摘要:
A six transistor SRAM cell for single-ended sensing is described along with related memory architecture. The cell comprises a bistable circuit connected to complementary bit lines through a pair of passgate transistors. One of the passgate transistors has a lower threshold voltage than the other transistor. The lower threshold voltage is used to couple the cell to a single-ended sense amplifier through one of the bit lines. In one embodiment fewer than all the bit lines in an array are precharged in order to reduce power consumption in the array.
摘要:
In some embodiments, the invention involves a system including an integrated circuit. The system a circuit including transistors. The system further includes control circuitry to control a setting of a body bias signal to control body biases provided in the circuit to at least partially control a parameter of the integrated circuit, the setting of the body bias signal being responsive to an input signal to the control circuitry. In some embodiments, the invention involves a system including an integrated circuit. The system a circuit including transistors. The system further includes control circuitry to control settings of a body bias signal, a supply voltage signal, and a clock signal to control body biases, supply voltages, and clock frequencies provided in the circuit to at least partially control a parameter of the integrated circuit, the setting of the body bias signal, supply voltage signal, and clock signal being responsive to an input signal to the control circuitry.
摘要:
One embodiment of the invention includes a semiconductor circuit including a ground voltage node to provide a ground voltage and pFET transistors having an n-type body electrically coupled to the ground voltage node to forward body bias the pFET transistors. Another embodiment of the invention includes a semiconductor circuit including a supply voltage node to provide a supply voltage and nFET transistors having a p-type body electrically coupled to the supply voltage node to forward body bias the nFET transistors. Still another embodiment of the invention includes a semiconductor circuit including a ground voltage node to provide a ground voltage and pFET transistors having an n-type body electrically coupled to the ground voltage node to forward body bias the pFET transistors. The circuit also includes a supply voltage node to provide a supply voltage and nFET transistors having a p-type body electrically coupled to the supply voltage node to forward body bias the nFET transistors.
摘要:
In some embodiments, the invention includes circuit having a differential amplifier and body bias control circuitry. The differential amplifier includes a differential pair of first and second FET transistors to at least partially control output voltage signals responsive to input voltage signals, the first and second FET transistors being configured to be matched and having a body. The body bias control circuitry provides a body bias voltage signal to the body to place the first and second FET transistors in a forward body bias condition. The differential amplifier and body bias circuitry may be used in a sense amplifier, comparator, voltage controlled oscillator, delay locked loop, and phase locked loop as well as other circuits.
摘要:
In one embodiment of the invention, a semiconductor circuit includes a first group of field effect transistors that are forward body biased and have threshold voltages and a second group of field effect transistors that are not forward body biased and have threshold voltages that are higher than the threshold voltages of the first group of field transistors. In another embodiment of the invention, a semiconductor circuit includes first and second groups of field effect transistors. The circuit includes voltage source circuitry to provide voltage signals to bodies of the first group of field effect transistors to forward body bias the transistors of the first group. When the voltage signals are applied, the transistors of the first group have lower threshold voltages than do the transistors of the second group, except that there may be unintentional variations in threshold voltages due to parameter variations. Other aspects of the invention include forward biased decoupling transistors and a method of testing for leakage.
摘要:
An integrated circuit includes a first diffusion area for a first type transistor. The first type transistor includes a first drain region and a first source region. A second diffusion area for a second type transistor is spaced from the first diffusion area. The second type transistor includes a second drain region and a second source region. A gate electrode continuously extends across the first diffusion area and the second diffusion area in a routing direction. The first metallic layer is electrically coupled with the first source region. The first metallic layer and the first diffusion area overlap with a first distance. A second metallic layer is electrically coupled with the first drain region and the second drain region. The second metallic layer and the first diffusion area overlap with a second distance. The first distance is larger than the second distance.
摘要:
An integrated circuit includes a first diffusion area for a first type transistor. The first type transistor includes a first drain region and a first source region. A second diffusion area for a second type transistor is spaced from the first diffusion area. The second type transistor includes a second drain region and a second source region. A gate electrode continuously extends across the first diffusion area and the second diffusion area in a routing direction. The first metallic layer is electrically coupled with the first source region. The first metallic layer and the first diffusion area overlap with a first distance. A second metallic layer is electrically coupled with the first drain region and the second drain region. The second metallic layer and the first diffusion area overlap with a second distance. The first distance is larger than the second distance.
摘要:
A capacitor includes a substrate (110, 210), a first electrically insulating layer (120, 220) over the substrate, and a fin (130, 231) including a semiconducting material (135) over the first electrically insulating layer. A first electrically conducting layer (140, 810) is located over the first electrically insulating layer and adjacent to the fin. A second electrically insulating layer (150, 910) is located adjacent to the first electrically conducting layer, and a second electrically conducting layer (160, 1010) is located adjacent to the second electrically insulating layer. The first and second electrically conducting layers together with the second electrically insulating layer form a metal-insulator-metal stack that greatly increases the capacitance area of the capacitor. In one embodiment the capacitor is formed using what may be referred to as a removable metal gate (RMG) approach.