Abstract:
The output of a Radio Frequency (RF) Power Amplifier (PA) is sampled and down-converted, and the amplitude envelope of the baseband feedback signal is extracted. This is compared to the envelope of a transmission signal, and the envelope tracking modulation of the RF PA supply voltage VCC is adaptively pre-distorted to achieve a constant ISO-Gain (and phase) in the RF PA. In particular, a nonlinear function is interpolated from a finite number gain values calculated from the feedback and transmission signals. This nonlinear function is then used to pre-distort the transmission signal envelope, resulting in a constant gain at the RF PA over a wide range of supply voltage VCC values. Since the gains are calculated from a feedback signal, the pre-distortion may be recalculated at event triggers, such as an RF frequency change. Furthermore, the method improves nonlinearity in the entire transmitter chain, not just the RF PA.
Abstract:
An area efficient distributed device for integrated voltage regulators comprising at least one filler cell coupled between a pair of PADS on I/O rail of a chip and at least one additional filler cell having small size portion of said device is coupled to said I/O rails for distributing portions of said device on the periphery of said chip. The device is coupled as small size portion on the lower portion of said second filler cell for distributing said device on the periphery of said chip and providing maximal area utilization.
Abstract translation:一种用于集成电压调节器的区域有效的分布式装置,其包括耦合在芯片的I / O轨上的一对PADS与至少一个具有所述装置的小尺寸部分的附加填充单元之间的填充单元耦合到所述I / O 用于在所述芯片的周围分配所述设备的部分的轨道。 该装置作为小尺寸部分耦合在所述第二填充单元的下部,用于将所述装置分布在所述芯片的外围并提供最大的面积利用率。
Abstract:
The invention concerns a circuit comprising: a first transistor (202) having a first main current node coupled to a first voltage signal (CNVDD), a control node coupled to a second voltage signal (CPVDD) and a second main current node coupled to an output node (206) of the circuit; a second transistor (204) having a first main current node coupled to a third voltage signal (CNGND), a control node coupled to a fourth voltage signal (CPGND) and a second main current node coupled to said output node of the circuit; and circuitry (210, 212) adapted to generate said first, second, third and fourth voltage signals based on a pair of differential input signals (CP, CN), wherein said first and second voltage signals are both referenced to a first supply voltage (VDD) and wherein said third and fourth voltage signals are both referenced to a second supply voltage (GND).
Abstract:
A circuit generates a compensation signal that can remove noise in a VCO introduced by a supply signal (i.e., supply-side noise). The circuit includes two transistors connected in series. A resistor is connected between the gate of the first transistor and the supply signal, and a capacitor is connected between the gate of the second transistor and the supply signal. The circuit is designed so that the transconductance of one transistor is greater than or equal to twice the transconductance of a second transistor. The compensation signal is supplied through a capacitor, which compensates for capacitors in a VCO, to an internal supply node of the VCO. At the internal supply node, the compensation signal removes (or greatly reduces) the noise introduced by the supply signal noise, resulting in a less-noisy output signal from the VCO.
Abstract:
A power consumption management system for a central processing unit may include a power consumption estimation block and an activity control block. The power consumption estimation block may be configured to estimate power consumption of the central processing unit based on information related to a status of the central processing unit. The activity control block may be configured to use the estimated power consumption to determine a control to be applied to the central processing unit for regulating a rate of change in power consumption of the central processing unit.
Abstract:
A memory management system for managing a memory and includes a multi-stage memory management unit including control circuitry and cache memory. The cache memory may have a respective translation look-aside buffer for each stage of the multi-stage memory management unit. The control circuitry may be configured to generate a blank data request including a virtual address and information that specifies that data is not to be read from the memory, perform address translations based on the generated blank data request in multiple stages until a physical address is obtained, and discard the blank data request.
Abstract:
A circuit having a centralized PT compensation circuit to provide compensation signals to localized I/O blocks on the chip. Process variations and temperature variations tend to be approximately uniform across an integrated circuit chip. Thus, a single, centralized PT compensation circuit may be used instead of one PT compensation circuit per I/O section as with solutions of the past. Further, the PT compensation circuit may generate a digital code indicative of the effects of process and temperature. Further yet, each section of I/O block may have a local voltage compensation circuit to compensate the voltage variation of the I/O block. The voltage compensation circuit utilizes an independent reference voltage. The reference voltage is generated by the PT compensation circuit, which is placed centrally in the IC chip and hence any need to repeat the reference generation for each I/O block is eliminated.
Abstract:
A multi level charge pump circuit may be associated with at least two power supplies, and may provide at least four levels of positive and negative voltage. The multi level charge pump may include first and second fly capacitors, and first and second tank capacitors. A plurality of PMOS transistors and NMOS transistors may allow generation of two high voltage levels and two low voltage levels for the multi level charge pump, the low voltage levels being derived from a charging of the two fly capacitors in series. This multi level charge pump may be embodied in an audio device within a platform without a dedicated SMPS circuit.
Abstract:
Delays are introduced in self-timed memories by introducing a capacitance on the path of a signal to be delayed. The capacitances are realized by using idle-lying metal layers in the circuitry. The signal to be delayed is connected to the idle-lying capacitances via programmable switches. The amount of delay introduced depends on the capacitance introduced in the path of signal, which in turn depends on state of the switches. The state of the switches is controlled by delay codes provided externally to the delay introducing circuitry. Since idle-lying metal capacitances are utilized, the circuitry can be implemented using a minimum amount of additional hardware. Also, the delay provided by the circuitry is a function of memory cell SPICE characteristics and core parasitic capacitances.
Abstract:
A Micro Electro Mechanical Systems (MEMS) device includes a rotor having first rotor teeth and second rotor teeth formed in at least two layers of silicon-on-insulator (SOI) substrate. Each rotor tooth belonging to the first rotor teeth is formed in a first layer and each rotor tooth belonging of the second rotor teeth is formed in a second layer. A stator includes first stator teeth and second stator teeth formed in at least two layers of SOI substrate. Each stator tooth belonging to the first stator teeth is formed in a first layer and each stator tooth belonging to the second stator teeth is formed in a second layer.