公开(公告)号：US20090134895A1

公开(公告)日：2009-05-28

申请号：US12259785

申请日：2008-10-28

申请人： Charles A. Miller

发明人： Charles A. Miller

IPC分类号： G01R31/02 ,  H01R43/00 ,  G01R1/067

CPC分类号： G01R31/2889 ,  G01R1/07314 ,  G01R1/07378 ,  G01R31/31905 ,  Y10T29/49117

摘要： A probe system for providing signal paths between an integrated circuit (IC) tester and input/output, power and ground pads on the surfaces of ICs to be tested includes a probe board assembly, a flex cable and a set of probes arranged to contact the IC's I/O pads. The probe board assembly includes one or more rigid substrate layers with traces and vias formed on or within the substrate layers providing relatively low bandwidth signal paths linking the tester to probes accessing some of the IC's pads. The flex cable provides relatively high bandwidth signal paths linking the tester to probes accessing others of the IC's pads.

摘要翻译： 用于在集成电路（IC）测试器和要测试的IC的表面上的输入/输出，电源和接地焊盘之间提供信号路径的探针系统包括探针板组件，柔性电缆和一组探针， IC的I / O焊盘。 探针板组件包括一个或多个刚性衬底层，其具有形成在衬底层上或衬底层内的迹线和通孔，其提供将测试器连接到访问IC的一些衬垫的探针的相对低带宽的信号路径。 柔性电缆提供相对高带宽的信号路径，将测试仪连接到访问IC其他焊盘的探针。

公开(公告)号：US20090108861A1

公开(公告)日：2009-04-30

申请号：US12345740

申请日：2008-12-30

申请人： Eric D. Hobbs ,  Andrew W. McFarland

发明人： Eric D. Hobbs ,  Andrew W. McFarland

IPC分类号： G01R31/02 ,  G01R31/28

CPC分类号： G01R1/07378

摘要： A stiffener assembly for use with testing devices is provided herein. In some embodiments, a stiffener for use with testing devices includes an inner member; an outer member disposed in a predominantly spaced apart relation to the inner member; and a plurality of alignment mechanisms for orienting the inner and outer members with respect to each other, wherein the alignment mechanisms transfer forces applied to a lower surface of the inner member to the outer member and provide the predominant conductive heat transfer passageway between the inner and outer members.

摘要翻译： 本文提供了一种与测试装置一起使用的加强装置。 在一些实施例中，用于与测试装置一起使用的加强件包括内部构件; 与所述内部构件以主要间隔开的关系设置的外部构件; 以及用于使内部和外部构件相对于彼此定向的多个对准机构，其中对准机构将施加到内部构件的下表面的力传递到外部构件，并且在内部构件和内部构件之间提供主要的导电传热通道 外部成员。

公开(公告)号：US20090051378A1

公开(公告)日：2009-02-26

申请号：US12259791

申请日：2008-10-28

申请人： Gaetan L. Mathieu

发明人： Gaetan L. Mathieu

IPC分类号： G01R1/067

CPC分类号： G06F11/30 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y40/00 ,  B33Y70/00 ,  G01R1/07378 ,  G01R3/00 ,  G01R31/2889 ,  H01L2224/48091 ,  H01L2224/48464 ,  H01L2924/00014

摘要： A probe card assembly, according to some embodiments of the invention, can comprise a tester interface configured to make electrical connections with a test controller, a plurality of electrically conductive probes disposed to contact terminals of an electronic device to be tested, and a plurality of electrically conductive data paths connecting the tester interface and the probes. At least one of the data paths can comprise an air bridge structure trace comprising an electrically conductive trace spaced away from an electrically conductive plate by a plurality of pylons.

摘要翻译： 根据本发明的一些实施例的探针卡组件可以包括测试器接口，其被配置为与测试控制器进行电连接，多个导电探针被设置成接触要测试的电子设备的端子，以及多个 连接测试仪接口和探头的导电数据路径。 数据路径中的至少一个可以包括空气桥结构迹线，其包括通过多个塔架与导电板间隔开的导电迹线。

公开(公告)号：US07471078B2

公开(公告)日：2008-12-30

申请号：US11617929

申请日：2006-12-29

申请人： Eric D. Hobbs ,  Andrew W. McFarland

发明人： Eric D. Hobbs ,  Andrew W. McFarland

IPC分类号： G01R31/28 ,  G01R31/02

CPC分类号： G01R1/07378

摘要： A stiffener assembly for use with testing devices is provided herein. In some embodiments, a stiffener for use with testing devices includes an inner member; an outer member disposed in a predominantly spaced apart relation to the inner member; and a plurality of alignment mechanisms for orienting the inner and outer members with respect to each other, wherein the alignment mechanisms transfer forces applied to a lower surface of the inner member to the outer member and provide the predominant conductive heat transfer passageway between the inner and outer members.

摘要翻译： 本文提供了一种与测试装置一起使用的加强装置。 在一些实施例中，用于与测试装置一起使用的加强件包括内部构件; 与所述内部构件以主要间隔开的关系设置的外部构件; 以及用于使内部和外部构件相对于彼此定向的多个对准机构，其中对准机构将施加到内部构件的下表面的力传递到外部构件，并且在内部构件和内部构件之间提供主要的导电传热通道 外部成员。

公开(公告)号：US07463043B2

公开(公告)日：2008-12-09

申请号：US11748988

申请日：2007-05-15

申请人： Timothy E. Cooper ,  Benjamin N. Eldridge ,  Igor Y. Khandros ,  Rod Martens ,  Gaetan L. Mathieu

发明人： Timothy E. Cooper ,  Benjamin N. Eldridge ,  Igor Y. Khandros ,  Rod Martens ,  Gaetan L. Mathieu

IPC分类号： G01R31/02

CPC分类号： G01R31/2886 ,  G01R31/2887

摘要： An electronic device is moved into a first position such that terminals of the electronic device are adjacent probes for making electrical contact with the terminals. The electronic device is then moved horizontally or diagonally such that the terminals contact the probes. Test data are then communicated to and from the electronic device through the probes.

摘要翻译： 电子设备移动到第一位置，使得电子设备的端子是与端子电接触的相邻探头。 然后电子设备水平或对角地移动，使得端子接触探针。 然后通过探头将测试数据传送到电子设备和从电子设备传送。

公开(公告)号：US20080186040A1

公开(公告)日：2008-08-07

申请号：US11864690

申请日：2007-09-28

申请人： Eric D. Hobbs ,  Andrew W. McFarland

发明人： Eric D. Hobbs ,  Andrew W. McFarland

IPC分类号： G01R31/26 ,  G01R1/02

CPC分类号： G01R31/2863 ,  G01R31/2889 ,  G01R31/31905

摘要： Methods and apparatus for testing semiconductor devices are provided herein. In some embodiments, an assembly for testing semiconductor devices can include a probe card assembly; and a thermal barrier disposed proximate an upper surface of the probe card assembly, the thermal barrier can restrict thermal transfer between tester side boundary conditions and portions of the probe card assembly disposed beneath the thermal barrier.

摘要翻译： 本文提供了测试半导体器件的方法和装置。 在一些实施例中，用于测试半导体器件的组件可以包括探针卡组件; 以及设置在探针卡组件的上表面附近的热障，热障可以限制测试仪侧边界条件与布置在热障下方的探针卡组件的部分之间的热传递。

公开(公告)号：US20080143358A1

公开(公告)日：2008-06-19

申请号：US11610925

申请日：2006-12-14

申请人： Keith J. Breinlinger

发明人： Keith J. Breinlinger

IPC分类号： G01R1/067 ,  G01R31/02 ,  H01R43/00

CPC分类号： G01R1/18 ,  G01R1/07342 ,  G01R3/00 ,  H05K1/0219 ,  H05K3/4644 ,  H05K2201/0715 ,  H05K2201/09236 ,  H05K2201/09618 ,  Y10T29/49204

摘要： A method of fabricating a guard structure can include depositing an insulating material over at least a portion of electrical signal conductors disposed on a component of a probe card assembly, and depositing an electrically conductive material onto the insulating material and at least a portion of electrical guard conductors disposed on the component of the probe card assembly. Each signal conductor can be disposed between a pair of the guard conductors. The probe card assembly can include a plurality of probes disposed to contact an electronic device to be tested. The signal conductors can be part of electrical paths within the probe card assembly to the probes.

摘要翻译： 制造防护结构的方法可以包括在布置在探针卡组件的部件上的电信号导体的至少一部分上沉积绝缘材料，以及将导电材料沉积到绝缘材料上以及至少一部分电保护 布置在探针卡组件的部件上的导体。 每个信号导体可以设置在一对保护导体之间。 探针卡组件可以包括多个探针，其布置成接触要测试的电子设备。 信号导体可以是探针卡组件内的探针的电气路径的一部分。

公开(公告)号：US07385411B2

公开(公告)日：2008-06-10

申请号：US10930272

申请日：2004-08-31

申请人： Benjamin N. Eldridge

发明人： Benjamin N. Eldridge

IPC分类号： G01R31/02

CPC分类号： G01R1/07364 ,  G01R1/07378 ,  G01R3/00 ,  Y10T29/49117

摘要： A probe card apparatus is configured to have a desired overall amount of compliance. The compliance of the probes of the probe card apparatus is determined, and an additional, predetermined amount of compliance is designed into the probe card apparatus so that the sum of the additional compliance and the compliance of the probes total the overall desired compliance of the probe card apparatus.

摘要翻译： 探针卡装置被配置为具有期望的总体顺应性。 确定探针卡装置的探针的符合性，并且将另外的预定量的顺应性设计到探针卡装置中，使得附加顺应性和探针的顺应性的总和达到探针的总体期望顺应性 卡装置。

公开(公告)号：US20080120833A1

公开(公告)日：2008-05-29

申请号：US12026466

申请日：2008-02-05

申请人： Gaetan L. Mathieu ,  Benjamin N. Eldridge

发明人： Gaetan L. Mathieu ,  Benjamin N. Eldridge

IPC分类号： H01R43/16 ,  H05K3/10

CPC分类号： H01L21/4853 ,  G01R1/06711 ,  G01R1/06727 ,  G01R1/06761 ,  G01R3/00 ,  H01L24/71 ,  H01L2224/11 ,  H01L2224/11002 ,  H01L2224/11003 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/13155 ,  H01L2224/13171 ,  H01L2224/136 ,  H01L2224/16 ,  H01L2924/0001 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01072 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15787 ,  H01L2924/3011 ,  H01R12/57 ,  H01R12/718 ,  H01R13/03 ,  H05K3/326 ,  H05K3/4092 ,  H05K2201/0311 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49204 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： An interconnection element and a-method of forming an interconnection element. In one embodiment, the interconnection element includes a first structure and a second structure coupled to the first structure. The second structure coupled with the first material has a spring constant greater than the spring constant of the first structure alone. In one embodiment, the interconnection element is adapted to be coupled to an electronic component tracked as a conductive path from the electronic component. In one embodiment, the method includes forming a first (interconnection) structure coupled to a substrate to define a shape suitable as an interconnection in an integrated circuit environment and then coupling, such as by coating, a second (interconnection) structure to the first (interconnection) structure to form an interconnection element. Collectively, the first (interconnection) structure and the second (interconnection) structure have a spring constant greater than a spring constant of the first (interconnection) structure.

摘要翻译： 一种形成互连元件的互连元件和方法。 在一个实施例中，互连元件包括耦合到第一结构的第一结构和第二结构。 与第一材料耦合的第二结构具有大于单独的第一结构的弹簧常数的弹簧常数。 在一个实施例中，互连元件适于耦合到从电子部件跟踪为导电路径的电子部件。 在一个实施例中，该方法包括形成耦合到衬底的第一（互连）结构以限定适合于集成电路环境中的互连的形状，然后例如通过将第二（互连）结构涂覆到第一（互连） 互连）结构以形成互连元件。 总的来说，第一（互连）结构和第二（互连）结构具有大于第一（互连）结构的弹簧常数的弹簧常数。

公开(公告)号：US07371072B2

公开(公告)日：2008-05-13

申请号：US10750355

申请日：2003-12-29

申请人： Gaetan L. Mathieu ,  Benjamin N. Eldridge ,  Gary W. Grube ,  Richard A. Larder

发明人： Gaetan L. Mathieu ,  Benjamin N. Eldridge ,  Gary W. Grube ,  Richard A. Larder

IPC分类号： H01R12/00

CPC分类号： H01L24/72 ,  G01R1/06727 ,  G01R1/06733 ,  G01R1/06761 ,  G01R1/07342 ,  G01R3/00 ,  H01H1/0036 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01055 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15787 ,  H01L2924/30105 ,  H05K3/326 ,  H05K3/4092 ,  H01L2924/00

摘要： An interconnection element of a spring (body) including a first resilient element with a first contact region and a second contact region and a first securing region and a second resilient element, with a third contact region and a second securing region. The second resilient element is coupled to the first resilient element through respective securing regions and positioned such that upon sufficient displacement of the first contact region toward the second resilient element, the second contact region will contact the third contact region. The interconnection, in one aspect, is of a size suitable for directly contacting a semiconductor device. A large substrate with a plurality of such interconnection elements can be used as a wafer-level contactor. The interconnection element, in another aspect, is of a size suitable for contacting a packaged semiconductor device, such as in an LGA package.

摘要翻译： 包括具有第一接触区域和第二接触区域的第一弹性元件和具有第三接触区域和第二固定区域的第一固定区域和第二弹性元件的弹簧（主体）的互连元件。 第二弹性元件通过相应的固定区域联接到第一弹性元件，并且定位成使得在第一接触区域朝着第二弹性元件充分移位时，第二接触区域将接触第三接触区域。 在一个方面，互连具有适于直接接触半导体器件的尺寸。 可以使用具有多个这种互连元件的大型衬底作为晶片级接触器。 在另一方面，互连元件的尺寸适合于例如LGA封装中的封装半导体器件的接触。