J2463/00 ,  H01L21/565 ,  H01L21/6836 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L24/85 ,  H01L24/92 ,  H01L24/94 ,  H01L25/0657 ,  H01L25/50 ,  H01L2221/68327 ,  H01L2224/27436 ,  H01L2224/29 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29311 ,  H01L2224/29316 ,  H01L2224/29318 ,  H01L2224/29324 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29364 ,  H01L2224/29371 ,  H01L2224/29386 ,  H01L2224/29387 ,  H01L2224/29393 ,  H01L2224/32014 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48221 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/83097 ,  H01L2224/83191 ,  H01L2224/83856 ,  H01L2224/83907 ,  H01L2224/85207 ,  H01L2224/92247 ,  H01L2224/94 ,  H01L2225/0651 ,  H01L2225/06575 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/0102 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01056 ,  H01L2924/01074 ,  H01L2924/01077 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/10253 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/20103 ,  H01L2924/20104 ,  H01L2924/20105 ,  H01L2924/20106 ,  H01L2924/3011 ,  H01L2924/00014 ,  H01L2224/03 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2924/05442 ,  H01L2924/05432 ,  H01L2924/0532 ,  H01L2924/04642 ,  H01L2924/05042 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299

摘要： The process for producing a semiconductor device of the invention is a process for producing a semiconductor device, comprising: a temporarily bonding step of bonding a semiconductor element temporarily on an adherend through an adhesive sheet, a semi-curing step of heating the adhesive sheet under predetermined conditions, thereby turning the sheet into a semi-cured state that the shearing adhering strength of the sheet to the adherend is 0.5 MPa or more, and a wire bonding step of causing the semiconductor element to undergo wire bonding in the state that the adhesive sheet is semi-cured.

摘要翻译： 本发明的半导体装置的制造方法是一种半导体装置的制造方法，其特征在于，包括：将半导体元件通过粘合片临时接合在被粘物上的暂时接合工序;将半导体装置 从而将片材转化为片材与被粘物的剪切粘合强度为0.5MPa以上的半固化状态，以及在粘合剂的状态下使半导体元件进行引线接合的引线接合工序 片材半固化。

公开(公告)号：US08586415B2

公开(公告)日：2013-11-19

申请号：US13326106

申请日：2011-12-14

申请人： Takeshi Matsumura ,  Masaki Mizutani

发明人： Takeshi Matsumura ,  Masaki Mizutani

IPC分类号： H01L21/00

CPC分类号： H01L24/29 ,  C09J7/20 ,  C09J2201/36 ,  C09J2201/606 ,  C09J2201/61 ,  C09J2203/326 ,  C09J2205/31 ,  C09J2433/00 ,  H01L21/6836 ,  H01L24/27 ,  H01L24/83 ,  H01L2221/68327 ,  H01L2224/274 ,  H01L2224/2919 ,  H01L2224/83191 ,  H01L2224/8385 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01016 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/3025 ,  Y10T428/218 ,  Y10T428/28 ,  Y10T428/2848 ,  H01L2924/00 ,  H01L2924/3512

摘要： A dicing/die-bonding film including a pressure-sensitive adhesive layer (2) on a supporting base material (1) and a die-bonding adhesive layer (3) on the pressure-sensitive adhesive layer (2), wherein a releasability in an interface between the pressure-sensitive adhesive layer (2) and the die-bonding adhesive layer (3) is different between an interface (A) corresponding to a work-attaching region (3a) in the die-bonding adhesive layer (3) and an interface (B) corresponding to a part or a whole of the other region (3b), and the releasability of the interface (A) is higher than the releasability of the interface (B). The dicing/die-bonding film is excellent in balance between retention in dicing a work and releasability in releasing its diced chipped work together with the die-bonding adhesive layer.

摘要翻译： 一种在支撑基材（1）上具有压敏粘合剂层（2）和压敏粘合剂层（2）上的芯片粘合层（3）的切割/芯片接合膜，其中， 粘合剂层（2）与芯片粘合层（3）之间的界面在与芯片粘合层（3）中的工件附着区域（3a）相对应的界面（A）之间是不同的， 以及对应于另一区域（3b）的一部分或全部的界面（B），并且界面（A）的释放性高于界面（B）的剥离性。 切割/芯片接合膜在切割工件的保持性和脱模性之间的平衡优异，并且与芯片粘合层一起释放切割的切片工作。

公开(公告)号：US20130187953A1

公开(公告)日：2013-07-25

申请号：US13877273

申请日：2010-10-22

申请人： Takeshi Matsumura ,  Johan Hjelm ,  Shingo Murakami ,  Toshikane Oda ,  Kenta Yasukawa

发明人： Takeshi Matsumura ,  Johan Hjelm ,  Shingo Murakami ,  Toshikane Oda ,  Kenta Yasukawa

IPC分类号： G06T11/60 ,  G06K9/62

CPC分类号： G06T11/60 ,  G06F17/30247 ,  G06F17/30864 ,  G06K9/00 ,  G06K9/6201 ,  G06K9/6203 ,  G06T19/00 ,  G06T19/006 ,  G09G5/14 ,  H04L29/08072

摘要： An image matching apparatus is provided. The apparatus includes a storage unit, an obtaining unit, a specification unit, and an image matching unit. The storage unit is configured to store image data of one or more devices that are connected to a local network. The obtaining unit is configured to obtain image data of device image obtained by capturing a device. The specification unit is configured to specify one or more local networks to be used for image matching. The image matching unit is configured to perform image matching of the obtained image data against the stored image data of one or more devices that are connected to the specified local network.

摘要翻译： 提供了图像匹配装置。 该装置包括存储单元，获取单元，规格单元和图像匹配单元。 存储单元被配置为存储连接到本地网络的一个或多个设备的图像数据。 获取单元被配置为获得通过捕获设备而获得的设备图像的图像数据。 规范单元被配置为指定要用于图像匹配的一个或多个本地网络。 图像匹配单元被配置为执行所获得的图像数据与连接到指定的本地网络的一个或多个设备的存储的图像数据的图像匹配。

公开(公告)号：US20120280706A1

公开(公告)日：2012-11-08

申请号：US13464861

申请日：2012-05-04

申请人： Daisuke Uenda ,  Makoto Namikawa ,  Takeshi Matsumura

发明人： Daisuke Uenda ,  Makoto Namikawa ,  Takeshi Matsumura

IPC分类号： G01R1/067 ,  B08B1/00 ,  A47L25/00 ,  A47L13/10

CPC分类号： B08B1/006

摘要： Provided is a cleaning unit for removing foreign matter adhering to a probe needle of a probe card for a continuity test, the cleaning unit being capable of effectively removing the foreign matter adhering to the probe needle without abrading the probe needle. A cleaning sheet of the present invention is a cleaning sheet, including a cleaning layer for removing foreign matter adhering to a probe needle of a probe card for a continuity test, in which the cleaning layer has an arithmetic average roughness Ra in conformity with JIS-B-0601 of 100 nm or less.

摘要翻译： 提供一种用于除去附着在用于连续性试验的探针卡的探针上的异物的清洁单元，该清洁单元能够有效地除去附着在探针上的异物而不会磨损探针。 本发明的清洁片是清洁片，其具有用于除去附着在用于连续性试验的探针卡的探针上的异物的清洁层，其中清洁层的算术平均粗糙度Ra符合JIS- B-0601为100nm以下。

公开(公告)号：US08304341B2

公开(公告)日：2012-11-06

申请号：US12983821

申请日：2011-01-03

申请人： Takeshi Matsumura ,  Masaki Mizutani ,  Sadahito Misumi

发明人： Takeshi Matsumura ,  Masaki Mizutani ,  Sadahito Misumi

IPC分类号： H01L21/4763

CPC分类号： H01L21/6836 ,  C09J7/20 ,  C09J2201/36 ,  C09J2201/606 ,  C09J2201/61 ,  C09J2203/326 ,  C09J2205/31 ,  C09J2433/00 ,  H01L24/27 ,  H01L24/83 ,  H01L2221/68327 ,  H01L2224/274 ,  H01L2224/2919 ,  H01L2224/8385 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01016 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01061 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/09701 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/3512

摘要： The invention relates to a dicing die-bonding film having a pressure-sensitive adhesive layer (2) on a substrate material (1) and a die-bonding adhesive layer (3) on the pressure-sensitive adhesive layer (2), wherein the adhesion of the pressure-sensitive adhesive layer (2) to the die-bonding adhesive layer (3), as determined under the conditions of a peel angle of 15° and a peel point moving rate of 2.5 mm/sec. at 23° C., is different between a region (2a) corresponding to a work attachment region (3a) and a region (2b) corresponding to a part or the whole of the other region (3b), in the die-bonding adhesive layer (3), and satisfies the following relationship: adhesion of the pressure-sensitive adhesive layer (2a)

摘要翻译： 本发明涉及一种在基材（1）上具有压敏粘合剂层（2）和压敏粘合剂层（2）上的芯片粘合层（3）的切割芯片接合膜，其中 在剥离角度为15°，剥离移动速度为2.5mm / sec的条件下测定粘合剂层（2）与芯片粘接层（3）的粘合性。 在相对于工件附着区域（3a）的区域（2a）和与其他区域（3b）的一部分或全部对应的区域（2b）在23℃下不同，在芯片接合粘合剂 层（3），并且满足以下关系：粘合剂层（2a）的粘合性<粘合剂层（2b）的粘合性和粘合剂层（2a）对粘合剂层 芯片粘合层（3）不高于2.3N / 25mm。