公开(公告)号：US06921913B2

公开(公告)日：2005-07-26

申请号：US10379033

申请日：2003-03-04

Applicant: Yee-Chia Yeo ,  Chun-Chieh Lin ,  Wen-Chin Lee ,  Chenming Hu

Inventor： Yee-Chia Yeo ,  Chun-Chieh Lin ,  Wen-Chin Lee ,  Chenming Hu

IPC: H01L21/20 ,  H01L21/28 ,  H01L21/336 ,  H01L29/51 ,  H01L29/78 ,  H01L29/06

CPC classification number: H01L21/28194 ,  H01L21/28202 ,  H01L21/28211 ,  H01L29/165 ,  H01L29/51 ,  H01L29/517 ,  H01L29/518 ,  H01L29/66628 ,  H01L29/66636 ,  H01L29/7834 ,  H01L29/7842 ,  H01L29/7848

Abstract: A strained-channel transistor structure with lattice-mismatched zone and fabrication method thereof. The transistor structure includes a substrate having a strained channel region, comprising a first semiconductor material with a first natural lattice constant, in a surface, a gate dielectric layer overlying the strained channel region, a gate electrode overlying the gate dielectric layer, and a source region and drain region oppositely adjacent to the strained channel region, with one or both of the source region and drain region comprising a lattice-mismatched zone comprising a second semiconductor material with a second natural lattice constant different from the first natural lattice constant.

Abstract translation: 具有晶格失配区的应变通道晶体管结构及其制造方法。 晶体管结构包括具有应变沟道区的衬底，包括表面上具有第一自然晶格常数的第一半导体材料，覆盖在应变沟道区上的栅极电介质层，覆盖栅极电介质层的栅电极和源极 区域和漏极区域相邻地邻近应变通道区域，其中源区域和漏极区域中的一个或两个包括晶格失配区域，其包含具有不同于第一自然晶格常数的第二自然晶格常数的第二半导体材料。

公开(公告)号：US20050079677A1

公开(公告)日：2005-04-14

申请号：US10683901

申请日：2003-10-10

Applicant: Chung-Hu Ke ,  Wen-Chin Lee ,  Yee-Chia Yeo ,  Chih-Hsin Ko ,  Chenming Hu

Inventor： Chung-Hu Ke ,  Wen-Chin Lee ,  Yee-Chia Yeo ,  Chih-Hsin Ko ,  Chenming Hu

IPC: H01L21/336 ,  H01L21/76 ,  H01L21/762 ,  H01L21/8238 ,  H01L27/092 ,  H01L29/10 ,  H01L29/76 ,  H01L29/78 ,  H01L29/80

CPC classification number: H01L29/7846 ,  H01L21/823807 ,  H01L21/823878 ,  H01L29/1033 ,  H01L29/78 ,  H01L29/7842

Abstract: A high performance semiconductor device and the method for making same is disclosed with an improved drive current. The semiconductor device has source and drain regions built on an active region, a length of the device being different than a width thereof. One or more isolation regions are fabricated surrounding the active region, the isolation regions are then filled with an predetermined isolation material whose volume shrinkage exceeds 0.5% after an anneal process. A gate electrode is formed over the active region, and one or more dielectric spacers are made next to the gate electrode. Then, a contact etch stopper layer is put over the device, wherein the isolation regions, spacers and contact etch layer contribute to modulating a net strain imposed on the active region so as to improve the drive current.

公开(公告)号：US20050045949A1

公开(公告)日：2005-03-03

申请号：US10650445

申请日：2003-08-28

Applicant: Chun-Chieh Lin ,  Wen-Chin Lee ,  Yee-Chia Yeo ,  Chenming Hu

Inventor： Chun-Chieh Lin ,  Wen-Chin Lee ,  Yee-Chia Yeo ,  Chenming Hu

IPC: H01L21/336 ,  H01L21/84 ,  H01L27/01 ,  H01L29/45 ,  H01L29/68 ,  H01L29/786

CPC classification number: H01L29/66772 ,  H01L29/458 ,  H01L29/66636 ,  H01L29/78618 ,  H01L29/78654

Abstract: A semiconductor device (100), including a dielectric pedestal (220) located above and integral to a substrate (110) and having first sidewalls (230), a channel region (210) located above the dielectric pedestal (220) and having second sidewalls (240), and source and drain regions (410) opposing the channel region (210) and each substantially spanning one of the second sidewalls (240). An integrated circuit (800) incorporating the semiconductor device (100) is also disclosed, as well as a method of manufacturing the semiconductor device (100).

Abstract translation: 一种半导体器件（100），包括位于衬底（110）上方并与衬底（110）成一体并具有第一侧壁（230）的电介质基座（220），位于电介质基座（220）上方的通道区域（210） （240），以及与沟道区（210）相对并且每个基本跨越第二侧壁（240）中的一个的源极和漏极区（410）。 还公开了结合半导体器件（100）的集成电路（800），以及制造半导体器件（100）的方法。

公开(公告)号：US20050035470A1

公开(公告)日：2005-02-17

申请号：US10639170

申请日：2003-08-12

Applicant: Chih-Hsin Ko ,  Yee-Chia Yeo ,  Wen-Chin Lee ,  Chenming Hu

Inventor： Chih-Hsin Ko ,  Yee-Chia Yeo ,  Wen-Chin Lee ,  Chenming Hu

IPC: H01L21/8238 ,  H01L27/088

CPC classification number: H01L29/7843 ,  H01L21/823807 ,  H01L21/823814 ,  H01L21/823864 ,  H01L29/66636 ,  H01L29/7848

Abstract: A transistor includes a gate dielectric overlying a channel region. A source region and a drain region are located on opposing sides of the channel region. The channel region is formed from a first semiconductor material and the source and drain regions are formed from a second semiconductor material. A gate electrode overlies the gate dielectric. A pair of spacers is formed on sidewalls of the gate electrode. Each of the spacers includes a void adjacent the channel region. A high-stress film can overlie the gate electrode and spacers.

Abstract translation: 晶体管包括覆盖沟道区的栅极电介质。 源极区域和漏极区域位于沟道区域的相对侧上。 沟道区由第一半导体材料形成，源极和漏极区由第二半导体材料形成。 栅极电极覆盖栅极电介质。 在栅电极的侧壁上形成一对间隔物。 每个间隔件包括邻近通道区域的空隙。 高应力膜可以覆盖栅电极和间隔物。

公开(公告)号：US20050035426A1

公开(公告)日：2005-02-17

申请号：US10687377

申请日：2003-10-16

Applicant: Chih-Hsin Ko ,  Yee-Chia Yeo ,  Chung-Hu Ge ,  Wen-Chin Lee

Inventor： Chih-Hsin Ko ,  Yee-Chia Yeo ,  Chung-Hu Ge ,  Wen-Chin Lee

IPC: H01L21/28 ,  H01L21/306 ,  H01L21/76 ,  H01L21/762 ,  H01L21/8234 ,  H01L29/78 ,  H01L29/00 ,  H01L21/8238

CPC classification number: H01L21/28123 ,  H01L21/76232 ,  H01L21/823481 ,  H01L29/7833

Abstract: A semiconductor isolation trench includes a substrate and a trench formed therein. The trench is lined with a nitrogen-containing liner and filled with a dielectric material. The nitrogen-containing liner preferably contacts the active region of a device, such as a transistor, located adjacent to the trench.

公开(公告)号：US20050032321A1

公开(公告)日：2005-02-10

申请号：US10637351

申请日：2003-08-08

Applicant: Chien-Chao Huang ,  Chung-Hu Ge ,  Wen-Chin Lee ,  Chenming Hu ,  Carlos Diaz ,  Fu-Liang Yang

Inventor： Chien-Chao Huang ,  Chung-Hu Ge ,  Wen-Chin Lee ,  Chenming Hu ,  Carlos Diaz ,  Fu-Liang Yang

IPC: H01L21/336 ,  H01L21/8238 ,  H01L29/78

CPC classification number: H01L29/6659 ,  H01L21/823807 ,  H01L21/823814 ,  H01L21/823828 ,  H01L29/665 ,  H01L29/6656 ,  H01L29/7833 ,  H01L29/7842 ,  H01L29/7843

Abstract: A structure to improve carrier mobility of a MOS device in an integrated circuit. The structure comprises a semiconductor substrate, containing a source region and a drain region; a conductive gate overlying a gate dielectric layer on the semiconductor substrate; a conformal stress film covering the source region, the drain region, and the conductive gate. In addition, the structure may comprise a semiconductor substrate, containing a source region and a drain region; a conductive gate overlying a gate dielectric layer on the semiconductor substrate; a plurality of stress films covering the source region, the drain region, and the conductive gate. Moreover, the structure may comprise a semiconductor substrate, containing a source region and a drain region; a conductive gate overlying a gate dielectric layer on the semiconductor substrate; a spacer disposed adjacent to the conductive gate, the spacer having a width less than 550 angstroms; a stress film covering the source region, the drain region, the conductive gate, and the spacer.

Abstract translation: 一种提高集成电路中MOS器件的载流子迁移率的结构。 该结构包括含有源区和漏区的半导体衬底; 覆盖半导体衬底上的栅极电介质层的导电栅极; 覆盖源极区域，漏极区域和导电栅极的共形应力膜。 此外，该结构可以包括含有源极区和漏极区的半导体衬底; 覆盖半导体衬底上的栅极电介质层的导电栅极; 覆盖源极区域，漏极区域和导电栅极的多个应力膜。 此外，该结构可以包括含有源极区和漏极区的半导体衬底; 覆盖半导体衬底上的栅极电介质层的导电栅极; 间隔件设置成与导电栅极相邻，间隔物具有小于550埃的宽度; 覆盖源极区域，漏极区域，导电栅极和间隔物的应力膜。

公开(公告)号：US20050023576A1

公开(公告)日：2005-02-03

申请号：US10657616

申请日：2003-09-08

Applicant: Wen-Chin Lee ,  Chung-Hu Ge ,  Chenming Hu

Inventor： Wen-Chin Lee ,  Chung-Hu Ge ,  Chenming Hu

IPC: H01L21/20 ,  H01L21/336 ,  H01L21/762 ,  H01L21/8234 ,  H01L29/10 ,  H01L29/76 ,  H01L31/062 ,  H01L31/119

CPC classification number: H01L21/02381 ,  H01L21/02447 ,  H01L21/0245 ,  H01L21/02529 ,  H01L21/02532 ,  H01L21/0262 ,  H01L21/02639 ,  H01L21/76232 ,  H01L21/823412 ,  H01L29/1054 ,  H01L29/66651

Abstract: A semiconductor structure including a highly strained selective epitaxial top layer suitable for use in fabricating a strained channel transistor. The top layer is deposited on the uppermost of a series of one or more lower layers. The lattice of each layer is mismatched with the lattice of its subjacent layer by an amount not less than the lattice mismatch between the lowest layer of the series and a substrate on which it resides. A trench is formed in the uppermost series layer. The trench has rounded corners so that a dielectric material filling the trench conforms to the round corners. The rounded corners are produced by heating the uppermost series layer after trench formation.

Abstract translation: 包括适用于制造应变通道晶体管的高应变选择性外延顶层的半导体结构。 顶层沉积在一系列一个或多个下层的最上面。 每个层的晶格与其下层的晶格不匹配，其量不小于该系列的最低层与其所在的衬底之间的晶格失配。 沟槽形成在最上层的层中。 沟槽具有圆角，使得填充沟槽的电介质材料符合圆角。 通过在沟槽形成之后加热最上面的串联层来产生圆角。

公开(公告)号：US08569837B2

公开(公告)日：2013-10-29

申请号：US11800615

申请日：2007-05-07

Applicant: Chih-Hsin Ko ,  Hung-Wei Chen ,  Chung-Hu Ke ,  Ta-Ming Kuan ,  Wen-Chin Lee

Inventor： Chih-Hsin Ko ,  Hung-Wei Chen ,  Chung-Hu Ke ,  Ta-Ming Kuan ,  Wen-Chin Lee

IPC: H01L29/417 ,  H01L27/092 ,  H01L29/78

CPC classification number: H01L21/823814 ,  H01L21/823807 ,  H01L29/165 ,  H01L29/665 ,  H01L29/6656 ,  H01L29/6659 ,  H01L29/66636 ,  H01L29/7848

Abstract: A semiconductor structure includes a semiconductor substrate; a gate dielectric over the semiconductor substrate; a gate electrode over the gate dielectric; a deep source/drain region adjacent the gate electrode; a silicide region over the deep source/drain region; and an elevated metallized source/drain region between the silicide region and the gate electrode. The elevated metallized source/drain region adjoins the silicide region.

Abstract translation: 半导体结构包括半导体衬底; 半导体衬底上的栅极电介质; 位于栅极电介质上的栅电极; 与栅电极相邻的深源/漏区; 深源/漏区上的硅化物区; 以及在硅化物区域和栅电极之间的升高的金属化源极/漏极区域。 升高的金属化源极/漏极区域邻接硅化物区域。

公开(公告)号：US08546176B2

公开(公告)日：2013-10-01

申请号：US12765407

申请日：2010-04-22

Applicant: Wen-Chin Lee ,  Wen-Tsai Yen ,  Ding-Yuan Chen ,  Liang-Sheng Yu ,  Yu-Han Chang

Inventor： Wen-Chin Lee ,  Wen-Tsai Yen ,  Ding-Yuan Chen ,  Liang-Sheng Yu ,  Yu-Han Chang

IPC: H01L21/00

CPC classification number: C23C14/3464 ,  C23C14/0623 ,  H01L31/0322 ,  Y02E10/541 ,  Y02P70/521

Abstract: Sulfur-containing chalcogenide absorbers in thin film solar cell are manufactured by sequential sputtering or co-sputtering targets, one of which contains a sulfur compound, onto a substrate and then annealing the substrate. The anneal is performed in a non-sulfur containing environment and avoids the use of hazardous hydrogen sulfide gas. A sulfurized chalcogenide is formed having a sulfur concentration gradient.

Abstract translation: 在薄膜太阳能电池中的含硫硫属元素化物吸收剂通过在衬底上顺序溅射或共溅射靶（其中一个含有硫化合物）然后对衬底进行退火来制造。 退火在不含硫的环境中进行，避免使用危险的硫化氢气体。 形成具有硫浓度梯度的硫化硫族化物。

公开(公告)号：US08466505B2

公开(公告)日：2013-06-18

申请号：US11077479

申请日：2005-03-10

Applicant: Li-Shyue Lai ,  Hung-Wei Chen ,  Wen-Chin Lee ,  Min-Hwa Chi

Inventor： Li-Shyue Lai ,  Hung-Wei Chen ,  Wen-Chin Lee ,  Min-Hwa Chi

IPC: H01L29/788

CPC classification number: H01L21/28273 ,  H01L29/66825 ,  H01L29/7391 ,  H01L29/8616

Abstract: A semiconductor device and a method of forming the same. The semiconductor device comprises a gate structure comprising a tunnel oxide over a substrate; a floating gate over the tunnel oxide; a dielectric over the floating gate; and a control gate over the dielectric. The semiconductor device further comprises: spacers along opposite edges of the gate structure; a first impurity region doped with a first type of dopant laterally spaced apart from a first edge of the gate structure; and a second impurity region doped with a second type of dopant, opposite from the first type, the drain being substantially under the drain spacer and substantially aligned with a second edge of the gate structure.

Abstract translation: 一种半导体器件及其制造方法。 半导体器件包括栅极结构，其包括在衬底上的隧道氧化物; 隧道氧化物上的浮动栅; 在浮动栅极上的电介质; 以及电介质上的控制栅极。 半导体器件还包括：沿着栅极结构的相对边缘的间隔物; 掺杂有与栅极结构的第一边缘横向间隔开的第一类型掺杂物的第一杂质区; 以及掺杂有与第一类型相反的第二类型掺杂剂的第二杂质区，漏极基本上在漏极间隔下方并且基本上与栅极结构的第二边缘对准。