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公开(公告)号：US2224055A
公开(公告)日：1940-12-03
申请号：US18466438
申请日：1938-01-12
申请人： LOTT CHARLES I
发明人： LOTT CHARLES I
CPC分类号： B24B27/06 , B23B9/02 , B24B27/0023 , Y10T29/5175
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公开(公告)号：US2015250A
公开(公告)日：1935-09-24
申请号：US63075332
申请日：1932-08-29
申请人： BILLKER FREDRICK W
发明人： BILLKER FREDRICK W
CPC分类号： B23D45/06 , B23D59/006 , B23Q11/0053 , B24B27/06 , B27G19/02 , Y10S29/079 , Y10S29/102 , Y10T83/2085 , Y10T83/2216 , Y10T83/66 , Y10T83/7722 , Y10T83/7734 , Y10T83/858
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公开(公告)号：US20230364730A1
公开(公告)日：2023-11-16
申请号：US18029646
申请日：2021-05-12
申请人： HUNAN BRUNP EV RECYCLING CO., LTD. , GUANGDONG BRUNP RECYCLING TECHNOLOGY CO., LTD. , HUNAN BRUNP RECYCLING TECHNOLOGY CO., LTD.
发明人： Xiaolin JIANG , Changdong LI
CPC分类号： B24B27/02 , B24B27/06 , B24B41/068 , B24B41/005 , H01M10/0404
摘要： The present disclosure discloses a device for cutting connection of multi-piece module electrode which includes a stand, the stand is provided with a workbench and the workbench is connected with a height adjusting device. The device further includes an angle grinding device, the angle grinding device includes a polishing shaft and an angle grinder, the angle grinder is arranged on the polishing shaft, and the angle grinding device is provided with a saw blade. According to the characteristics of the module electrode, the angle grinding device is matched with the workbench to implement simultaneous electrode disconnecting operation of multiple electrodes of the module, so that the device not only has higher efficiency and better cutting effect, but also is suitable for universal saw blades, saves the cost, and is safer.
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公开(公告)号：US20180178410A1
公开(公告)日：2018-06-28
申请号：US15854401
申请日：2017-12-26
CPC分类号： B28D7/04 , B24B27/06 , B24B41/06 , B28D1/24 , H01F1/0577 , H01F41/0253
摘要： A fastening jig for securing a magnet block (M) when the magnet block is cutoff machined into pieces is provided, the jig comprising a lower clamp (31) on which the magnet block is rested, an upper clamp (32) disposed on the magnet block, and a press unit (33) for pressing the clamps to apply a pressing force to the magnet block. A portion of the lower clamp (31) which is disposed adjacent to the magnet block is provided with a generally horizontal channel (311) to define a resilient cantilever (312), whereby the magnet block is held between the clamps by the repulsion force of the cantilever (312).
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公开(公告)号：US20180166355A1
公开(公告)日：2018-06-14
申请号：US15841032
申请日：2017-12-13
申请人： DISCO CORPORATION
发明人： Katsuhiko Suzuki
IPC分类号： H01L23/15 , H01L21/48 , H01L23/498 , H05K1/03 , H05K3/00
CPC分类号： H01L23/15 , B23K26/0622 , B23K26/364 , B23K26/402 , B23K2101/40 , B23K2103/172 , B23K2103/54 , B24B19/02 , B24B27/06 , B24B51/00 , B28D1/24 , H01L21/304 , H01L21/48 , H01L21/486 , H01L21/76 , H01L21/78 , H01L23/00 , H01L23/498 , H01L23/49827 , H01L2224/16225 , H05K1/0306 , H05K3/0029 , H05K3/0094 , H05K2201/10378
摘要： A plurality of interposers are made from a material substrate. The material substrate includes a glass substrate partitioned by a plurality of crossing division lines to define a plurality of separate regions. A multilayer member is provided on a first surface or a second surface opposite to the first surface of the glass substrate and has an insulating layer and a wiring layer. An exposed surface of the multilayer member is cut along each division line by using a first cutting blade to form a cut groove on the exposed surface of the multilayer member, the cut groove having a depth not reaching the glass substrate. The glass substrate is cut along each cut groove by using a second cutting blade having a thickness smaller than the width of each cut groove to thereby divide the glass substrate and manufacture the plural interposers.
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公开(公告)号：US20170343528A1
公开(公告)日：2017-11-30
申请号：US15535567
申请日：2015-10-09
申请人： SUMCO CORPORATION
发明人： Yuuji MINAMIHATA
CPC分类号： G01N33/40 , B24B27/06 , B24B57/02 , B28D5/007 , C09K3/14 , G01N15/06 , G01N21/49 , G01N21/51 , G01N21/85 , G01N21/94 , G01N2015/0053 , H01L21/304 , Y02P70/179
摘要： An evaluation method of abrasive grains used in an ingot-cutting slurry includes: an evaluation solution preparation step in which abrasive grains including polishing grains and impurities are dissolved in a solvent to prepare an evaluation solution; a sedimentation step in which a container containing the evaluation solution is left still to settle the polishing grains; a measurement step in which a turbidity of supernatant of the evaluation solution is measured using the measurement device; and an estimation step in which an amount of the impurities is estimated based on the measurement result of the turbidity of the supernatant.
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公开(公告)号：US20170341170A1
公开(公告)日：2017-11-30
申请号：US15165578
申请日：2016-05-26
IPC分类号： B23D61/02 , H01C17/245 , B24B27/06
CPC分类号： B23D61/025 , B23D45/003 , B23D45/021 , B24B27/06 , H01C7/003 , H01C7/006 , H01C17/245
摘要： A saw blade for dicing a sheet of copper alloy to form individual resistors is disclosed, wherein the sheet of copper alloy has a thickness of less than 0.3 mm. The saw blade includes a ring having a first side, a second side, and a circumferential surface, wherein the thickness of the ring between the first side and the second side is less than 0.6 mm.
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公开(公告)号：US20170301549A1
公开(公告)日：2017-10-19
申请号：US15485987
申请日：2017-04-12
申请人： DISCO CORPORATION
发明人： Katsuhiko Suzuki
IPC分类号： H01L21/304 , H01L21/322 , H01L21/268 , H01L29/32 , H01L29/16
CPC分类号： H01L21/304 , B23K26/402 , B23K26/53 , B23K2103/56 , B24B19/02 , B24B27/06 , B24B37/107 , H01L21/268 , H01L21/3043 , H01L21/322 , H01L21/67092 , H01L21/78 , H01L29/1608 , H01L29/32
摘要： A SiC wafer is processed by a laser beam having a wavelength that transmits SiC to form a peeling plane in a region of the wafer which corresponds to a device area of a first surface of the wafer. A plurality of devices demarcated by a plurality of intersecting projected dicing lines in the device area are formed on the first surface. An annular groove is formed on a second surface of the wafer which is opposite the first surface, in a boundary region of the wafer between the device area and an outer peripheral excessive area surrounding the device area. A portion of the wafer which is positioned radially inwardly of the annular groove is peeled from the peeling plane, thereby thinning the device area and forming an annular stiffener area on a region of the second surface which corresponds to the outer peripheral excessive area.
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公开(公告)号：US09636844B2
公开(公告)日：2017-05-02
申请号：US14333016
申请日：2014-07-16
申请人： DISCO CORPORATION
发明人： Nobuhiko Wakita
CPC分类号： B28D5/02 , B23B31/307 , B24B27/06 , B24B45/00 , B26D7/2621 , B27B5/30 , B27B5/32 , B28D5/0082 , B28D5/022 , Y10T83/647 , Y10T83/9379
摘要： A cutting unit includes a spindle, a spindle housing, a support flange on the front of the spindle, a cutting blade detachably supported to the support flange, and a fixing flange for fixing the cutting blade to the support flange. The support flange includes a boss portion adapted to be inserted through a central opening of the cutting blade, a flange portion for supporting one side surface of the cutting blade, and a cylindrical portion for engaging the front of the spindle. The flange portion has a suction hole opening toward the fixing flange, and the cylindrical portion has a communication hole communicating with the suction hole. The communication hole is connected to a vacuum source through a rotary joint fixed to the spindle housing so that communication between the communication hole and the vacuum source is selectively made by an on-off valve.
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