公开(公告)号：US07152957B2

公开(公告)日：2006-12-26

申请号：US10731118

申请日：2003-12-10

申请人： Toshihiro Mori

发明人： Toshihiro Mori

IPC分类号： B41J2/14 ,  B41J2/16

CPC分类号： B41J2/14024 ,  B41J2/14072 ,  B41J2/17513 ,  B41J2/1752 ,  B41J2/1753 ,  B41J2/17553

摘要： The invention is intended to suppress failures of connected portions between electrode pads and bumps. A liquid ejection head comprises a recording device board including an energy generating device disposed thereon to generate energy for ejecting a liquid through an ejection orifice, and an electrode pad which is disposed in a recess formed in the recording device board and is electrically communicated with the energy generating device. The liquid ejection head further comprises an electrode lead for supplying power to the electrode pad externally of the recording device board, a bump for connecting the electrode pad and the electrode lead to establish electrical communication therebetween, and a sealing resin material filled in the recess to surround an electrically connected portion between the electrode pad and the bump without covering the bump.

摘要翻译： 本发明旨在抑制电极焊盘和凸块之间的连接部分的故障。 液体喷射头包括记录装置板，其包括设置在其上以产生用于通过喷射口喷射液体的能量的能量产生装置，以及电极焊盘，其设置在形成在记录装置板中的凹部中并与 能量发生装置。 液体喷射头还包括用于向记录装置板外部的电极焊盘供电的电极引线，用于连接电极焊盘和电极引线之间的电极引线的凸块，以及填充在凹部中的密封树脂材料 围绕电极焊盘和凸块之间的电连接部分而不覆盖凸块。

公开(公告)号：US20060239869A1

公开(公告)日：2006-10-26

申请号：US11473072

申请日：2006-06-23

申请人： Kazuyoshi Irie ,  Toshihiro Mori ,  Hisao Yokoyama ,  Takayuki Tomiyama ,  Toshihide Takano ,  Shin Tamata ,  Shuichi Kanno

发明人： Kazuyoshi Irie ,  Toshihiro Mori ,  Hisao Yokoyama ,  Takayuki Tomiyama ,  Toshihide Takano ,  Shin Tamata ,  Shuichi Kanno

IPC分类号： B01J8/04 ,  B01J10/00

CPC分类号： B01J4/002 ,  B01D53/8659 ,  B01D53/8662 ,  B01J8/0221 ,  B01J8/025 ,  B01J8/0278 ,  B01J8/0285 ,  B01J19/26 ,  B01J2208/00061 ,  B01J2208/00203 ,  B01J2208/00362 ,  B01J2208/00407 ,  B01J2208/00415 ,  B01J2208/00495 ,  B01J2208/0053 ,  B01J2208/00814 ,  B01J2208/0084 ,  B01J2208/00884 ,  B01J2219/00006 ,  Y02C20/30

摘要： An exhaust gas containing a perfluoride component (PFC) and SiIF4 is conducted into a silicon remover and brought into contact with water. A reaction water supplied from a water supplying piping and air supplied from an air supplying piping are mixed with the exhaust gas exhausted from the silicon remover. The exhaust gas containing water, air, and CF4 is heated at 700° C. by a heater. The exhaust gas containing PFC is conducted to a catalyst layer filled with an alumina group catalyst. The PFC is decomposed to HF and CO2 at a high temperature exhausted from the catalyst layer is cooled in a cooling apparatus. Subsequently, the exhaust gas is conducted to an acidic gas removing apparatus to remove HF. In this way, the silicon component is removed from the exhaust gas before introducing the exhaust gas into the catalyst layer. Therefore, the surface of the catalyst can be utilized effectively, and the decomposition reaction of the perfluoride compound can be improved.

摘要翻译： 将含有全氟化物成分（PFC）和SiIF 4 N的废气导入硅去除剂中并与水接触。 从供水管道供应的反应水和从供气管道供应的空气与从硅去除器排出的废气混合。 含有水，空气和CF 4 N的废气通过加热器在700℃下加热。 含有PFC的废气被传导到填充有氧化铝基催化剂的催化剂层。 在从催化剂层排出的高温下，将PFC分解成HF，在冷却装置中冷却CO 2。 随后，将废气导入酸性气体去除装置中去除HF。 以这种方式，在将废气引入催化剂层之前，从排气中除去硅组分。 因此，可有效利用催化剂的表面，可以提高全氟化合物的分解反应。

公开(公告)号：US20060139410A1

公开(公告)日：2006-06-29

申请号：US11358203

申请日：2006-02-22

申请人： Shogo Kawamura ,  Toshihiro Mori ,  Hisashi Fukai ,  Naoki Nakajo

发明人： Shogo Kawamura ,  Toshihiro Mori ,  Hisashi Fukai ,  Naoki Nakajo

IPC分类号： B41J2/05

CPC分类号： H05K3/361 ,  B41J2/14024 ,  B41J2/14072 ,  H05K3/328 ,  H05K2201/0367 ,  H05K2201/0397 ,  H05K2201/10977

摘要： A liquid discharge recording head includes a recording element with a discharge port for discharging liquid and an electrically connecting portion arranged adjacent to the discharge port and receiving an electric signal for controlling the discharge of the discharge port. The liquid discharge recording head further includes a flexible wiring substrate for covering at least a portion of the recording element. The flexible wiring substrate includes each of a device hole for exposing the discharge port and a bonding hole arranged facing the electrically connecting portion independently. The liquid discharge recording head further includes a sealing agent for covering at least a portion of the electrically connecting portion and filled to at least a portion of the bonding hole. Thus, a liquid discharge recording head that enhances recording performance and that has superior productivity while maintaining reliability of the recording performance is provided.

公开(公告)号：US06841419B2

公开(公告)日：2005-01-11

申请号：US10240673

申请日：2001-03-30

申请人： Masanori Akita ,  Toshihiro Mori ,  Koji Ito

发明人： Masanori Akita ,  Toshihiro Mori ,  Koji Ito

IPC分类号： G06K19/077 ,  H01L29/06 ,  H01L21/48

CPC分类号： G06K19/07745 ,  H01L29/0657 ,  H01L2924/10158 ,  H01L2924/14 ,  H01L2924/15151 ,  H01L2924/15153 ,  H01L2924/15157 ,  H01L2924/15165 ,  H01L2924/1579

摘要： A method of manufacturing a COF package comprises the steps of providing a resin film substrate with a hole for receiving a chip, providing an IC chip having electrodes, inserting the IC chip into the hole so as to fix it with its electrodes exposed above the substrate surface, and forming a circuit pattern on the substrate surface for connection with the electrodes. The hole and the IC chip are tapered, and the IC chip is secured in the hole with sealant or adhesive.

摘要翻译： 一种制造COF封装的方法包括以下步骤：提供具有用于接收芯片的孔的树脂膜基板，提供具有电极的IC芯片，将IC芯片插入孔中，以将它的电极固定在基板上方 并且在衬底表面上形成用于与电极连接的电路图案。 孔和IC芯片是锥形的，IC芯片用密封剂或粘合剂固定在孔中。

公开(公告)号：US06629755B2

公开(公告)日：2003-10-07

申请号：US10138585

申请日：2002-05-06

申请人： Riichi Saito ,  Toshihiro Mori ,  Naruyuki Nojo ,  Shogo Kawamura

发明人： Riichi Saito ,  Toshihiro Mori ,  Naruyuki Nojo ,  Shogo Kawamura

IPC分类号： B41J205

CPC分类号： B41J2/1603 ,  B41J2/14072 ,  B41J2/1623 ,  B41J2/1629 ,  B41J2/1631

摘要： To suitably electrically interconnect a recording element substrate, on which power supply paths are formed in a high density, and an electric wiring substrate, on which wiring lines for supplying power to these paths are formed, bumps are formed and arranged on the recording element substrate at a predetermined pitch therebetween so as to protrude by a predetermined distance t1 from this substrate. On the electric wiring substrate, on the other hand, connecting terminals are formed and arranged with the same pitch as that of the bumps. Between each two of the bumps is formed an insulating film which protrudes in the protrusion direction of the bumps by a predetermined distance t2, where t1

摘要翻译： 为了适当地电连接以高密度形成电源路径的记录元件基板和形成有用于向这些路径供电的布线的电布线基板，形成并布置在记录元件基板上 以它们之间的预定间距从该衬底突出预定距离t1。 另一方面，在电布线基板上，以与凸点相同的间距形成并配置连接端子。 在两个凸块之间形成绝缘膜，该绝缘膜在凸块的突出方向上突出预定距离t2，其中t1

公开(公告)号：US06410415B1

公开(公告)日：2002-06-25

申请号：US09724019

申请日：2000-11-28

申请人： Richard H. Estes ,  James E. Clayton ,  Koji Ito ,  Masanori Akita ,  Toshihiro Mori ,  Minoru Wada

发明人： Richard H. Estes ,  James E. Clayton ,  Koji Ito ,  Masanori Akita ,  Toshihiro Mori ,  Minoru Wada

IPC分类号： H01L2144

CPC分类号： H01L24/13 ,  H01L21/563 ,  H01L23/4985 ,  H01L24/16 ,  H01L24/29 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/1319 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73104 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/81801 ,  H01L2224/83192 ,  H01L2224/83856 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01084 ,  H01L2924/01094 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/00 ,  H01L2224/05599

摘要： The invention provides processes for bonding a flip chip to a substrate in a manner that maximizes reliability of the bonding operation. Electrically conductive polymer bumps are formed on bond pads of a flip chip and the flip chip polymer bumps are at least partially hardened. Electrically conductive polymer bumps are formed on bond pads of a substrate, and a layer of electrically insulating adhesive paste is then applied on the substrate, covering the substrate polymer bumps with the adhesive. The bond pads of the flip chip are then aligned with the bond pads of the substrate and the at least partially hardened flip chip polymer bumps are then pushed through the substrate adhesive and at least partially into the substrate polymer bumps. In a further method, electrically conductive polymer bumps are formed on bond pads of a flip chip and the flip chip polymer bumps are at least partially hardened. A layer of electrically insulating adhesive paste is formed on a substrate having bond pads, covering the bond pads with the adhesive. The bond pads of the flip chip are aligned with the bond pads of the substrate, and then the at least partially hardened flip chip polymer bumps are pushed through the substrate adhesive with pressure sufficient for the flip chip polymer bumps to directly contact and deform the substrate bond pads.

摘要翻译： 本发明提供了使倒装芯片以最大限度地提高接合操作的可靠性的方式与基板结合的工艺。 导电聚合物凸块形成在倒装芯片的接合焊盘上，并且倒装芯片聚合物凸块至少部分硬化。 导电性聚合物凸块形成在基板的接合焊盘上，然后将一层电绝缘粘合剂浆料涂覆在基板上，用粘合剂覆盖基板聚合物凸块。 然后将倒装芯片的接合焊盘与衬底的接合焊盘对准，然后将至少部分硬化的倒装芯片聚合物凸块推入衬底粘合剂并且至少部分地推入衬底聚合物凸块中。 在另一种方法中，导电聚合物凸块形成在倒装芯片的接合焊盘上，并且倒装芯片聚合物凸块至少部分硬化。 在具有接合焊盘的基板上形成电绝缘粘合剂糊层，用粘合剂覆盖接合焊盘。 倒装芯片的接合焊盘与衬底的接合焊盘对准，然后将至少部分硬化的倒装芯片聚合物凸块按压足以使倒装芯片聚合物凸块直接接触和变形衬底的衬底粘合剂 接合垫

公开(公告)号：US06274194B1

公开(公告)日：2001-08-14

申请号：US09230985

申请日：1999-02-03

申请人： Toshihiro Mori ,  Hideki Iba

发明人： Toshihiro Mori ,  Hideki Iba

IPC分类号： B22F102

CPC分类号： B22F9/082 ,  B22F1/0088 ,  B22F2009/0864 ,  B22F2999/00 ,  C01B3/0031 ,  C22C1/04 ,  H01M4/383 ,  Y02E60/327 ,  Y02P20/129 ,  Y10S420/90 ,  C01B17/45

摘要： The present invention relates to a surface treatment for hydrogen-absorbing alloy. More particularly, the present invention relates to a surface treatment for hydrogen-absorbing alloy by which the poisoning resistance of a surface of alloy powder with respect to oxide film, water or absorbing gas can be enhanced so that activation treatment can be easily conducted on alloy powder. In the method, the poisoning resistance is enhanced by forming a protective film, which contains at least one of sulfide and fluoride, on the surface of hydrogen-absorbing alloy powder in an atmosphere containing SF6 gas when hydrogen-absorbing alloy is crushed or hydrogen-absorbing alloy is in a state of powder or when hydrogen-absorbing alloy is made into powder by rapidly cooling and solidifying. Further, the above method includes: a process in which hydrogen-absorbing alloy is accommodated in a container and crushing of hydrogenation is conducted on the alloy in an atmosphere of hydrogen; a process of dehydrogenation in which gases are withdrawn from the container; and a process in which heat treatment is conducted in the container, wherein the atmosphere in the container contains SF6 gas.

摘要翻译： 本发明涉及吸氢合金的表面处理。 更具体地说，本发明涉及一种吸氢合金的表面处理方法，其中可以提高合金粉末表面相对于氧化膜，水或吸收气体的耐中毒性，从而可以容易地对合金进行活化处理 粉末。 在该方法中，当吸氢合金粉碎时，在含有SF 6气体的气氛中，在吸氢合金粉末的表面上形成含有硫化物和氟化物中的至少一种的保护膜，从而提高耐中毒性， 吸收合金处于粉末状态，或者当通过快速冷却和固化将吸氢合金制成粉末时。 此外，上述方法包括：在氢气氛中将合金吸收在容器中并进行氢化破碎的方法， 脱气过程，其中气体从容器中取出; 以及在容器中进行热处理的方法，其中容器中的气氛含有SF 6气体。

公开(公告)号：US6113220A

公开(公告)日：2000-09-05

申请号：US931931

申请日：1997-09-17

申请人： Hiroyuki Ishinaga ,  Asao Saito ,  Toshihiro Mori

发明人： Hiroyuki Ishinaga ,  Asao Saito ,  Toshihiro Mori

IPC分类号： B41J2/05 ,  B41J2/14 ,  B41J2/16

CPC分类号： B41J2/1646 ,  B41J2/14072 ,  B41J2/14129 ,  B41J2/1604 ,  B41J2/1628 ,  B41J2/1629 ,  B41J2/1631 ,  B41J2/1642 ,  B41J2002/14379 ,  B41J2202/13

摘要： A recording head is equipped with a plurality of liquid discharge portions, each having a discharge opening for discharging ink, and a substrate. The substrate is provided with a plurality of electrothermal transducers for generating thermal energy to be utilized for discharging the ink supplied to the liquid discharging portions and a plurality of functional devices connected electrically to the electrothermal transducers. The plurality of functional devices are arranged in a direction diagonal relative to an arrangement direction of the plurality of electrothermal transducers within a region provided with a wiring portion and have different characteristic curves of saturated voltage versus temperature corresponding to the distance from the electrothermal transducers. The region includes common electrode wiring and selective electrode wiring for the plurality of electrothermal transducers and the plurality of functional devices. The plurality of electrothermal transducers are connected to the common electrode wiring. The wiring portion is formed essentially at a layer lower than the layer where the electrothermal transducers are formed.

摘要翻译： 记录头配备有多个液体排出部，每个液体排出部具有用于排出墨的排出口和基板。 基板设置有多个电热换能器，用于产生用于排放供应到液体排出部分的墨水的热能和与电热换能器电连接的多个功能装置。 所述多个功能器件相对于设置有布线部分的区域中的多个电热换能器的排列方向在相对方向上布置，并且具有与来自电热换能器的距离相对应的饱和电压对温度的不同特性曲线。 该区域包括用于多个电热换能器和多个功能器件的公共电极布线和选择电极布线。 多个电热换能器连接到公共电极布线。 布线部分基本上形成在低于形成电热换能器的层的层上。

公开(公告)号：US6056391A

公开(公告)日：2000-05-02

申请号：US411890

申请日：1995-03-28

申请人： Masami Kasamoto ,  Toshihiro Mori

发明人： Masami Kasamoto ,  Toshihiro Mori

IPC分类号： B41J2/14 ,  B41J2/16 ,  B41J2/05

CPC分类号： B41J2/1646 ,  B41J2/14129 ,  B41J2/1604 ,  B41J2/1623 ,  B41J2/1628 ,  B41J2/1642 ,  B41J2202/03

摘要： A substrate for an ink jet head comprises a base member and an electrothermal converting body formed on the base member, the electrothermal converting body including a resistor layer and a pair of electrode layers connected to the resistor layer wherein the resistor layer positioned between a pair of the electrode layers serves as a heat generating portion for generating thermal energy utilized for discharging ink; wherein one of a pair of the electrode layers passes under the heat generating portion; an electrode layer positioned under the heat generating portion has a multi-layer structure composed of a plurality of layers; and at least one of a plurality of the layers, being nearest to the heat generating portion, is made of a metal having a melting point of 1500.degree. C. or more at 1 atm. An ink jet head using this substrate is able to prolong service life while reducing a failure ratio, and to continue preferable ink discharge for a long period of time.

摘要翻译： 一种用于喷墨头的基​​片包括形成在基底构件上的基底构件和电热转换体，该电热转换体包括一个电阻层和连接到该电阻层的一对电极层，其中该电阻层位于一对 电极层用作用于产生用于排出墨的热能的发热部分; 其中一对电极层中的一个在发热部分的下方通过; 位于发热部下方的电极层具有由多层构成的多层结构， 并且最靠近发热部分的多个层中的至少一个由1atm的熔点为1500℃以上的金属制成。 使用该基板的喷墨头能够延长使用寿命，同时降低故障率，并且持续优选的墨水排出长时间。

公开(公告)号：US5954880A

公开(公告)日：1999-09-21

申请号：US808220

申请日：1997-02-28

申请人： Akio Aoki ,  Yukio Sato ,  Shin Niizeki ,  Takao Hashimoto ,  Katsuhiro Nojima ,  Toshihiro Mori ,  Koji Ando ,  Atsuhisa Yakawa

发明人： Akio Aoki ,  Yukio Sato ,  Shin Niizeki ,  Takao Hashimoto ,  Katsuhiro Nojima ,  Toshihiro Mori ,  Koji Ando ,  Atsuhisa Yakawa

IPC分类号： C23C2/00 ,  F16C13/02 ,  F16C23/08 ,  F16C35/077 ,  B05C3/00

CPC分类号： C23C2/003 ,  F16C13/02 ,  F16C23/084 ,  F16C35/077

摘要： In a roller support device, an inner peripheral surface of a bearing box is covered with a material having a poor wettability with respect to a molten metal, such as tantalum, graphite, C/C composite, silicon carbide or the like. The molten metal does not adhere to the covered portion, or even if the molten metal adheres to and is solidified on the covered portion, the molten metal can be peeled off with a light force. Therefore, after a support roller is pulled up from the molten metal, the molten metal does not prevent a rolling bearing from shifting in the axial direction thereof so that the roller support device can prevent an excessive force from being applied to the rolling bearing when the support roller, after it is thermally expanded once, is contracted as the temperature falls.

摘要翻译： 在辊支撑装置中，轴承箱的内周面用相对于诸如钽，石墨，C / C复合材料，碳化硅等的熔融金属具有差的润湿性的材料覆盖。 熔融金属不粘附到被覆盖部分，或者即使熔融金属粘附并被覆盖部分固化，也可以用轻的力量将熔融金属剥离。 因此，在从熔融金属拉出支撑辊之后，熔融金属不会阻止滚动轴承在其轴向上移动，使得当支撑辊在轴向方向上移动时，辊支撑装置可以防止过大的力施加到滚动轴承上， 支撑辊在热膨胀一次后，随温度下降而收缩。