公开(公告)号：US06189203B1

公开(公告)日：2001-02-20

申请号：US09288750

申请日：1999-04-08

Applicant: Randy T. Heinrich ,  Allen F. Rozman ,  Thang D. Truong ,  William L. Woods, Jr.

Inventor： Randy T. Heinrich ,  Allen F. Rozman ,  Thang D. Truong ,  William L. Woods, Jr.

IPC: H01F4106

CPC classification number: H05K1/165 ,  H05K1/141 ,  H05K3/3415 ,  H05K3/3436 ,  H05K2201/045 ,  H05K2201/086 ,  H05K2201/09063 ,  H05K2201/10234 ,  H05K2201/10257 ,  H05K2201/10666 ,  H05K2203/041 ,  H05K2203/0455 ,  H05K2203/1476 ,  H05K2203/1572 ,  Y02P70/613 ,  Y10T29/4902 ,  Y10T29/49073 ,  Y10T29/49126

Abstract: A surface mountable power supply and a method of manufacturing the power supply. In one embodiment, the power supply includes: (1) a substrate having opposing upper and lower conductive layers (2) a lower electrical component having a first lead mounted on a first pad on the lower conductive layer and subject to forces capable of detaching the lower electrical component from the substrate when the power supply passes through a reflow soldering process, (3) an upper electrical component having a second lead mounted on a second pad on the upper conductive layer, (4) a solder located proximate the first lead, the lower electrical component of a sufficiently low weight such that a surface tension of a liquid state of the solder is sufficient to maintain the lower electrical component in contact with the lower conductive layer as the power supply passes through the reflow soldering process, (5) a planar magnetic device mounted on the substrate, the planar magnetic device having windings formed from a portion of conductive traces on the upper and lower conductive layers and a core disposed through apertures of the substrate and proximate the windings and (6) an inter-substrate conductive mount, coupled to the lower conductive layer, composed of a material having a melting point above a solder reflow temperature and adapted to mount the power supply to an adjacent substrate and provide a conductive path therebetween, the conductive mount including first and second compliant solder joints at interfaces of the substrate and the adjacent substrate, respectively.

Abstract translation: 一种可表面安装的电源和一种制造电源的方法。 在一个实施例中，电源包括：（1）具有相对的上和下导电层（2）的衬底，下电气部件具有安装在下导电层上的第一焊盘上的第一引线，并受到能够分离 当电源通过回流焊接工艺时，从基板上降低电气部件，（3）具有安装在上导电层上的第二焊盘上的第二引线的上部电气部件，（4）位于第一引线附近的焊料， 较低的电气部件具有足够低的重量，使得当电源通过回流焊接工艺时，焊料的液态的表面张力足以保持较低的电气部件与下导电层接触;（5） 安装在基板上的平面磁性装置，该平面磁性装置具有由上和下导电层上的一部分导电迹线形成的绕组 以及通过所述基板的孔径并且靠近所述绕组设置的芯体，以及（6）连接到所述下导电层的衬底间导电安装件，所述衬底由具有高于焊料回流温度的熔点的材料组成，并且适于安装所述功率 供应到相邻基板并在其间提供导电路径，导电安装座分别包括在基板和相邻基板的界面处的第一和第二柔性焊接点。

公开(公告)号：US06092280A

公开(公告)日：2000-07-25

申请号：US318952

申请日：1999-05-26

Applicant: Robert John Wojnarowski

Inventor： Robert John Wojnarowski

IPC: H01L23/12 ,  H01L21/48 ,  H01L23/32 ,  H01L23/485 ,  H01L23/498 ,  H05K3/32 ,  H05K3/34 ,  H05K3/40 ,  H01R43/00 ,  H01L23/40

CPC classification number: H01L24/02 ,  H01L21/4853 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49827 ,  H05K3/3436 ,  H01L2224/0401 ,  H01L2224/16225 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01021 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30107 ,  H01L2924/3511 ,  H05K2201/0373 ,  H05K2201/10257 ,  H05K2201/10378 ,  H05K3/326 ,  H05K3/4092 ,  Y02P70/613 ,  Y10S428/901 ,  Y10T29/49124 ,  Y10T29/4913 ,  Y10T428/24917

Abstract: A flexible film interface includes a flexible film; flexible material attached to a portion of the flexible film; surface metallization on the flexible material, the flexible film having at least one via extending therethrough to the surface metallization; and a floating pad structure including floating pad metallization patterned over the flexible material and the surface metallization, a first portion of the floating pad metallization forming a central pad and a second portion of the floating pad metallization forming at least one extension from the central pad and extending into the at least one via.

Abstract translation: 柔性膜界面包括柔性膜; 柔性材料附着在柔性膜的一部分上; 在柔性材料上的表面金属化，所述柔性膜具有至少一个通过其延伸到表面金属化的通孔; 以及浮动焊盘结构，其包括在所述柔性材料和所述表面金属化之上图案化的浮动焊盘金属化，所述浮动焊盘金属化的第一部分形成中心焊盘，并且所述浮动焊盘金属化的第二部分形成从所述中心焊盘的至少一个延伸部， 延伸到所述至少一个通孔中。

公开(公告)号：US6046410A

公开(公告)日：2000-04-04

申请号：US139049

申请日：1998-08-24

Applicant: Robert John Wojnarowski ,  Barry Scott Whitmore ,  Bernard Gorowitz

Inventor： Robert John Wojnarowski ,  Barry Scott Whitmore ,  Bernard Gorowitz

IPC: H01L21/48 ,  H01L23/485 ,  H01L23/498 ,  H05K3/32 ,  H05K3/34 ,  H05K3/40 ,  H01R9/09

CPC classification number: H01L24/02 ,  H01L21/4853 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49827 ,  H05K3/3436 ,  H01L2224/0401 ,  H01L2224/16 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30107 ,  H01L2924/3511 ,  H05K2201/0373 ,  H05K2201/10257 ,  H05K2201/10378 ,  H05K3/326 ,  H05K3/4092 ,  Y02P70/613 ,  Y10S438/94 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/4913

Abstract: An interface includes a surface having an electrically conductive pad; a compliant coating over the surface having a via extending to the pad; metallization patterned over the compliant coating and extending into the via; a low modulus dielectric interface layer overlying the compliant coating and having an interface via extending to the metallization; and a floating pad structure including floating pad metallization patterned over the dielectric interface layer with a first portion forming a central pad and a second portion forming an extension from the central pad extending into the interface via. Another interface includes a substrate including a low modulus dielectric interface material having a hole extending at least partially therethrough and a floating contact structure including electrically conductive material coating the hole with at least some of the floating pad metallization forming an extension from the hole. A conductive contact area interface may include an electrically conductive first contact area; an electrically conductive second contact area facing and being substantially aligned with the first contact area; and at least one interface structure coupled between the first and second contact areas and including an electrical conductor having a partially open interior to form a compliant joint between the first and second contact areas.

Abstract translation: 界面包括具有导电垫的表面; 表面上的柔顺涂层具有延伸到垫的通孔; 金属化图案化在柔性涂层上并延伸到通孔中; 覆盖顺应性涂层并具有延伸到金属化的界面的低模量介电界面层; 以及浮动衬垫结构，其包括在电介质界面层上图案化的浮动衬垫金属化，第一部分形成中心焊盘，第二部分形成从延伸到接口通孔的中心焊盘的延伸部分。 另一个界面包括一个衬底，该衬底包括一个具有至少部分贯穿其中延伸的孔的低模量介电界面材料，以及一个浮动接触结构，其包括导电材料，该导电材料涂覆孔，浮动金属化中的至少一些从孔形成延伸。 导电接触区界面可以包括导电的第一接触区域; 面向并基本上与第一接触区域对准的导电的第二接触区域; 以及耦合在所述第一和第二接触区域之间的至少一个接口结构，并且包括具有部分敞开的内部的电导体，以在所述第一和第二接触区域之间形成柔性接头。