Methods for selective deposition to improve selectivity
    73.
    发明申请
    Methods for selective deposition to improve selectivity 有权
    用于选择性沉积以提高选择性的方法

    公开(公告)号:US20050230760A1

    公开(公告)日:2005-10-20

    申请号:US11152266

    申请日:2005-06-13

    摘要: Methods and associated apparatus of forming a microelectronic structure are described. Those methods comprise providing a substrate comprising a region of higher active area density comprising source and drain recesses and a region of lower active area density comprising source and drain recesses, wherein the region of lower active area density further comprises dummy recesses, and selectively depositing a silicon alloy layer in the source, drain and dummy recesses to enhance the selectivity and uniformity of the silicon alloy deposition.

    摘要翻译: 描述形成微电子结构的方法和相关装置。 那些方法包括提供一种衬底,其包括具有源极和漏极凹部的较高有源面积密度的区域和包括源极和漏极凹陷的较低有源面积密度的区域,其中较低有源面积密度的区域还包括虚设凹槽,并且选择性地沉积 源极,漏极和虚拟凹槽中的硅合金层,以增强硅合金沉积的选择性和均匀性。

    Semiconductor transistor having a stressed channel
    75.
    发明申请
    Semiconductor transistor having a stressed channel 审中-公开
    具有应力通道的半导体晶体管

    公开(公告)号:US20050184311A1

    公开(公告)日:2005-08-25

    申请号:US11107141

    申请日:2005-04-14

    摘要: A process is described for manufacturing an improved PMOS semiconductor transistor. Recesses are etched into a layer of epitaxial silicon. Source and drain films are deposited in the recesses. The source and drain films are made of an alloy of silicon and germanium. The alloy is epitaxially deposited on the layer of silicon. The alloy thus has a lattice having the same structure as the structure of the lattice of the layer of silicon. However, due to the inclusion of the germanium, the lattice of the alloy has a larger spacing than the spacing of the lattice of the layer of silicon. The larger spacing creates a stress in a channel of the transistor between the source and drain films. The stress increases IDSAT and IDLIN of the transistor. An NMOS transistor can be manufactured in a similar manner by including carbon instead of germanium, thereby creating a tensile stress.

    摘要翻译: 描述了用于制造改进的PMOS半导体晶体管的工艺。 凹陷被蚀刻成一层外延硅。 源极和漏极膜沉积在凹槽中。 源极和漏极膜由硅和锗的合金制成。 合金外延沉积在硅层上。 合金因此具有与硅层的晶格结构相同结构的晶格。 然而,由于包含锗,合金的晶格具有比硅层的晶格间隔更大的间隔。 较大的间距在源极和漏极膜之间的晶体管的沟道中产生应力。 应力增加晶体管的IATAT和/或DLIN 。 可以通过包括碳而不是锗来以类似的方式制造NMOS晶体管,从而产生拉伸应力。

    Polysilicon-germanium MOSFET gate electrodes
    78.
    发明授权
    Polysilicon-germanium MOSFET gate electrodes 有权
    多晶硅锗栅极电极

    公开(公告)号:US06373112B1

    公开(公告)日:2002-04-16

    申请号:US09454056

    申请日:1999-12-02

    IPC分类号: H01L2976

    CPC分类号: H01L21/2807

    摘要: An insulated gate field effect transistor (FET) of a particular conductivity type, has as a gate electrode including a polycrystalline SiGe layer. A process in accordance with the present invention includes forming an ultra-thin silicon seed film superjacent a gate dielectric layer followed by forming a SiGe layer over the seed layer. The thin Si seed layer enables deposition of the SiGe film to be substantially uniform and continuous without significant gate oxide degradation. The small thickness of the seed layer also enables effective Ge diffusion into the Si seed layer during subsequent deposition and/or subsequent thermal operations, resulting in a homogenous Ge concentration in the seed film and the SiGe overlayer.

    摘要翻译: 具有特定导电类型的绝缘栅场效应晶体管(FET)具有包括多晶SiGe层的栅电极。 根据本发明的方法包括在栅极电介质层之上形成超薄硅籽晶膜,然后在晶种层上形成SiGe层。 薄Si种子层能够使SiGe膜的沉积基本上均匀且连续,而不会显着的栅极氧化物降解。 籽晶层的厚度也使得在随后的沉积和/或随后的热操作期间能够有效地将Ge扩散到Si籽晶层中,导致种子膜和SiGe覆盖层中均匀的Ge浓度。

    NANOWIRE TRANSISTOR WITH UNDERLAYER ETCH STOPS
    79.
    发明申请
    NANOWIRE TRANSISTOR WITH UNDERLAYER ETCH STOPS 有权
    具有下层蚀刻层的纳米晶体管

    公开(公告)号:US20140264280A1

    公开(公告)日:2014-09-18

    申请号:US13996848

    申请日:2013-03-15

    摘要: A nanowire device of the present description may be produced with the incorporation of at least one underlayer etch stop formed during the fabrication of at least one nanowire transistor in order to assist in protecting source structures and/or drain structures from damage that may result from fabrication processes. The underlayer etch stop may prevent damage to the source structures andor drain the structures, when the material used in the fabrication of the source structures andor the drain structures is susceptible to being etched by the processes used in the removal of the sacrificial materials, i.e. low selectively to the source structure and/or the drain structure materials, such that potential shorting between the transistor gate electrodes and contacts formed for the source structures andor the drain structures may be prevented.

    摘要翻译: 本描述的纳米线器件可以通过结合在制造至少一个纳米线晶体管期间形成的至少一个底层蚀刻停止来产生,以便有助于保护源结构和/或漏极结构免受可能由制造产生的损伤 过程。 当用于制造源结构的材料和漏极结构易于被用于去除牺牲材料的工艺被蚀刻时,底层蚀刻停止件可以防止对源结构的损坏和排出结构,即低 选择性地连接到源极结构和/或漏极结构材料,使得可以防止晶体管栅电极和为源结构形成的触点之间的电位短路以及漏极结构。