公开(公告)号：US20170110445A1

公开(公告)日：2017-04-20

申请号：US15391424

申请日：2016-12-27

Applicant: PIL-KYU KANG ,  Byung Lyul Park ,  Taeyeong Kim ,  Yeun-Sang Park ,  Dosun Lee ,  Ho-Jin Lee ,  Jinho Chun ,  JU-IL CHOI ,  Yi Koan Hong

Inventor： PIL-KYU KANG ,  Byung Lyul Park ,  Taeyeong Kim ,  Yeun-Sang Park ,  Dosun Lee ,  Ho-Jin Lee ,  Jinho Chun ,  JU-IL CHOI ,  Yi Koan Hong

IPC: H01L25/00 ,  H01L21/304 ,  H01L23/48 ,  H01L25/065 ,  H01L21/66 ,  H01L21/768 ,  H01L23/00

CPC classification number: H01L25/50 ,  H01L21/304 ,  H01L21/561 ,  H01L21/76898 ,  H01L22/32 ,  H01L23/3128 ,  H01L23/481 ,  H01L24/03 ,  H01L24/05 ,  H01L24/06 ,  H01L24/08 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/92 ,  H01L24/94 ,  H01L25/0657 ,  H01L25/18 ,  H01L2224/0401 ,  H01L2224/05568 ,  H01L2224/0557 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/06181 ,  H01L2224/08146 ,  H01L2224/131 ,  H01L2224/13124 ,  H01L2224/13147 ,  H01L2224/16145 ,  H01L2224/16146 ,  H01L2224/16225 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/9202 ,  H01L2224/94 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06558 ,  H01L2225/06565 ,  H01L2225/06596 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/1431 ,  H01L2924/1434 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/81 ,  H01L2224/11 ,  H01L2224/03 ,  H01L2924/00014 ,  H01L2924/014

Abstract: A semiconductor device having a chip stack and an interconnection terminal is provided. The chip stack includes a first semiconductor chip, a second semiconductor chip and a third semiconductor chip stacked on each other. The interconnection terminal is electrically coupled to the chip stack. The first semiconductor chip includes a first front surface and a first backside surface. The second semiconductor chip includes a second front surface, a second backside surface, a second circuit layer and a through-electrode which is electrically coupled to the second circuit layer and penetrates the second semiconductor chip. The third semiconductor chip includes a third front surface, a third backside surface opposite to the third front surface and a third circuit layer adjacent to the third front surface. The first front surface and the second front surface face each other. The third front surface and the second backside surface face each other.

公开(公告)号：US09025089B2

公开(公告)日：2015-05-05

申请号：US12948211

申请日：2010-11-17

Applicant: Ho-Jin Lee

Inventor： Ho-Jin Lee

IPC: G02F1/1335 ,  G02F1/1333 ,  G06F3/041 ,  G06F3/01

CPC classification number: G06F3/041 ,  G06F3/016

Abstract: A touch panel device in which a support portion is provided to include an actuator for generating vibration giving an excellent sense of touch without the need for a separate mounting space. To this end, the touch panel device having a front cover portion, a touch sensor unit divided into an upper transparent electrode layer and a lower transparent electrode layer, and a substrate provided under the touch sensor portion includes an actuator for delivering vibration to the front cover portion, a reinforcing portion having the actuator attached thereto to attach the actuator to the touch sensor unit, and a support portion formed on the substrate to provide an opening in a first side thereof and a closed second side, such that the actuator is inserted into and coupled to the opening and the support portion supports the actuator to deliver the vibration of the actuator to the front cover portion.

Abstract translation: 一种触摸面板装置，其中提供支撑部分以包括用于产生振动的致动器，从而具有优异的触摸感，而不需要单独的安装空间。 为此，具有前盖部分，分为上透明电极层和下透明电极层的触摸传感器单元和设置在触摸传感器部分下方的基板的触摸面板装置包括用于将振动传递到前面的致动器 覆盖部分，具有附接到其上的致动器以将致动器附接到触摸传感器单元的加强部分，以及形成在基板上的支撑部分，以在其第一侧和闭合的第二侧提供开口，使得致动器被插入 并且支撑部分支撑致动器以将致动器的振动传递到前盖部分。

公开(公告)号：US20140217322A1

公开(公告)日：2014-08-07

申请号：US13983428

申请日：2012-01-17

Applicant: Kinji Yamada ,  Ho-Jin Lee ,  Toshimitsu Kikuchi ,  Taisuke Kasahara ,  Hiromoto Katsuyama

Inventor： Kinji Yamada ,  Ho-Jin Lee ,  Toshimitsu Kikuchi ,  Taisuke Kasahara ,  Hiromoto Katsuyama

IPC: H01G11/56

CPC classification number: H01G11/56 ,  H01G11/06 ,  H01G11/62 ,  H01G11/64 ,  Y02E60/13

Abstract: A lithium-ion capacitor includes a non-aqueous electrolyte solution that includes (A) a compound represented by the following general formula (1), (B) a cyclic carbonate ester that includes at least one carbon-carbon unsaturated bond, and (C) a carboxylic ester, the non-aqueous electrolyte solution having a ratio (MB/MC) of 0.001 to 0.5, the ratio (MB/MC) being the ratio of the content (MB) (mmol/g) of the cyclic carbonate ester (B) to the content (MC) (mmol/g) of the carboxylic ester (C). Z+.[X(CN)m(Y)n]−  (1) wherein X is at least one element selected from boron, aluminum, silicon, phosphorus, and arsenic, Y is a halogen, Z is lithium or magnesium, m is an integer from 3 to 6, and n is an integer from 0 to 5, provided that m+n≧3.

Abstract translation: 锂离子电容器包括非水电解液，其包含（A）由以下通式（1）表示的化合物，（B）包含至少一个碳 - 碳不饱和键的环状碳酸酯和（C ）羧酸酯，所述非水电解质溶液的比例（MB / MC）为0.001〜0.5，所述比例（MB / MC）为所述环状碳酸酯的含量比（MB）（mmol / g） （B）至羧酸酯（C）的含量（MC）（mmol / g）。 Z +。[X（CN）m（Y）n] - （1）其中X是选自硼，铝，硅，磷和砷中的至少一种元素，Y是卤素，Z是锂或镁，m是 3〜6的整数，n为0〜5的整数，m +n≥3。

公开(公告)号：US08678438B2

公开(公告)日：2014-03-25

申请号：US13615788

申请日：2012-09-14

Applicant: Byoung-Gae You ,  Sung-Suk Ko ,  Ho-Jin Lee

Inventor： Byoung-Gae You ,  Sung-Suk Ko ,  Ho-Jin Lee

IPC: B60R22/20

CPC classification number: B60R21/055 ,  B60R22/24 ,  B60R2022/1818

Abstract: A seat belt apparatus for a vehicle including an anchor metal plate coupled with a vehicle body by a fastening bolt to extensively support a seat belt and upper and lower covers to receive the anchor metal plate. A contact rib is formed on at least one side portion of the inner surface of the upper cover, and a sidewall is formed on a side portion of the lower cover to make contact with the contact rib. An arc-type rib is formed on the bottom plate of the lower cover corresponding to an outer peripheral portion of at least one side portion of the base portion of the anchor metal plate, and a connection rib is formed between the arc-type rib and the sidewall. An arc-type slot is formed on the bottom plate of the lower cover.

Abstract translation: 一种用于车辆的安全带装置，包括通过紧固螺栓与车体联接的锚金属板，以广泛地支撑安全带和上盖和下盖以接收锚金属板。 接触肋形成在上盖的内表面的至少一个侧部上，并且侧壁形成在下盖的侧部上以与接触肋接触。 在下盖的底板上形成弧形肋，该底板对应于锚金属板的基部的至少一个侧部的外周部分，并且在弧形肋和 侧壁。 在下盖的底板上形成弧形槽。

公开(公告)号：US08482129B2

公开(公告)日：2013-07-09

申请号：US13027594

申请日：2011-02-15

Applicant: In-Young Lee ,  Ho-Jin Lee ,  Hyun-Soo Chung ,  Ju-Il Choi ,  Son-Kwan Hwang

Inventor： In-Young Lee ,  Ho-Jin Lee ,  Hyun-Soo Chung ,  Ju-Il Choi ,  Son-Kwan Hwang

IPC: H01L23/48

CPC classification number: H01L21/76898 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/81 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/05009 ,  H01L2224/0557 ,  H01L2224/06181 ,  H01L2224/11462 ,  H01L2224/13009 ,  H01L2224/13022 ,  H01L2224/13025 ,  H01L2224/13099 ,  H01L2224/13147 ,  H01L2224/16 ,  H01L2224/81801 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2924/0002 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01055 ,  H01L2924/0106 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/14 ,  H01L2924/19043 ,  H01L2224/05552

Abstract: A method of manufacturing a semiconductor device includes forming an integrated circuit region on a semiconductor wafer. A first metal layer pattern is formed over the integrated circuit region. A via hole is formed to extend through the first metal layer pattern and the integrated circuit region. A final metal layer pattern is formed over the first metal layer pattern and within the via hole. A plug is formed within the via hole. Thereafter, a passivation layer is formed to overlie the final metal layer pattern.

Abstract translation: 一种制造半导体器件的方法包括在半导体晶片上形成集成电路区域。 在集成电路区域上形成第一金属层图案。 通孔形成为延伸穿过第一金属层图案和集成电路区域。 最终的金属层图案形成在第一金属层图案之上并且在通孔内。 在通孔内形成插头。 此后，形成钝化层以覆盖最终金属层图案。

公开(公告)号：US08426252B2

公开(公告)日：2013-04-23

申请号：US13537953

申请日：2012-06-29

Applicant: Hyun-Soo Chung ,  Ho-Jin Lee ,  Dong-Hyun Jang ,  Dong-Ho Lee

Inventor： Hyun-Soo Chung ,  Ho-Jin Lee ,  Dong-Hyun Jang ,  Dong-Ho Lee

IPC: H01L21/00 ,  H01L21/44

CPC classification number: H01L25/0657 ,  H01L21/76898 ,  H01L23/481 ,  H01L25/50 ,  H01L2224/02371 ,  H01L2224/02372 ,  H01L2224/0401 ,  H01L2224/13025 ,  H01L2224/274 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2924/01079 ,  H01L2924/01087

Abstract: In a semiconductor device package having a stress relief spacer, and a manufacturing method thereof, metal interconnect fingers extend from the body of a chip provide for chip interconnection. The metal fingers are isolated from the body of the chip by a stress-relief spacer. In one example, such isolation takes the form of an air gap. In another example, such isolation takes the form of an elastomer material. In either case, mismatch in coefficient of thermal expansion between the metal interconnect fingers and the body of the chip is avoided, alleviating the problems associated with cracking and delamination, and leading to improved device yield and device reliability.

公开(公告)号：US08217768B2

公开(公告)日：2012-07-10

申请号：US12498683

申请日：2009-07-07

Applicant: Ho-Jin Lee ,  Young-Min Lee ,  Shi-Yun Cho ,  Ho-Seong Seo ,  Youn-Ho Choi ,  Ji-Hyun Jung

Inventor： Ho-Jin Lee ,  Young-Min Lee ,  Shi-Yun Cho ,  Ho-Seong Seo ,  Youn-Ho Choi ,  Ji-Hyun Jung

IPC: H04B3/36

CPC classification number: H04M1/72544 ,  G06F3/016

Abstract: An apparatus and method for allowing a user to dynamically enjoy a video. A difference between image data is computed at every preset unit of time and a vibration corresponding to the computed difference is generated so that the user can sense a motion change of an object within the video. Upon video reproduction, scenes are displayed by applying the lighting effect of a strobe light or the like between the scenes to be reproduced. Upon video reproduction, more enjoyment and various haptic effects can be provided to the user.

Abstract translation: 一种用于允许用户动态地欣赏视频的装置和方法。 在每个预设的时间单位计算图像数据之间的差异，并且生成与所计算的差异相对应的振动，使得用户可以感测视频内的对象的运动变化。 在视频再现时，通过在要再现的场景之间施加闪光灯等的照明效果来显示场景。 在视频再现时，可以向用户提供更多的享受和各种触觉效果。

公开(公告)号：US20120104608A1

公开(公告)日：2012-05-03

申请号：US13346191

申请日：2012-01-09

Applicant: Hyun-Soo Chung ,  Ho-Jin Lee ,  Dong-Hyun Jang ,  Dong-Ho Lee

Inventor： Hyun-Soo Chung ,  Ho-Jin Lee ,  Dong-Hyun Jang ,  Dong-Ho Lee

IPC: H01L25/07

CPC classification number: H01L25/0657 ,  H01L21/76898 ,  H01L23/481 ,  H01L25/50 ,  H01L2224/02371 ,  H01L2224/02372 ,  H01L2224/0401 ,  H01L2224/13025 ,  H01L2224/274 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2924/01079 ,  H01L2924/01087

Abstract: In a semiconductor device package having a stress relief spacer, and a manufacturing method thereof, metal interconnect fingers extend from the body of a chip provide for chip interconnection. The metal fingers are isolated from the body of the chip by a stress-relief spacer. In one example, such isolation takes the form of an air gap. In another example, such isolation takes the form of an elastomer material. In either case, mismatch in coefficient of thermal expansion between the metal interconnect fingers and the body of the chip is avoided, alleviating the problems associated with cracking and delamination, and leading to improved device yield and device reliability.

Abstract translation: 在具有应力消除间隔物的半导体器件封装及其制造方法中，从芯片本体延伸的金属互连指状物提供芯片互连。 金属手指通过应力消除间隔物与芯片的主体隔离。 在一个示例中，这种隔离采取气隙的形式。 在另一个实例中，这种隔离采用弹性体材料的形式。 在这两种情况下，都避免了金属互连指和芯体之间的热膨胀系数的不匹配，从而减轻了与开裂和分层相关的问题，从而提高了器件的产量和器件的可靠性。

公开(公告)号：US20110149836A1

公开(公告)日：2011-06-23

申请号：US12943182

申请日：2010-11-10

Applicant: Tae-Chul HONG ,  Kunseok Kang ,  Do-Seob Ahn ,  Ho-Jin Lee

Inventor： Tae-Chul HONG ,  Kunseok Kang ,  Do-Seob Ahn ,  Ho-Jin Lee

IPC: H04B7/185 ,  H04W52/04

CPC classification number: H04B7/18543 ,  H04L1/0003 ,  H04L1/0009 ,  H04L1/0021 ,  H04L1/0026 ,  H04L1/0028 ,  H04W52/262 ,  H04W52/58

Abstract: A power controlled adaptive modulation and coding (AMC) scheme in a satellite communications system includes: calculating, by a user terminal, a received signal-to-noise ratio (SNR) through a packet received from a base station; removing a power control level applied to a packet received before the received packet from the calculated received SNR, and deciding the value obtained by decreasing the calculated received SNR by the power control level; deciding an AMC mode based on the decided received SNR; determining whether power control is required, and deciding a required power control magnitude depending on a channel state positioned in the AMC mode range; transmitting the decided AMC mode and the decided power control information to the base station through channel quality indicator (CQI) feedback; and applying the AMC mode based on information received, and increasing a power by a power control magnitude decided from the received information.

Abstract translation: 卫星通信系统中的功率控制自适应调制和编码（AMC）方案包括：由用户终端通过从基站接收到的分组来计算接收信噪比（SNR）; 从所计算的接收到的SNR中去除应用于在接收到的分组之前接收到的分组的功率控制电平，以及通过将所计算的接收SNR减小所获得的值来确定功率控制电平; 基于所确定的接收到的SNR来决定AMC模式; 确定是否需要功率控制，以及根据位于AMC模式范围内的信道状态来确定所需的功率控制幅度; 通过信道质量指示符（CQI）反馈将决定的AMC模式和决定的功率控制信息发送到基站; 以及基于所接收的信息应用AMC模式，并且通过从所接收的信息确定的功率控制量来增加功率。

公开(公告)号：US20110116230A1

公开(公告)日：2011-05-19

申请号：US13002888

申请日：2009-07-21

Applicant: Changsoo Kwak ,  In-Bok Yom ,  So-Hyeun Yun ,  Donghwan Shin ,  Ho-Jin Lee

Inventor： Changsoo Kwak ,  In-Bok Yom ,  So-Hyeun Yun ,  Donghwan Shin ,  Ho-Jin Lee

IPC: H05K7/20

CPC classification number: H01Q1/02 ,  H01Q1/42

Abstract: A system for controlling temperature of an antenna module including a heat generating module, and a radome and an underbody cover that enclose the heat generating module. The system includes: a heat collecting unit mounted on inner surface of the antenna module; a heat discharging unit mounted on outer surface of the antenna module; and a heat transfer unit for transferring heat from the heat collecting unit to the heat discharging unit.

Abstract translation: 一种用于控制包括发热模块的天线模块的温度的系统，以及包围发热模块的天线罩和底盖。 该系统包括：安装在天线模块的内表面上的集热单元; 安装在所述天线模块的外表面上的放热单元; 以及用于将热量从集热单元传递到散热单元的传热单元。