公开(公告)号：US6071809A

公开(公告)日：2000-06-06

申请号：US161176

申请日：1998-09-25

Applicant: Bin Zhao

Inventor： Bin Zhao

IPC: H01L21/768 ,  H01L23/522 ,  H01L23/532 ,  H01L21/4763

CPC classification number: H01L21/7681 ,  H01L21/76819 ,  H01L21/7684 ,  H01L23/5222 ,  H01L23/5329 ,  H01L2924/0002

Abstract: Dual damascene methods and structures are provided for IC interconnects which use a dual-damascene process incorporating a low-k dielectric material, high conductivity metal, and an improved hard mask scheme. A pair of hard masks are employed: a silicon dioxide layer and a silicon nitride layer, wherein the silicon dioxide layer acts to protect the silicon nitride layer during dual damascene etch processing, but is subsequently sacrificed during CMP, allowing the silicon nitride layer to act as a the CMP hard mask. In this way, delamination of the low-k material is prevented, and any copper-contaminated silicon dioxide material is removed.

Abstract translation: 提供了双重镶嵌方法和结构用于IC互连，其使用结合低k电介质材料，高导电性金属和改进的硬掩模方案的双镶嵌工艺。 使用一对硬掩模：二氧化硅层和氮化硅层，其中二氧化硅层用于在双镶嵌蚀刻处理期间保护氮化硅层，但随后在CMP期间被牺牲，允许氮化硅层起作用 作为CMP硬掩模。 以这种方式，可以防止低k材料的分层，并且去除任何铜污染的二氧化硅材料。

公开(公告)号：US5824599A

公开(公告)日：1998-10-20

申请号：US587264

申请日：1996-01-16

Applicant: Yosef Schacham-Diamand ,  Valery M. Dubin ,  Chiu H. Ting ,  Bin Zhao ,  Prahalad K. Vasudev ,  Melvin Desilva

Inventor： Yosef Schacham-Diamand ,  Valery M. Dubin ,  Chiu H. Ting ,  Bin Zhao ,  Prahalad K. Vasudev ,  Melvin Desilva

IPC: H01L21/768 ,  H01L21/44

CPC classification number: H01L21/76834 ,  H01L21/76838 ,  H01L21/76843 ,  H01L21/76874 ,  H01L21/76858 ,  Y10S977/712 ,  Y10S977/81 ,  Y10S977/888 ,  Y10S977/89

Abstract: A method for utilizing electroless copper deposition to form interconnects on a semiconductor. Once a via or a trench is formed in a dielectric layer, a titanium nitride (TiN) or tantalum (Ta) barrier layer is deposited. Then, a catalytic copper seed layer is conformally blanket deposited in vacuum over the barrier layer. Next, without breaking the vacuum, an aluminum protective layer is deposited onto the catalytic layer to encapsulate and protect the catalytic layer from oxidizing. An electroless deposition technique is then used to auto-catalytically deposit copper on the catalytic layer. The electroless deposition solution dissolves the overlying protective layer to expose the surface of the underlying catalytic layer. The electroless copper deposition occurs on this catalytic surface, and continues until the via/trench is filled. Subsequently, the copper and barrier material are polished by an application of chemical-mechanical polishing (CMP) to remove excess copper and barrier material from the surface, so that the only copper and barrier material remaining are in the via/trench openings. Then an overlying silicon nitride (SiN) layer is formed above the exposed copper in order to form a dielectric barrier layer. The copper interconnect is fully encapsulated from the adjacent material by the TiN (or Ta) barrier layer and the overlying SiN layer.

Abstract translation: 一种利用无电铜沉积在半导体上形成互连的方法。 一旦在电介质层中形成通孔或沟槽，则沉积氮化钛（TiN）或钽（Ta）阻挡层。 然后，催化铜籽晶层在真空中在阻挡层上共形地覆盖。 接下来，在不破坏真空的情况下，将铝保护层沉积到催化剂层上以包封并保护催化剂层免于氧化。 然后使用无电沉积技术在催化剂层上自动催化沉积铜。 无电沉积溶液溶解上覆的保护层以暴露下面的催化剂层的表面。 无电铜沉积发生在该催化剂表面上，并持续直到通孔/沟槽被填充。 随后，通过施加化学机械抛光（CMP）来抛光铜和阻挡材料，以从表面去除多余的铜和阻挡材料，使得剩余的唯一的铜和阻挡材料在通孔/沟槽开口中。 然后，在暴露的铜上方形成覆盖氮化硅（SiN）层，以形成电介质阻挡层。 铜互连通过TiN（或Ta）阻挡层和覆盖的SiN层从相邻材料完全封装。

公开(公告)号：US5695810A

公开(公告)日：1997-12-09

申请号：US754600

申请日：1996-11-20

Applicant: Valery M. Dubin ,  Yosi Schacham-Diamand ,  Bin Zhao ,  Prahalad K. Vasudev ,  Chiu H. Ting

Inventor： Valery M. Dubin ,  Yosi Schacham-Diamand ,  Bin Zhao ,  Prahalad K. Vasudev ,  Chiu H. Ting

IPC: C23C18/16 ,  C23C18/50 ,  H01L21/768 ,  B05D5/12 ,  B05D1/18

CPC classification number: H01L21/76831 ,  C23C18/1603 ,  C23C18/1651 ,  C23C18/1689 ,  C23C18/405 ,  C23C18/50 ,  H01L21/288 ,  H01L21/76843 ,  H01L21/76849 ,  H01L21/76876 ,  H01L21/76879 ,  H01L2221/1089

Abstract: A technique for electrolessly depositing a CoWP barrier material on to copper and electrolessly depositing copper onto a CoWP barrier material to prevent copper diffusion when forming layers and/or structures on a semiconductor wafer.

Abstract translation: 一种用于将CoWP阻挡材料无电沉积到铜上并在CoWP阻挡材料上无电沉积铜以防止在半导体晶片上形成层和/或结构时铜扩散的技术。

公开(公告)号：US10097925B2

公开(公告)日：2018-10-09

申请号：US15417208

申请日：2017-01-26

Applicant: Xun Di ,  Lipeng Ma ,  Ping Liang ,  Bin Zhao ,  Xudong Yan

Inventor： Xun Di ,  Lipeng Ma ,  Ping Liang ,  Bin Zhao ,  Xudong Yan

IPC: H04R7/12 ,  B32B3/28 ,  B32B5/12 ,  B32B37/06 ,  B32B37/10 ,  B32B38/18 ,  H04R31/00 ,  B29C70/00

Abstract: The present disclosure disclose a diaphragm dome, the diaphragm dome includes a first carbon fiber layer and a second carbon fiber layer which are alternatively arranged by stacking, the first carbon fiber layer and the second carbon fiber layer are respectively a single-layer structure formed by an one-way extended carbon fiber bundle, an extending direction of the carbon fiber bundle of the first carbon fiber layer is perpendicular to an extending direction of the carbon fiber bundle of the second carbon fiber layer, and a thickness difference exists between the first carbon fiber layer and the second carbon fiber layer. In the diaphragm dome provided by the present disclosure, the material has larger specific strength, thus can reduce the thickness of the diaphragm dome, the carbon fiber layers of the diaphragm dome are well adhered, which is not readily layered, and has good water resistance.

公开(公告)号：US09917756B2

公开(公告)日：2018-03-13

申请号：US14500968

申请日：2014-09-29

Applicant: Bin Zhao ,  Jonathan Li

Inventor： Bin Zhao ,  Jonathan Li

IPC: H04M3/56 ,  H04M3/432 ,  H04L12/26 ,  H04W4/16 ,  H04L29/06 ,  H04L12/18 ,  H04L12/24 ,  H04L12/721 ,  H04L12/925 ,  H04M3/22 ,  H04M7/00 ,  H04L12/58 ,  H04L12/841 ,  H04M1/253 ,  H04M1/725

CPC classification number: H04L43/0864 ,  H04L12/18 ,  H04L12/1827 ,  H04L12/1831 ,  H04L41/5038 ,  H04L43/045 ,  H04L43/062 ,  H04L43/0852 ,  H04L43/10 ,  H04L43/50 ,  H04L45/123 ,  H04L47/283 ,  H04L47/722 ,  H04L51/34 ,  H04L65/1066 ,  H04L65/4038 ,  H04M1/2535 ,  H04M1/72547 ,  H04M3/2236 ,  H04M3/432 ,  H04M3/563 ,  H04M3/565 ,  H04M7/0084 ,  H04M2250/62 ,  H04M2250/74 ,  H04W4/16

Abstract: Systems and methods for a readiness dialog box for a call over network (CON) are provided. In some embodiments, the readiness dialog box is presented to the callers prior to the onset of the call. It presents the other participant's and their status. For example, it may indicate which participants are online, but not yet ready, those who are ready, and those not available. It also enables the caller to send messages (both preconfigured and customized) to the other participants. Once sufficient participants have joined, the call may start. Sufficiency of participants could include a quorum of individuals, may require that specific participants are ready, everyone is ready, or may be time dependent. The participant requirements may be configured by the individual setting up the call based upon call type.

公开(公告)号：US20170048600A1

公开(公告)日：2017-02-16

申请号：US15082304

申请日：2016-03-28

Applicant: Xiaofeng Pu ,  Qun Xiang ,  Xudong Yan ,  Bin Zhao ,  Sheng Ye

Inventor： Xiaofeng Pu ,  Qun Xiang ,  Xudong Yan ,  Bin Zhao ,  Sheng Ye

IPC: H04R1/02 ,  H04R1/32

CPC classification number: H04R1/023 ,  H04R1/2811 ,  H04R31/00 ,  H04R2499/11

Abstract: A sound generating device is provided in the present disclosure. The sound generating device includes a shell providing a receiving cavity, a sound generating body received in the receiving cavity and assembled to the shell, sound absorbing material filled in the receiving cavity, and an isolating member attached on the sound generating body. The sound generating body includes at least one air hole, and the isolating member covers the at least one air hole, the isolating member is configured for isolating the sound absorbing material from entering the sound generating body. The present disclosure further provides a method for making a sound generating device.

Abstract translation: 本发明提供一种发声装置。 声音发生装置包括提供接收腔的外壳，容纳在接收腔中并组装到外壳上的声音发生体，填充在接收腔中的吸声材料以及附着在发声体上的隔离构件。 发声体包括至少一个气孔，隔离构件覆盖至少一个气孔，该隔离构件用于隔离吸音材料以进入发声体。 本公开还提供了一种用于制造声音产生装置的方法。

公开(公告)号：US20150381440A1

公开(公告)日：2015-12-31

申请号：US14500954

申请日：2014-09-29

Applicant: Bin Zhao ,  Jonathan Li

Inventor： Bin Zhao ,  Jonathan Li

IPC: H04L12/26 ,  H04L29/06 ,  H04L29/08

CPC classification number: H04L43/0864 ,  H04L12/18 ,  H04L12/1827 ,  H04L12/1831 ,  H04L41/5038 ,  H04L43/045 ,  H04L43/062 ,  H04L43/0852 ,  H04L43/10 ,  H04L43/50 ,  H04L45/123 ,  H04L47/283 ,  H04L47/722 ,  H04L51/34 ,  H04L65/1066 ,  H04L65/4038 ,  H04M1/2535 ,  H04M1/72547 ,  H04M3/2236 ,  H04M3/432 ,  H04M3/563 ,  H04M3/565 ,  H04M7/0084 ,  H04M2250/62 ,  H04M2250/74 ,  H04W4/16

Abstract: Systems and methods for visualization of a call over network (CON) are provided. In some embodiments, the visualization of a call over network may be effectuated by three functionalities: a readiness dialog box that enables the facilitation of the call, the inclusion of visualization and participant features within the call, and a visualized summary after the call. The readiness dialog box is presented to the callers prior to the onset of the call. It presents the other participant's and their status. It also enables the caller to send messages (both preconfigured and customized) to the other participants. Once sufficient participants have joined, the call may start. Once the call starts, it may be visualized by displaying on a single or multi channels, which caller is speaking, and any additional indications they may be providing. The caller may likewise be provided a set of participant features that allow the user to interact with the call. After the call concludes, a visualized summary of the call can then be generated. The summary includes any of the recording, transcriptions, scenario information, speaker information and the duration each speaker was talking, etc.

Abstract translation: 提供了通过网络（CON）可视化的系统和方法。 在一些实施例中，通过网络的呼叫的可视化可以通过三个功能来实现：能够促进呼叫，在呼叫中包括可视化和参与者特征的准备对话框以及呼叫之后的可视化摘要。 就绪对话框在呼叫开始之前呈现给呼叫者。 它提供了另一个参与者及其状态。 它还使呼叫者能够向其他参与者发送消息（预配置和自定义）。 一旦有足够的参与者加入，呼叫可能开始。 一旦呼叫开始，它可以通过在单个或多个频道上显示，哪个呼叫者在说话，以及可能提供的任何附加指示。 呼叫者同样可以被提供一组允许用户与呼叫交互的参与者特征。 呼叫结束后，可以生成可视化的通话摘要。 摘要包括录音，转录，情景信息，演讲者信息以及每个发言者在说话的持续时间等。

公开(公告)号：US08599915B2

公开(公告)日：2013-12-03

申请号：US13025201

申请日：2011-02-11

Applicant: Bin Zhao ,  Jack W. Cornish ,  Andrew M. Kameya ,  Weizhuang W. Xin

Inventor： Bin Zhao ,  Jack W. Cornish ,  Andrew M. Kameya ,  Weizhuang W. Xin

IPC: H03K7/08 ,  H03K9/08

CPC classification number: H05B33/0827 ,  G09G3/3406 ,  G09G2320/064

Abstract: First information is received at a first pulse width modulation (PWM) module responsive to a chip select signal being asserted at a chip select input of a communication bus of the first PWM module during a first time. The first information is latched at a control register of the first PWM module in response to a first logic transition of the chip select signal. A first PWM signal is provided at a first output of the first PWM module beginning a predetermined amount of time after the first logic transition of the chip select signal, the first PWM signal generated by the first PWM module based upon the first information.

Abstract translation: 响应于在第一时间期间在第一PWM模块的通信总线的芯片选择输入端被断言的芯片选择信号，第一脉冲宽度调制（PWM）模块接收第一信息。 响应于芯片选择信号的第一逻辑转换，第一信息被锁存在第一PWM模块的控制寄存器中。 第一PWM信号设置在第一PWM模块的第一输出处，在芯片选择信号的第一逻辑转换，基于第一信息由第一PWM模块产生的第一PWM信号之后开始预定的时间量。

公开(公告)号：US20130070369A1

公开(公告)日：2013-03-21

申请号：US13238026

申请日：2011-09-21

Applicant: Shen kuang sidney CHOU ,  Chi hung Yuen ,  Yan bin Wang ,  Shu ming Zhang ,  Bin Zhao ,  Ming liang Lin

Inventor： Shen kuang sidney CHOU ,  Chi hung Yuen ,  Yan bin Wang ,  Shu ming Zhang ,  Bin Zhao ,  Ming liang Lin

IPC: G11B5/48 ,  G11B5/127 ,  G11B17/02

CPC classification number: G11B5/4853 ,  G11B5/486 ,  Y10T29/4903

Abstract: A suspension includes a flexure and a plurality of electrical traces formed on the flexure. Each electrical trace has a trace body and a bonding pad arranged for connecting with a slider, and the bonding pad is a free end before connecting with the slider and is capable of bending to the trace body flexibly, and the bonding pad includes a trace body layer and a solder layer formed on the trace body layer, thereby the bonding pads of the electrical traces connecting with the slider by reflowing the solder layer. The present invention uses no extra solder balls, so as to reduce the manufacturing cost and the corresponding apparatus cost. The invention also discloses a manufacturing method of a suspension, and a connecting method for a suspension and a slider.

Abstract translation: 悬架包括挠曲件和形成在挠曲件上的多个电迹线。 每个电迹线具有迹线体和布置成与滑块连接的接合焊盘，并且接合焊盘在与滑块连接之前是自由端，并且能够柔性地弯曲到迹线体，并且焊盘包括迹线体 层和形成在迹体层上的焊料层，由此通过回流焊料层而与滑块连接的电迹线的焊盘。 本发明不使用额外的焊球，从而降低制造成本和相应的设备成本。 本发明还公开了一种悬架的制造方法以及悬架和滑块的连接方法。

公开(公告)号：US08106604B2

公开(公告)日：2012-01-31

申请号：US12504335

申请日：2009-07-16

Applicant: Bin Zhao ,  Jack W. Cornish ,  Brian B. Horng ,  Andrew M. Kameya ,  Kenneth C. Kwok ,  Victor K. Lee

Inventor： Bin Zhao ,  Jack W. Cornish ,  Brian B. Horng ,  Andrew M. Kameya ,  Kenneth C. Kwok ,  Victor K. Lee

IPC: H05B37/02

CPC classification number: H05B33/0827 ,  G09G3/342 ,  G09G2320/064 ,  H05B33/0815 ,  H05B33/0818

Abstract: A light emitting diode (LED) system implements a LED driver to drive a set of one or more LED strings. The LED driver includes a voltage source to provide an adjustable output voltage to a head end of each LED string of the set for a first duration and a second duration following the first duration. The LED driver further includes a feedback controller to control the voltage source to adjust the output voltage for the second duration based on a digital code value generated from a minimum tail voltage of one or more tail voltages of the set at a sample point of the first duration. The LED driver further includes a power controller to temporarily enable one or more components of the feedback controller for a sample period of the first duration, the sample period comprising the sample point.

Abstract translation: 发光二极管（LED）系统实现LED驱动器以驱动一组或多个LED串。 LED驱动器包括电压源，以在第一持续时间和第一持续时间之后的第一持续时间和第二持续时间内向组的每个LED串的头端提供可调节的输出电压。 所述LED驱动器还包括反馈控制器，用于控制所述电压源，以基于在所述第一持续时间内的所述第一持续时间的采样点从所述组的一个或多个尾部电压的最小尾部电压产生的数字代码值来调整所述输出电压 持续时间 LED驱动器还包括功率控制器，用于临时使得反馈控制器的一个或多个部件在第一持续时间的采样周期内，该采样周期包括采样点。