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1.发明授权Method of forming a probe substrate by layering probe row structures and probe substrates formed thereby 有权通过层叠由此形成的探针行结构和探针基底来形成探针基底的方法公开(公告)号：US08513942B1
公开(公告)日：2013-08-20
申请号：US12974152
申请日：2010-12-21
CPC分类号： G01R3/00 , G01R1/07307
摘要： A probe head can comprise a substrate and electrically conductive structures extending from opposite surfaces of the substrate. The probe head can be made by forming frame structures each comprising a frame to which a row of the conductive structures is coupled. The frame structures can be placed in a stack. A compressible shim or a curable adhesive can be provided between adjacent frames in the stack to control a distance between the contact ends of the conductive structures in adjacent rows of the conductive structures. The frames can include cavities that form a mold while the frames are in the stack, and the substrate can be formed by introducing a moldable material into the mold. After the moldable material hardens, the frame can be removed, leaving the conductive structures embedded in the substrate.
摘要翻译： 探头可以包括衬底和从衬底的相对表面延伸的导电结构。 探针头可以通过形成每个包括一排导电结构的框架的框架结构来制造。 框架结构可以放置在堆叠中。 可以在堆叠中的相邻框架之间设置可压缩垫片或可固化粘合剂，以控制导电结构的相邻行中的导电结构的接触端之间的距离。 框架可以包括在框架在堆叠中时形成模具的空腔，并且可以通过将可模制材料引入模具中来形成基板。 在可模塑材料变硬之后，可以移除框架，使导电结构嵌入衬底中。
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2.发明授权Method of wirebonding that utilizes a gas flow within a capillary from which a wire is played out 失效引线接合方法，其利用毛线管内的气流从其播出线公开(公告)号：US08485418B2
公开(公告)日：2013-07-16
申请号：US12942709
申请日：2010-11-09
IPC分类号： B23K31/02
CPC分类号： B23K20/004 , B23K2101/40 , H01L23/13 , H01L23/49811 , H01L23/50 , H01L24/45 , H01L24/48 , H01L24/78 , H01L24/85 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/78301 , H01L2224/85043 , H01L2224/85045 , H01L2224/85099 , H01L2224/85203 , H01L2224/85205 , H01L2224/85207 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01012 , H01L2924/01014 , H01L2924/01015 , H01L2924/01018 , H01L2924/01019 , H01L2924/01023 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01042 , H01L2924/01044 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01074 , H01L2924/01075 , H01L2924/01076 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/07802 , H01L2924/10253 , H01L2924/10329 , H01L2924/12041 , H01L2924/12044 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H01L2924/30105 , H01L2924/30107 , H01L2924/3011 , H01L2924/3025 , H01L2924/00014 , H01L2924/00 , H01L2924/20752 , H01L2924/20753 , H01L2924/20755 , H01L2924/00015 , H01L2924/2075 , H01L2924/20754 , H01L2924/013 , H01L2924/00013
摘要： Contact structures exhibiting resilience or compliance for a variety of electronic components are formed. A variety of materials for the wire stem (which serves as a falsework) and for the overcoat (which serves as a superstructure over the falsework) are disclosed. Various techniques are described for mounting the contact structures to a variety of electronic components (e.g., semiconductor wafers and dies, semiconductor packages, interposers, interconnect substrates, etc.), and various process sequences are described. The resilient contact structures described herein are ideal for making a “temporary” (probe) connections to an electronic component such as a semiconductor die, for burn-in and functional testing.
摘要翻译： 形成表现出各种电子部件的弹性或顺应性的接触结构。 公开了用于线杆（用作脚手架）和外套（用作脚手架上的上部结构）的各种材料。 描述了用于将接触结构安装到各种电子部件（例如，半导体晶片和管芯，半导体封装，插入件，互连衬底等）的各种技术，并且描述了各种工艺顺序。 本文所述的弹性接触结构对于进行诸如半导体管芯的电子部件的“临时”（探针）连接是理想的，用于老化和功能测试。
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公开(公告)号：US08383958B2
公开(公告)日：2013-02-26
申请号：US12783967
申请日：2010-05-20
CPC分类号： G01R3/00 , G01R1/06716 , G01R1/06744 , H01L24/80 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/1461 , Y10T29/49117 , Y10T29/49147 , Y10T156/10 , Y10T428/12347 , Y10T428/12375 , Y10T428/12535 , Y10T428/12542 , Y10T428/12556 , Y10T428/12569 , Y10T428/31681 , H01L2924/00
摘要： A robust mechanical structure is provided to prevent small foundation structures formed on a substrate from detaching from the substrate surface. The strengthened structure is formed by plating a foundation metal layer on a seed layer and then embedding the plated foundation structure in an adhesive polymer material, such as epoxy. Components, such as spring probes, can then be constructed on the plated foundation. The adhesive polymer material better assures the adhesion of the metal foundation structure to the substrate surface by counteracting forces applied to an element, such as a spring probe, attached to the plated foundation.
摘要翻译： 提供坚固的机械结构以防止形成在基板上的小基础结构从基板表面分离。 强化结构通过在种子层上电镀基础金属层，然后将镀覆的基础结构嵌入诸如环氧树脂的粘合剂聚合物材料中而形成。 然后可以在镀覆的基础上构造诸如弹簧探针的组件。 粘合剂聚合物材料通过抵抗附着在镀覆基底上的诸如弹簧探针的元件的抵抗力，更好地保证金属基础结构与基底表面的粘附。
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4.发明授权Carbon nanotube columns and methods of making and using carbon nanotube columns as probes 有权碳纳米管柱及其制备和使用碳纳米管柱作为探针的方法公开(公告)号：US08354855B2
公开(公告)日：2013-01-15
申请号：US12632428
申请日：2009-12-07
CPC分类号： B82Y40/00 , B82Y10/00 , B82Y30/00 , C01B32/16 , C01B2202/08 , G01R1/06755 , G01R3/00 , Y10T29/49117
摘要： Carbon nanotube columns each comprising carbon nanotubes can be utilized as electrically conductive contact probes. The columns can be grown, and parameters of a process for growing the columns can be varied while the columns grow to vary mechanical characteristics of the columns along the growth length of the columns. Metal can then be deposited inside and/or on the outside of the columns, which can enhance the electrical conductivity of the columns. The metalized columns can be coupled to terminals of a wiring substrate. Contact tips can be formed at or attached to ends of the columns. The wiring substrate can be combined with other electronic components to form an electrical apparatus in which the carbon nanotube columns can function as contact probes.
摘要翻译： 每个包含碳纳米管的碳纳米管柱可用作导电接触探针。 柱可以生长，并且用于生长柱的方法的参数可以变化，同时柱生长以改变柱沿着生长长度的机械特性。 然后可以将金属沉积在柱的内部和/或外部，这可以增强柱的导电性。 金属化柱可以连接到布线基板的端子。 接触尖端可以形成在柱或端附近。 布线基板可以与其他电子部件组合以形成其中碳纳米管柱可用作接触探针的电气设备。
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公开(公告)号：US07897435B2
公开(公告)日：2011-03-01
申请号：US11420403
申请日：2006-05-25
IPC分类号： H01L21/00
CPC分类号： B81C1/00214 , B81B7/04 , B81C3/002 , B81C2203/051 , G01R1/06711 , G01R1/06744 , G01R1/07314 , G01R1/07342 , G01R3/00 , H01L23/49827 , H01L2924/0002 , H01L2924/15174 , Y10T29/49004 , Y10T29/49126 , Y10T29/4913 , Y10T29/49147 , Y10T29/49151 , Y10T29/49204 , H01L2924/00
摘要： Methods of fabricating an array of aligned microstructures on a substrate are disclosed. The microstructures may be spring contacts or other microelements. The methods disclosed include construction of an alignment substrate, alignment of die elements with the alignment substrate, and fixation of the aligned die elements to a backing substrate.
摘要翻译： 公开了在衬底上制造排列的微结构阵列的方法。 微结构可以是弹簧触点或其他微量元件。 所公开的方法包括对准基板的构造，模具元件与对准基板的对准以及将对准的模具元件固定到背衬基板上。
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公开(公告)号：US07868632B2
公开(公告)日：2011-01-11
申请号：US11697603
申请日：2007-04-06
IPC分类号： G01R31/02
CPC分类号： G01R31/2887 , G01R1/06705 , G01R31/2886
摘要： An electronic device is moved into a first position with respect to probes for making electrical contact with the device. The electronic device is then moved into a second position in which the electronic device is pressed against the probes, compressing the probes. The movement into the second position includes two components. One component of the movement tends to press the electronic device against the probes, compressing the probes and inducing a stress in the probes. The second movement tends to reduce that stress. Test data are then communicated to and from the electronic device through the probes.
摘要翻译： 电子设备相对于用于与设备电接触的探针移动到第一位置。 然后将电子设备移动到第二位置，其中电子设备被压靠在探针上，压缩探针。 进入第二位置的运动包括两个部件。 移动的一个组件倾向于将电子装置压靠在探针上，压缩探针并在探针中引起应力。 第二动作往往会减轻压力。 然后通过探头将测试数据传送到电子设备和从电子设备传送。
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公开(公告)号：US20100224303A1
公开(公告)日：2010-09-09
申请号：US12783967
申请日：2010-05-20
IPC分类号： B29C65/52
CPC分类号： G01R3/00 , G01R1/06716 , G01R1/06744 , H01L24/80 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/1461 , Y10T29/49117 , Y10T29/49147 , Y10T156/10 , Y10T428/12347 , Y10T428/12375 , Y10T428/12535 , Y10T428/12542 , Y10T428/12556 , Y10T428/12569 , Y10T428/31681 , H01L2924/00
摘要： A robust mechanical structure is provided to prevent small foundation structures formed on a substrate from detaching from the substrate surface. The strengthened structure is formed by plating a foundation metal layer on a seed layer and then embedding the plated foundation structure in an adhesive polymer material, such as epoxy. Components, such as spring probes, can then be constructed on the plated foundation. The adhesive polymer material better assures the adhesion of the metal foundation structure to the substrate surface by counteracting forces applied to an element, such as a spring probe, attached to the plated foundation.
摘要翻译： 提供坚固的机械结构以防止形成在基板上的小基础结构从基板表面分离。 强化结构通过在种子层上电镀基础金属层，然后将镀覆的基础结构嵌入诸如环氧树脂的粘合剂聚合物材料中而形成。 然后可以在镀覆的基础上构造诸如弹簧探针的组件。 粘合剂聚合物材料通过抵抗附着在镀覆基底上的诸如弹簧探针的元件的抵抗力，更好地保证金属基础结构与基底表面的粘附。
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公开(公告)号：US07731503B2
公开(公告)日：2010-06-08
申请号：US11466039
申请日：2006-08-21
IPC分类号： H01R12/00
CPC分类号： G01R1/06755 , H01R13/03 , Y10T29/49204
摘要： A carbon nanotube contact structure can be used for making pressure connections to a DUT. The contact structure can be formed using a carbon nanotube film or with carbon nanotubes in solution. The carbon nanotube film can be grown in a trench in a sacrificial substrate in which a contact structure such as a beam or contact element is then formed by metal plating. The film can also be formed on a contact element and have metal posts dispersed therein to provide rigidity and elasticity. Contact structures or portions thereof can also be plated with a solution containing carbon nanotubes. The resulting contact structure can be tough, and can provide good electrical conductivity.
摘要翻译： 可以使用碳纳米管接触结构来与DUT进行压力连接。 可以使用碳纳米管膜或溶液中的碳纳米管来形成接触结构。 碳纳米管膜可以在牺牲基板中的沟槽中生长，其中通过金属电镀形成诸如光束或接触元件的接触结构。 膜也可以形成在接触元件上，并且金属柱分散在其中以提供刚性和弹性。 接触结构或其部分也可以镀有含有碳纳米管的溶液。 所得到的接触结构可以是韧性的，并且可以提供良好的导电性。
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9.发明申请公开(公告)号：US20100065963A1
公开(公告)日：2010-03-18
申请号：US12500495
申请日：2009-07-09
IPC分类号： H01L23/48
CPC分类号： B23K20/004 , B23K2101/40 , H01L23/13 , H01L23/49811 , H01L23/50 , H01L24/45 , H01L24/48 , H01L24/78 , H01L24/85 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/78301 , H01L2224/85043 , H01L2224/85045 , H01L2224/85099 , H01L2224/85203 , H01L2224/85205 , H01L2224/85207 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01012 , H01L2924/01014 , H01L2924/01015 , H01L2924/01018 , H01L2924/01019 , H01L2924/01023 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01042 , H01L2924/01044 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01074 , H01L2924/01075 , H01L2924/01076 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/07802 , H01L2924/10253 , H01L2924/10329 , H01L2924/12041 , H01L2924/12044 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H01L2924/30105 , H01L2924/30107 , H01L2924/3011 , H01L2924/3025 , H01L2924/00014 , H01L2924/00 , H01L2924/20752 , H01L2924/20753 , H01L2924/20755 , H01L2924/00015 , H01L2924/2075 , H01L2924/20754 , H01L2924/013 , H01L2924/00013
摘要： Contact structures for a variety of electronic components can be formed to have primarily elastic properties. The contact structures can be free standing, and can be coupled to a variety of different electronic components such as a probe card assembly, a semiconductor wafer or dies, an interposer, or the like. Tips of the contact structures can have a topology that facilities contact with another electronic component.
摘要翻译： 可以形成各种电子部件的接触结构以具有主要的弹性特性。 接触结构可以是独立的，并且可以耦合到各种不同的电子部件，例如探针卡组件，半导体晶片或管芯，插入件等。 接触结构的提示可以具有设备与另一电子部件接触的拓扑。
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10.发明授权公开(公告)号：US07659736B2
公开(公告)日：2010-02-09
申请号：US11761912
申请日：2007-06-12
申请人： Benjamin N. Eldridge , Barbara Vasquez , Makarand S. Shinde , Gaetan L. Mathieu , A. Nicholas Sporck
发明人： Benjamin N. Eldridge , Barbara Vasquez , Makarand S. Shinde , Gaetan L. Mathieu , A. Nicholas Sporck
IPC分类号： G01R31/02
CPC分类号： G01R31/2889 , G01R1/0416 , G01R1/07307
摘要： A wafer test assembly includes multiple probe head substrates arranged like tiles with connectors attached to one side and probes supported on the opposing side. In one embodiment, flexible cable connectors directly connect the connectors on the probe head tile to a test head, while in another embodiment the flexible cables connect the probe head tile to a PCB providing horizontal routing to test head connectors. In one embodiment, leveling pins provide a simplified support structure connecting to a retaining element attached to the tiles to provide for applying a push-pull leveling force. A test head connector interface frame enables rearrangement of connectors between the test head and the probe card to provide for both full wafer contact or partial wafer contact. The test head connectors are rearranged by being slidable on rails, or pluggable and unpluggable enabling movement over a range of positions.
摘要翻译： 晶片测试组件包括多个探针头基底，其布置成瓦片，其中连接器连接到一侧，探针支撑在相对侧上。 在一个实施例中，柔性电缆连接器将探头头瓦片上的连接器直接连接到测试头，而在另一个实施例中，柔性电缆将探头头瓦片连接到PCB，从而向测试头连接器提供水平布线。 在一个实施例中，调平销提供连接到附接到瓦片的保持元件以提供施加推挽平整力的简化支撑结构。 测试头连接器接口框架能够重新布置测试头和探针卡之间的连接器，以提供完整的晶片接触或部分晶片接触。 测试头连接器通过在轨道上滑动来重新布置，或者可插拔和可拔出，使得能够在一定范围的位置上移动。
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