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    High speed printer with multiple paper paths
    71.
    发明授权
    High speed printer with multiple paper paths 失效
    具有多个纸张路径的高速打印机

    公开(公告)号：US4452543A

    公开(公告)日：1984-06-05

    申请号：US339272

    申请日：1982-01-15

    Applicant: James W. Adkisson ,  David W. Davis ,  Paul A. Ishman

    Inventor： James W. Adkisson ,  David W. Davis ,  Paul A. Ishman

    IPC: B41J11/48 ,  B41J15/04 ,  B41J11/00

    CPC classification number: B41J15/04 ,  B41J11/48

    Abstract: A high speed printer has multiple paths to accommodate cut paper sheets, manually fed paper and continuous forms for supply to a cylindrical platen such that the printer can be utilized with various types and sizes of paper. The printer includes a bail mechanism operable to capture the cut paper sheets and the manually fed sheets and to be moved to a displaced position when the printer is used for continuous forms.

    Abstract translation: 高速打印机具有多条路径以适应切割的纸张，手动输送纸张和连续形式供应到圆柱形压板，使得打印机可以与各种类型和尺寸的纸张一起使用。 打印机包括可操作用于捕获切割的纸张和手动进给的纸张并且当打印机用于连续形式时移动到移动位置的吊环机构。

    Bipolar transistor with a collector having a protected outer edge portion for reduced based-collector junction capacitance and a method of forming the transistor
    75.
    发明授权
    Bipolar transistor with a collector having a protected outer edge portion for reduced based-collector junction capacitance and a method of forming the transistor 有权
    具有集电器的双极晶体管具有受保护的外边缘部分，用于降低基极集电极结电容，以及形成晶体管的方法

    公开(公告)号：US08546230B2

    公开(公告)日：2013-10-01

    申请号：US13296496

    申请日：2011-11-15

    Applicant: James W. Adkisson ,  David L. Harame ,  Robert K. Leidy ,  Qizhi Liu

    Inventor： James W. Adkisson ,  David L. Harame ,  Robert K. Leidy ,  Qizhi Liu

    IPC: H01L21/331 ,  H01L29/66

    CPC classification number: H01L29/732 ,  H01L29/7371

    Abstract: Disclosed are embodiments of a transistor (e.g., bipolar junction transistor (BJT) or a heterojunction bipolar transistor (HBT)) and a method of forming the transistor with a collector region having a protected upper edge portion for reduced base-collector junction capacitance Cbc. In the embodiments, a collector region is positioned laterally adjacent to a trench isolation region within a substrate. Mask layer(s) cover the trench isolation region and further extend laterally onto the edge portion of the collector region. A first section of an intrinsic base layer is positioned above a center portion of the collector region and a second section of the intrinsic base layer is positioned above the mask layer(s). During processing these mask layer(s) prevent divot formation in the upper corner of the trench isolation region at the isolation region-collector region interface and further limit dopant diffusion from a subsequently formed raised extrinsic base layer into the collector region.

    Abstract translation: 公开了晶体管（例如双极结型晶体管（BJT）或异质结双极晶体管（HBT））的实施例以及形成具有集电极区域的晶体管的方法，该集电极区域具有用于还原的基极 - 集电极结电容Cbc的受保护的上边缘部分。 在实施例中，集电极区域位于衬底内侧向与沟槽隔离区域相邻的位置。 掩模层覆盖沟槽隔离区域并且进一步横向延伸到收集器区域的边缘部分上。 本征基极层的第一部分位于集电极区域的中心部分的上方，并且本征基极层的第二部分位于掩模层之上。 在处理期间，这些掩模层防止在隔离区域 - 集电极区界面处的沟槽隔离区的上角部形成裂缝，并且进一步限制从随后形成的凸起的外在基极层到集电极区域的掺杂剂扩散。

    Methods for forming anti-reflection structures for CMOS image sensors
    77.
    发明授权
    Methods for forming anti-reflection structures for CMOS image sensors 有权
    CMOS图像传感器形成抗反射结构的方法

    公开(公告)号：US08409904B2

    公开(公告)日：2013-04-02

    申请号：US13165375

    申请日：2011-06-21

    Applicant: James W. Adkisson ,  John J. Ellis-Monaghan ,  Jeffrey P. Gambino ,  Charles F. Musante

    Inventor： James W. Adkisson ,  John J. Ellis-Monaghan ,  Jeffrey P. Gambino ,  Charles F. Musante

    IPC: H01L21/00

    CPC classification number: H01L27/14685 ,  H01L27/14618 ,  H01L27/14625 ,  H01L27/14627 ,  H01L27/14632 ,  H01L27/14645 ,  H01L27/14689 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00

    Abstract: Protuberances, having vertical and lateral dimensions less than the wavelength range of lights detectable by a photodiode, are formed at an optical interface between two layers having different refractive indices. The protuberances may be formed by employing self-assembling block copolymers that form an array of sublithographic features of a first polymeric block component within a matrix of a second polymeric block component. The pattern of the polymeric block component is transferred into a first optical layer to form an array of nanoscale protuberances. Alternately, conventional lithography may be employed to form protuberances having dimensions less than the wavelength of light. A second optical layer is formed directly on the protuberances of the first optical layer. The interface between the first and second optical layers has a graded refractive index, and provides high transmission of light with little reflection.

    Abstract translation: 在具有不同折射率的两层之间的光学界面处形成具有小于由光电二极管可检测的光的波长范围的垂直和横向尺寸的突起。 突起可以通过采用在第二聚合物嵌段组分的基质内形成第一聚合物嵌段组分的亚光刻特征阵列的自组装嵌段共聚物来形成。 聚合物嵌段组分的图案被转移到第一光学层中以形成纳米级突起的阵列。 或者，可以使用常规光刻来形成尺寸小于光的波长的突起。 第二光学层直接形成在第一光学层的突起上。 第一和第二光学层之间的界面具有渐变的折射率，并提供很少的反射光的高透射率。

    PASSIVATED THROUGH WAFER VIAS IN LOW-DOPED SEMICONDUCTOR SUBSTRATES
    78.
    发明申请
    PASSIVATED THROUGH WAFER VIAS IN LOW-DOPED SEMICONDUCTOR SUBSTRATES 有权
    通过低压半导体衬底中的波形钝化

    公开(公告)号：US20130026646A1

    公开(公告)日：2013-01-31

    申请号：US13193991

    申请日：2011-07-29

    Applicant: James W. Adkisson ,  Jeffrey P. Gambino ,  Mark D. Jaffe ,  Alvin J. Joseph

    Inventor： James W. Adkisson ,  Jeffrey P. Gambino ,  Mark D. Jaffe ,  Alvin J. Joseph

    IPC: H01L21/28 ,  G06F17/50 ,  H01L23/48 ,  H01L21/22 ,  H01L21/265

    CPC classification number: H01L21/76898 ,  H01L21/26586 ,  H01L29/732

    Abstract: A method for forming passivated through wafer vias, passivated through wafer via structures, and passivated through wafer via design structures. The method includes: forming a through wafer via in a semiconductor substrate, the through wafer via comprising an electrical conductor extending from a top of the semiconductor substrate to a bottom surface of the semiconductor substrate; and forming a doped layer abutting all sidewalls of the electrical conductor, the doped layer of a same dopant type as the semiconductor substrate, the concentration of dopant in the doped layer greater than the concentration of dopant in the semiconductor substrate, the doped layer intervening between the electrical conductor and the semiconductor substrate.

    Abstract translation: 用于形成钝化的晶片通孔的方法，通过晶片通孔结构钝化，并通过设计结构钝化通过晶片。 该方法包括：在半导体衬底中形成贯穿晶片通孔，所述贯通晶片通孔包括从半导体衬底的顶部延伸到半导体衬底的底表面的电导体; 并且形成邻接电导体的所有侧壁的掺杂层，与半导体衬底相同的掺杂剂类型的掺杂层，掺杂层中掺杂剂的浓度大于半导体衬底中掺杂剂的浓度，掺杂层介于 电导体和半导体衬底。

    CMOS IMAGER PHOTODIODE WITH ENHANCED CAPACITANCE
    80.
    发明申请
    CMOS IMAGER PHOTODIODE WITH ENHANCED CAPACITANCE 有权
    具有增强电容的CMOS IMAGER光电二极管

    公开(公告)号：US20120122261A1

    公开(公告)日：2012-05-17

    申请号：US13288686

    申请日：2011-11-03

    Applicant: James W. Adkisson ,  John J. Ellis-Monaghan ,  Mark D. Jaffe ,  Dale J. Pearson ,  Dennis L. Rogers

    Inventor： James W. Adkisson ,  John J. Ellis-Monaghan ,  Mark D. Jaffe ,  Dale J. Pearson ,  Dennis L. Rogers

    IPC: H01L31/18

    CPC classification number: H01L27/14643 ,  H01L27/1463 ,  H01L27/14689 ,  H01L31/035281

    Abstract: A method for manufacturing a pixel sensor cell that includes a photosensitive element having a non-laterally disposed charge collection region. The method includes forming a trench recess in a substrate of a first conductivity type material, and filling the trench recess with a material having second conductivity type material. The second conductivity type material is then diffused out of the filled trench material to the substrate region surrounding the trench to form the non-laterally disposed charge collection region. The filled trench material is removed to provide a trench recess, and the trench recess is filled with a material having a first conductivity type material. A surface implant layer is formed at either side of the trench having a first conductivity type material. A collection region of a trench-type photosensitive element is formed of the outdiffused second conductivity type material and is isolated from the substrate surface.

    Abstract translation: 一种制造像素传感器单元的方法，该像素传感器单元包括具有非横向放置的电荷收集区域的感光元件。 该方法包括在第一导电类型材料的衬底中形成沟槽凹槽，并用具有第二导电类型材料的材料填充沟槽凹槽。 然后将第二导电类型材料从填充的沟槽材料扩散到围绕沟槽的衬底区域，以形成非横向布置的电荷收集区域。 去除填充的沟槽材料以提供沟槽凹槽，并且用具有第一导电类型材料的材料填充沟槽凹槽。 表面注入层形成在具有第一导电类型材料的沟槽的任一侧。 沟槽型感光元件的收集区域由向外扩散的第二导电型材料形成，并与衬底表面隔离。

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