摘要:
Techniques for combining volatile and non-volatile programmable logic into one integrated circuit (IC) are provided. An IC is segregated into two portions. A first block of programmable logic is configured by bits stored in on-chip non-volatile memory. A second block of programmable logic is configured by bits stored in off-chip memory. The function of IO banks on the IC is multiplexed between the two logic blocks of the IC. The programmable logic in the first block can be configured and fully functional in a fraction of the time that the programmable logic in the second block can be configured. The programmable logic in the first block can configure fast enough and have enough independence to assist in the configuration of the second block. The non-volatile memory can also provide security features to a user design, such as encryption.
摘要:
A method of fabricating a non-volatile memory cell on a semiconductor substrate is disclosed. An area of a first region of the semiconductor substrate designated for a layer of floating polysilicon is blocked while a second region of the semiconductor substrate designated for a layer of non-floating polysilicon is exposed. Exposed regions of the semiconductor substrate are doped with charges.
摘要:
A layout architecture for a programmable logic device comprising one or more adjacent metal lines, a first circuit, and a second circuit. The one or more adjacent metal lines may each comprise a critical path. The first circuit may be configured to present an input signal to each of the one or more adjacent metal lines in response to a configuration signal. The second circuit may be configured to (i) receive a signal from at least one of the one or more adjacent metal lines selected in response to the configuration signal and (ii) generate an output signal in response to the received signal.
摘要:
A method of forming non-volatile memory (e.g., an EEPROM device) and a CMOS device (e.g., a RAM), on a single die or chip, and a structure formed by the method. In one embodiment, the control gate of the storage transistor as well as the isolation gate of the isolation transistor may be formed during the same manufacturing process step, and thus may be formed of the same gate poly material and may have similar thickness.
摘要:
Asymmetric transistors such as asymmetric pass transistors may be formed on an integrated circuit. The asymmetric transistors may have gate structures. Symmetric pocket implants may be formed in source-drains on opposing sides of each transistor gate structure. Selective heating may be used to asymmetrically diffuse the implants. Selective heating may be implemented by patterning the gate structures on a semiconductor substrate so that the spacing between adjacent gate structures varies. A given gate structure may be located between first and second adjacent gate structures spaced at different respective distances from the given gate structure. A larger gate structure spacing leads to a greater substrate temperature rise than a smaller gate structure spacing. The pocket implant diffuses more in portions of the substrate with the greater temperature rise, producing asymmetric transistors. Asymmetric pass transistors may be controlled by static control signals from memory elements to implement circuits such as programmable multiplexers.
摘要:
An IC that includes a memory cell and a pass gate coupled to the memory cell, where the pass gate includes a PMOS transistor, is described. In one implementation, the PMOS transistor has a negative threshold voltage. In one implementation, the memory cell includes thick oxide transistors.
摘要:
An electrostatic discharge (ESD) protection structure comprising a polysilicon gate on an insulating layer on a substrate, said gate having first and second sides, a first heavily doped P-region in the substrate on the first side of the gate, a first heavily doped N-region in the substrate on the second side of the gate, and a shallow trench isolation isolating said first P-region and said first N-region from other structures in the substrate. In a first embodiment, the heavily doped regions are formed in a well having opposite conductivity to that of the substrate and a diode is formed at a PN junction between one of the heavily doped regions and the well. To minimize capacitance between the well and the substrate, the substrate is doped at a level of native doping and the well is isolated so that no other wells or heavily-doped regions are nearby in the substrate. Doping levels in the well and the dimensions of the gate are controlled to minimize on resistance (Ron) of the diode. In a second embodiment, no well is used.
摘要:
Integrated circuits such as programmable integrated circuits may include programmable logic regions that can be configured to perform custom user functions. The programmable logic regions may produce output signals. The integrated circuit may include interconnects that route selected output signals throughout the integrated circuit. The integrated circuit may include output selection circuitry having output selection and interconnect selection stages. The output selection circuitry may be configured to select which of the output signals produced by the programmable logic regions are provided to the interconnects for routing. The interconnect selection stage may be formed using multiplexing circuits or tristate drivers. Logic design system computing equipment may be used to generate configuration data that can be used to program the output selection circuitry to reduce crosstalk by routing signals away from critical interconnects or by double-driving critical interconnects.
摘要:
Asymmetric transistors such as asymmetric pass transistors may be formed on an integrated circuit. The asymmetric transistors may have gate structures. Symmetric pocket implants may be formed in source-drains on opposing sides of each transistor gate structure. Selective heating may be used to asymmetrically diffuse the implants. Selective heating may be implemented by patterning the gate structures on a semiconductor substrate so that the spacing between adjacent gate structures varies. A given gate structure may be located between first and second adjacent gate structures spaced at different respective distances from the given gate structure. A larger gate structure spacing leads to a greater substrate temperature rise than a smaller gate structure spacing. The pocket implant diffuses more in portions of the substrate with the greater temperature rise, producing asymmetric transistors. Asymmetric pass transistors may be controlled by static control signals from memory elements to implement circuits such as programmable multiplexers.
摘要:
The present invention is a trigger device useful, for example, in triggering an SCR in an ESD protection circuit. Illustratively, an NMOS trigger device comprises a gate and heavily doped P and N regions in a P-well on opposite sides of the gate. A first N type source/drain extension and a first P-type pocket region extend from the P region toward the N region with the pocket region located under the source/drain extension and extending under the gate. A second N-type source/drain extension and a second P-type pocket region extend from the N region toward the P region with the pocket region located under the source/drain extension and extending under the gate. Preferably, the gate itself is heavily doped so that one half of the gate on the side adjacent the heavily doped P region is also heavily doped with dopants of P-type conductivity and the other half of the gate on the side adjacent the heavily doped N region is also heavily doped with dopants of N-type conductivity. Doping the gate increases the threshold voltage by about one Volt due to an increase in the work function on the source side of the gate.