公开(公告)号：US5879192A

公开(公告)日：1999-03-09

申请号：US718387

申请日：1996-10-01

申请人： Yukifumi Machida ,  Hideo Kon ,  Yoshikazu Tanaka ,  Akihiro Kojima ,  Michiyasu Watanabe

发明人： Yukifumi Machida ,  Hideo Kon ,  Yoshikazu Tanaka ,  Akihiro Kojima ,  Michiyasu Watanabe

IPC分类号： H01R13/436 ,  H01R13/516

CPC分类号： H01R13/4367

摘要： An electric connector including a housing (14) and a rear holder (13). The rear holder (13) retains connecting terminals (12) therein and is fitted into the housing (14) from the rear of the housing. The rear holder (13) includes a front retaining portion (36a, 36b) for restricting forward movement of the connecting terminals (12), and a rear retaining portion (37) for restricting backward movement of the connecting terminals (12). The housing (14) has an inclined guide surface (34b, 43c) for receiving and guiding a respective connecting terminal (12) at an inclined angle into the housing. The structure of the housing (14) and rear holder (13) is adapted so that the connecting terminals (12) are retained within a terminal connecting portion (21) in a provisionally engaged position by inserting a connecting terminal (12) into the housing (14) at an inclined by abutting the inclined guide surface (34b, 43c) and then moving the connecting terminals (12) into a fixed completely engaged horizontal position by pushing the rear holder (13).

摘要翻译： PCT No.PCT / JP96 / 00186 Sec。 371日期：1996年10月1日 102（e）日期1996年10月1日PCT提交1996年1月31日PCT公布。 WO96 / 24176 PCT公开号 日期：1996年8月8日具有壳体（14）和后保持架（13）的电连接器。 后保持器（13）将连接端子（12）保持在其中并且从壳体的后部装配到壳体（14）中。 后保持器（13）包括用于限制连接端子（12）向前移动的前保持部分（36a，36b）和用于限制连接端子（12）向后移动的后保持部分（37）。 壳体（14）具有倾斜的引导表面（34b，43c），用于将相应的连接端子（12）倾斜地接收并引导到壳体中。 壳体（14）和后保持器（13）的结构适于使得连接端子（12）通过将连接端子（12）插入壳体中而保持在临时接合位置内的端子连接部分（21）内 （14）通过抵靠所述倾斜的引导表面（34b，43c）而倾斜，然后通过推动所述后保持器（13）将所述连接端子（12）移动到固定的完全接合的水平位置。

公开(公告)号：US08994030B2

公开(公告)日：2015-03-31

申请号：US13598504

申请日：2012-08-29

申请人： Akihiro Kojima ,  Hideto Furuyama ,  Miyoko Shimada ,  Yosuke Akimoto ,  Hideyuki Tomizawa ,  Yoshiaki Sugizaki

发明人： Akihiro Kojima ,  Hideto Furuyama ,  Miyoko Shimada ,  Yosuke Akimoto ,  Hideyuki Tomizawa ,  Yoshiaki Sugizaki

IPC分类号： H01L33/44

CPC分类号： H01L33/44 ,  H01L33/486 ,  H01L33/50

摘要： According to one embodiment, a semiconductor light emitting device includes a semiconductor layer, a p-side electrode, an n-side electrode, a phosphor layer, and a transparent film. The semiconductor layer has a first face, a second face opposite to the first face, and a light emitting layer. The p-side electrode is provided on the second face in an area including the light emitting layer. The n-side electrode is provided on the second face in an area not including the light emitting layer. The phosphor layer is provided on the first face. The phosphor layer includes a transparent resin and phosphor dispersed in the transparent resin. The transparent film is provided on the phosphor layer and has an adhesiveness lower than an adhesiveness of the transparent resin.

摘要翻译： 根据一个实施例，半导体发光器件包括半导体层，p侧电极，n侧电极，荧光体层和透明膜。 半导体层具有第一面，与第一面相反的第二面和发光层。 p侧电极设置在包括发光层的区域的第二面上。 n侧电极设置在不包括发光层的区域的第二面上。 磷光体层设置在第一面上。 荧光体层包括分散在透明树脂中的透明树脂和荧光体。 透明膜设置在荧光体层上，粘合性低于透明树脂的粘合性。

公开(公告)号：US08987762B2

公开(公告)日：2015-03-24

申请号：US13607480

申请日：2012-09-07

申请人： Toshiya Nakayama ,  Kazuhito Higuchi ,  Hiroshi Koizumi ,  Hideo Nishiuchi ,  Susumu Obata ,  Akiya Kimura ,  Yoshiaki Sugizaki ,  Akihiro Kojima ,  Yosuke Akimoto

发明人： Toshiya Nakayama ,  Kazuhito Higuchi ,  Hiroshi Koizumi ,  Hideo Nishiuchi ,  Susumu Obata ,  Akiya Kimura ,  Yoshiaki Sugizaki ,  Akihiro Kojima ,  Yosuke Akimoto

IPC分类号： H01L33/50 ,  H01L33/56 ,  H01L33/54

CPC分类号： H01L33/56 ,  H01L27/15 ,  H01L33/502 ,  H01L33/505 ,  H01L33/508 ,  H01L33/54 ,  H01L2933/0041

摘要： According to one embodiment, a light-emitting unit which emits light, a wavelength conversion unit which includes a phosphor and which is provided on a main surface of the light-emitting unit, and a transparent resin which is provided on top of the wavelength conversion unit, are prepared. The transparent resin has a greater modulus of elasticity and/or a higher Shore hardness than the wavelength conversion unit.

摘要翻译： 根据一个实施例，发射光的发光单元，包括荧光体并设置在发光单元的主表面上的波长转换单元和设置在波长转换器顶部的透明树脂 单位，准备。 透明树脂具有比波长转换单元更大的弹性模量和/或更高的肖氏硬度。

公开(公告)号：US08884327B2

公开(公告)日：2014-11-11

申请号：US12886709

申请日：2010-09-21

申请人： Yoshiaki Sugizaki ,  Hideki Shibata ,  Akihiro Kojima ,  Masayuki Ishikawa ,  Hideo Tamura ,  Tetsuro Komatsu

发明人： Yoshiaki Sugizaki ,  Hideki Shibata ,  Akihiro Kojima ,  Masayuki Ishikawa ,  Hideo Tamura ,  Tetsuro Komatsu

IPC分类号： H01L33/00 ,  H01L33/50 ,  H01L33/44 ,  H01L33/38 ,  H01L33/62 ,  H01L33/48

CPC分类号： H01L33/0066 ,  H01L27/15 ,  H01L33/0075 ,  H01L33/0079 ,  H01L33/38 ,  H01L33/44 ,  H01L33/48 ,  H01L33/486 ,  H01L33/50 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2933/0041 ,  H01L2933/005 ,  H01L2933/0066 ,  H01L2924/00

摘要： According to one embodiment, a semiconductor light emitting device includes a light emitting chip and a fluorescent material layer. The light emitting chip includes a semiconductor layer, a first electrode, a second electrode, an insulating layer, a first interconnect layer, a second interconnect layer, a first metal pillar, a second metal pillar, and a resin layer. The semiconductor layer includes a light emitting layer, a first major surface, and a second major surface formed on a side opposite to the first major surface. The fluorescent material layer is provided on the first major surface and has a larger planer size than the light emitting chip.

摘要翻译： 根据一个实施例，半导体发光器件包括发光芯片和荧光材料层。 发光芯片包括半导体层，第一电极，第二电极，绝缘层，第一互连层，第二互连层，第一金属柱，第二金属柱和树脂层。 半导体层包括形成在与第一主表面相对的一侧上的发光层，第一主表面和第二主表面。 荧光材料层设置在第一主表面上，并且具有比发光芯片更大的平面尺寸。

公开(公告)号：US08692279B2

公开(公告)日：2014-04-08

申请号：US13052248

申请日：2011-03-21

申请人： Miyuki Izuka ,  Yosuke Akimoto ,  Akihiro Kojima ,  Yoshiaki Sugizaki

发明人： Miyuki Izuka ,  Yosuke Akimoto ,  Akihiro Kojima ,  Yoshiaki Sugizaki

IPC分类号： H01L33/00

CPC分类号： H01L33/44 ,  H01L33/38 ,  H01L33/486 ,  H01L33/50 ,  H01L2924/0002 ,  H01L2924/00

摘要： According to one embodiment, a semiconductor light emitting device includes a semiconductor layer, a first electrode, a second electrode, a first insulating layer, a first interconnect layer, a second interconnect layer, a first metal pillar, a second metal pillar, and a second insulating layer. The semiconductor layer includes a first major surface, a second major surface opposite to the first major surface, and a light emitting layer. The first electrode is provided on a region including the light emitting layer on the second major surface. The second electrode is provided on the second major surface and interposed in the first electrode in a planar view.

摘要翻译： 根据一个实施例，半导体发光器件包括半导体层，第一电极，第二电极，第一绝缘层，第一互连层，第二互连层，第一金属柱，第二金属柱和 第二绝缘层。 半导体层包括第一主表面，与第一主表面相对的第二主表面和发光层。 第一电极设置在包括第二主表面上的发光层的区域上。 第二电极设置在第二主表面上并且以平面视图插入第一电极中。

公开(公告)号：US20130313581A1

公开(公告)日：2013-11-28

申请号：US13601336

申请日：2012-08-31

申请人： Hideto Furuyama ,  Akihiro Kojima ,  Miyoko Shimada ,  Yosuke Akimoto ,  Hideyuki Tomizawa

发明人： Hideto Furuyama ,  Akihiro Kojima ,  Miyoko Shimada ,  Yosuke Akimoto ,  Hideyuki Tomizawa

IPC分类号： H01L33/50 ,  H01L33/08

CPC分类号： H01L33/505

摘要： According to one embodiment, a semiconductor light emitting device includes: a semiconductor layer including a first and second surfaces, and a light emitting layer; a p-side electrode provided on the second surface; an n-side electrode provided on the second surface; a first insulating film covering the p-side and the n-side electrodes; a p-side wiring section electrically connected to the p-side electrode through the first insulating film; an n-side wiring section electrically connected to the n-side electrode through the first insulating film; and a phosphor layer provided on the first surface. The phosphor layer has an upper surface and an oblique surface, the oblique surface forming an obtuse angle with the upper surface and inclined with respect to the first surface. Thickness of the phosphor layer immediately below the oblique surface is smaller than thickness of the phosphor layer immediately below the upper surface.

摘要翻译： 根据一个实施例，半导体发光器件包括：包括第一和第二表面的半导体层和发光层; 设置在第二表面上的p侧电极; 设置在所述第二表面上的n侧电极; 覆盖p侧和n侧电极的第一绝缘膜; 通过第一绝缘膜电连接到p侧电极的p侧布线部分; 通过第一绝缘膜与n侧电极电连接的n侧配线部; 以及设置在第一表面上的荧光体层。 荧光体层具有上表面和倾斜表面，倾斜表面与上表面形成钝角并相对于第一表面倾斜。 斜面正下方的荧光体层的厚度小于上表面正下方的荧光体层的厚度。

公开(公告)号：US08436378B2

公开(公告)日：2013-05-07

申请号：US12817592

申请日：2010-06-17

申请人： Akihiro Kojima ,  Yoshiaki Sugizaki ,  Hideki Shibata ,  Hideo Tamura ,  Tetsuro Komatsu ,  Masayuki Ishikawa

发明人： Akihiro Kojima ,  Yoshiaki Sugizaki ,  Hideki Shibata ,  Hideo Tamura ,  Tetsuro Komatsu ,  Masayuki Ishikawa

IPC分类号： H01L33/00

CPC分类号： H01L33/486 ,  H01L33/50 ,  H01L33/504 ,  H01L2224/16

摘要： According to one embodiment, a semiconductor light emitting device includes a semiconductor layer, a first electrode, a second electrode, an insulating film, a first interconnection, a second interconnection, a first metal pillar, a second metal pillar, a resin, and a fluorescent layer. The semiconductor layer has a first major surface, a second major surface formed on an opposite side to the first major surface, and a light emitting layer. The first electrode and the second electrode are provided on the second major surface of the semiconductor layer. The fluorescent layer faces to the first major surface of the semiconductor layer and includes a plurality of kinds of fluorescent materials having different peak wavelengths of emission light.

摘要翻译： 根据一个实施例，半导体发光器件包括半导体层，第一电极，第二电极，绝缘膜，第一互连，第二互连，第一金属柱，第二金属柱，树脂和 荧光层。 半导体层具有第一主表面，与第一主表面相反的一侧形成的第二主表面和发光层。 第一电极和第二电极设置在半导体层的第二主表面上。 荧光层面向半导体层的第一主表面，并且包括发射光的不同峰值波长的多种荧光材料。

公开(公告)号：US20130069102A1

公开(公告)日：2013-03-21

申请号：US13607418

申请日：2012-09-07

申请人： Akiya KIMURA ,  Kazuhito Higuchi ,  Hideo Nishiuchi ,  Susumu Obata ,  Toshiya Nakayama ,  Yoshiaki Sugizaki ,  Akihiro Kojima ,  Yosuke Akimoto

发明人： Akiya KIMURA ,  Kazuhito Higuchi ,  Hideo Nishiuchi ,  Susumu Obata ,  Toshiya Nakayama ,  Yoshiaki Sugizaki ,  Akihiro Kojima ,  Yosuke Akimoto

IPC分类号： H01L33/36

CPC分类号： H01L33/62 ,  H01L33/486 ,  H01L2924/0002 ,  H01L2933/0066 ,  H01L2924/00

摘要： A semiconductor light-emitting device includes a laminated body that is configured to emit light from a main surface thereof, first and second electrodes, each disposed on a surface of the laminated body that is opposite the main surface, a first terminal that is electrically coupled to the first electrode, has a concave edge but not a convex edge, and has at most three exposed sides, and a second terminal that is electrically coupled to the second electrode, has a concave edge but not a convex edge, and has at most three exposed sides.

摘要翻译： 一种半导体发光器件，包括被配置为从其主表面发光的层叠体，每个设置在层叠体的与主表面相对的表面上的第一和第二电极，电耦合的第一端子 具有凹形边缘但不具有凸边缘，并且具有至多三个外露侧面，并且电耦合到第二电极的第二端子具有凹形边缘但不具有凸起边缘，并且具有至多 三个暴露的一面。

公开(公告)号：US08373192B2

公开(公告)日：2013-02-12

申请号：US12883745

申请日：2010-09-16

申请人： Yoshiaki Sugizaki ,  Hideki Shibata ,  Akihiro Kojima ,  Masayuki Ishikawa ,  Hideo Tamura ,  Tetsuro Komatsu

发明人： Yoshiaki Sugizaki ,  Hideki Shibata ,  Akihiro Kojima ,  Masayuki Ishikawa ,  Hideo Tamura ,  Tetsuro Komatsu

IPC分类号： H01L33/00

CPC分类号： H01L25/0753 ,  H01L33/0079 ,  H01L33/508 ,  H01L33/58 ,  H01L2224/11 ,  H01L2924/0002 ,  H01L2924/3511 ,  H01L2933/0016 ,  H01L2933/0066 ,  H01L2924/00

摘要： According to one embodiment, a semiconductor light emitting device includes a plurality of semiconductor layers, a first electrode, a second electrode, an insulating layer, a first interconnection layer, a second interconnection layer, a first metal pillar, a second metal pillar and a resin layer, and is mounted in a bent state on a curved surface. The plurality of semiconductor layers includes a first main surface, a second main surface opposite to the first main surface, and a light emitting layer, the plurality of semiconductor layers being separated from one another. A material is provided between the plurality of the semiconductor layers separated from one another. The member has a higher flexibility than the semiconductor layers being.

摘要翻译： 根据一个实施例，半导体发光器件包括多个半导体层，第一电极，第二电极，绝缘层，第一互连层，第二互连层，第一金属柱，第二金属柱和 树脂层，并且以弯曲状态安装在弯曲表面上。 多个半导体层包括第一主表面，与第一主表面相对的第二主表面和发光层，所述多个半导体层彼此分离。 在彼此分离的多个半导体层之间提供材料。 该构件具有比半导体层更高的柔性。

公开(公告)号：US08309858B2

公开(公告)日：2012-11-13

申请号：US12358869

申请日：2009-01-23

申请人： Akihiro Kojima ,  Yoshiaki Sugizaki ,  Yoshiaki Shimooka

发明人： Akihiro Kojima ,  Yoshiaki Sugizaki ,  Yoshiaki Shimooka

IPC分类号： H05K1/16

CPC分类号： B81B7/0038 ,  B81B2201/0221 ,  B81B2203/04 ,  B81C1/00476

摘要： A substrate includes a functional element. An insulating first film forms a cavity which stores the functional element, together with the substrate, and includes a plurality of through-holes. An insulating second film covers the plurality of through-holes, is formed on the first film, and has a gas permeability which is higher than that of the first film. An insulating third film is formed on the second film and has a gas permeability which is lower than the second film. An insulating fourth film is formed on the third film and has an elasticity which is larger than the third film.

摘要翻译： 衬底包括功能元件。 绝缘的第一膜形成空腔，其与基板一起存储功能元件，并且包括多个通孔。 绝缘的第二膜覆盖多个通孔，形成在第一膜上，并且具有比第一膜高的透气性。 在第二薄膜上形成绝缘的第三薄膜，其透气度低于第二薄膜。 绝缘的第四膜形成在第三膜上，并且具有大于第三膜的弹性。