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61.
公开(公告)号:US20140289574A1
公开(公告)日:2014-09-25
申请号:US14353401
申请日:2012-10-19
Applicant: RAMBUS INC.
Inventor: Ely Tsern , Frederick A. Ware , Suresh Rajan , Thomas Vogelsang
IPC: G11C29/24
CPC classification number: G06F11/1008 , G11C5/04 , G11C29/24 , G11C29/50016 , G11C2029/4402 , G11C2211/4061
Abstract: A method of operation in an integrated circuit (IC) memory device is disclosed. The method includes refreshing a first group of storage rows in the IC memory device at a first refresh rate. A retention time for each of the rows is tested. The testing for a given row under test includes refreshing at a second refresh rate that is slower than the first refresh rate. The testing is interruptible based on an access request for data stored in the given row under test.
Abstract translation: 公开了一种在集成电路(IC)存储器件中的操作方法。 该方法包括以第一刷新率刷新IC存储设备中的第一组存储行。 测试每行的保留时间。 对被测试给定行的测试包括以比第一刷新率慢的第二刷新率刷新。 测试可以基于存储在给定行中的数据的访问请求而中断。
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公开(公告)号:US12111723B2
公开(公告)日:2024-10-08
申请号:US18233250
申请日:2023-08-11
Applicant: Rambus Inc.
Inventor: Frederick A. Ware , Ely Tsern
IPC: G06F11/00 , G06F11/10 , G06F11/16 , G11C7/10 , G11C29/00 , G11C29/42 , G11C29/44 , G11C29/52 , H03M13/15 , G06F11/20
CPC classification number: G06F11/1044 , G06F11/1048 , G06F11/1068 , G06F11/1666 , G11C7/10 , G11C29/42 , G11C29/4401 , G11C29/52 , G11C29/70 , H03M13/1575 , G06F11/20 , G11C2029/4402 , G11C29/765
Abstract: A memory module is disclosed that includes a substrate, a memory device that outputs read data, and a buffer. The buffer has a primary interface for transferring the read data to a memory controller and a secondary interface coupled to the memory device to receive the read data. The buffer includes error logic to identify an error in the received read data and to identify a storage cell location in the memory device associated with the error. Repair logic maps a replacement storage element as a substitute storage element for the storage cell location associated with the error.
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63.
公开(公告)号:US20240104036A1
公开(公告)日:2024-03-28
申请号:US18482268
申请日:2023-10-06
Applicant: Rambus Inc
Inventor: Frederick A. Ware , Ely Tsern , John Eric Linstadt , Thomas J. Giovannini , Kenneth L. Wright
CPC classification number: G06F13/287 , G06F13/16 , G11C5/04 , G11C7/10 , G11C7/1045 , G06F2213/28
Abstract: The embodiments described herein describe technologies of dynamic random access memory (DRAM) components for high-performance, high-capacity registered memory modules, such as registered dual in-line memory modules (RDIMMs). One DRAM component may include a set of memory cells and steering logic. The steering logic may include a first data interface and a second data interface. The first and second data interfaces are selectively coupled to a controller component in a first mode and the first data interface is selectively coupled to the controller component in a second mode and the second data interface is selectively coupled to a second DRAM component in the second mode.
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公开(公告)号:US20240020249A1
公开(公告)日:2024-01-18
申请号:US18365696
申请日:2023-08-04
Applicant: Rambus Inc.
Inventor: Frederick A. Ware , Ely Tsern , John Eric Linstadt , Thomas J. Giovannini , Craig E. Hampel , Scott C. Best , John Yan
IPC: G06F13/16
CPC classification number: G06F13/1678 , G06F13/1673 , G06F13/1694
Abstract: Described are motherboards with memory-module sockets that accept legacy memory modules for backward compatibility or accept a greater number of configurable modules in support of increased memory capacity. The configurable modules can be backward compatible with legacy motherboards. Equipped with the configurable modules, the motherboards support memory systems with high signaling rates and capacities.
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公开(公告)号:US20230307026A1
公开(公告)日:2023-09-28
申请号:US18094908
申请日:2023-01-09
Applicant: Rambus Inc.
Inventor: Frederick A. Ware , Ely Tsern , John Eric Linstadt
CPC classification number: G11C11/005 , G06F3/0619 , G06F3/0659 , G06F3/0673 , G06F11/1004 , G06F11/1076 , G11C5/04 , G11C5/063 , G11C7/1057 , G11C7/1078 , G11C7/12
Abstract: Memory controllers, devices, modules, systems and associated methods are disclosed. In one embodiment, a memory module includes a pin interface for coupling to a memory controller via a bus. The module includes at least two non-volatile memory devices, and a buffer disposed between the pin interface and the at least two non-volatile memory devices. The buffer receives non-volatile memory access commands from the memory controller that are interleaved with DRAM memory module access commands.
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公开(公告)号:US11556433B2
公开(公告)日:2023-01-17
申请号:US17321053
申请日:2021-05-14
Applicant: Rambus Inc.
Inventor: Frederick A. Ware , J. James Tringali , Ely Tsern
Abstract: The embodiments described herein describe technologies for non-volatile memory persistence in a multi-tiered memory system including two or more memory technologies for volatile memory and non-volatile memory.
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67.
公开(公告)号:US11341070B2
公开(公告)日:2022-05-24
申请号:US17100560
申请日:2020-11-20
Applicant: Rambus Inc.
Inventor: Frederick A. Ware , Ely Tsern , John Eric Linstadt , Thomas J. Giovannini , Kenneth L. Wright
Abstract: The embodiments described herein describe technologies of dynamic random access memory (DRAM) components for high-performance, high-capacity registered memory modules, such as registered dual in-line memory modules (RDIMMs). One DRAM component may include a set of memory cells and steering logic. The steering logic may include a first data interface and a second data interface. The first and second data interfaces are selectively coupled to a controller component in a first mode and the first data interface is selectively coupled to the controller component in a second mode and the second data interface is selectively coupled to a second DRAM component in the second mode.
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68.
公开(公告)号:US20210173800A1
公开(公告)日:2021-06-10
申请号:US17100560
申请日:2020-11-20
Applicant: Rambus Inc.
Inventor: Frederick A. Ware , Ely Tsern , John Eric Linstadt , Thomas J. Giovannini , Kenneth L. Wright
Abstract: The embodiments described herein describe technologies of dynamic random access memory (DRAM) components for high-performance, high-capacity registered memory modules, such as registered dual in-line memory modules (RDIMMs). One DRAM component may include a set of memory cells and steering logic. The steering logic may include a first data interface and a second data interface. The first and second data interfaces are selectively coupled to a controller component in a first mode and the first data interface is selectively coupled to the controller component in a second mode and the second data interface is selectively coupled to a second DRAM component in the second mode.
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公开(公告)号:US11010263B2
公开(公告)日:2021-05-18
申请号:US16254920
申请日:2019-01-23
Applicant: Rambus Inc.
Inventor: Frederick A. Ware , J. James Tringali , Ely Tsern
Abstract: The embodiments described herein describe technologies for non-volatile memory persistence in a multi-tiered memory system including two or more memory technologies for volatile memory and non-volatile memory.
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公开(公告)号:US20200168288A1
公开(公告)日:2020-05-28
申请号:US16690743
申请日:2019-11-21
Applicant: Rambus Inc.
Inventor: Ely Tsern , Frederick A Ware , Suresh Rajan , Thomas Vogelsang
Abstract: A method of operation in an integrated circuit (IC) memory device is disclosed. The method includes refreshing a first group of storage rows in the IC memory device at a first refresh rate. A retention time for each of the rows is tested. The testing for a given row under test includes refreshing at a second refresh rate that is slower than the first refresh rate. The testing is interruptible based on an access request for data stored in the given row under test.
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