Memory devices including indium-containing materials, and related electronic systems

    公开(公告)号:US11908948B2

    公开(公告)日:2024-02-20

    申请号:US17821414

    申请日:2022-08-22

    CPC classification number: H01L29/7869 H01L29/66969 H10B41/41 H10B43/40

    Abstract: A transistor comprises a lower contact structure, a channel structure, a dielectric fill structure, and an upper contact structure. The lower contact structure comprises a first oxide semiconductive material. The channel structure contacts the lower contact structure and comprises a second oxide semiconductive material having a smaller atomic concentration of one or more metals than the first oxide semiconductive material. The dielectric fill structure contacts an inner side surface of the channel structure and has a recessed upper surface relative to the channel structure. The upper contact structure comprises a third oxide semiconductive material having a greater atomic concentration of the one or more metals than the channel structure. The upper contact structure comprises a first portion contacting the upper surface of the dielectric fill structure and the inner side surface of the channel structure, and a second portion contacting the upper surface of the channel structure.

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