公开(公告)号：US06790763B2

公开(公告)日：2004-09-14

申请号：US10182835

申请日：2002-10-11

申请人： Fumio Kondo ,  Koji Mishima ,  Akira Tanaka ,  Yoko Suzuki ,  Tetsuji Togawa ,  Hiroaki Inoue

发明人： Fumio Kondo ,  Koji Mishima ,  Akira Tanaka ,  Yoko Suzuki ,  Tetsuji Togawa ,  Hiroaki Inoue

IPC分类号： H01L214763

CPC分类号： H01L21/67161 ,  B24B37/005 ,  B24B37/042 ,  B24B37/245 ,  B24B37/345 ,  B24B41/061 ,  B24B49/16 ,  C23C18/1632 ,  C23C18/1653 ,  C25D7/123 ,  H01L21/02074 ,  H01L21/02087 ,  H01L21/0209 ,  H01L21/288 ,  H01L21/2885 ,  H01L21/3212 ,  H01L21/67167 ,  H01L21/67173 ,  H01L21/67184 ,  H01L21/67219 ,  H01L21/6723 ,  H01L21/67393 ,  H01L21/67396 ,  H01L21/67772 ,  H01L21/7684 ,  H01L21/76843 ,  H01L21/76849 ,  H01L21/76864 ,  H01L21/76873 ,  H01L21/76874 ,  H01L21/76877

摘要： A substrate processing method comprising steps for forming a copper film on a surface of a substrate. These steps includes the step of filling a first metal in the trenches so as to form a plated film of the first metal on an entire surface of the substrate by electroplating, wherein the electromagnetic field is adjusted by the virtual anode so that differences of thickness of the plated film between the central portion and the peripheral portion of the substrate being minimized, and polishing and removing the plated film by pressing the substrate to the polishing surface, wherein the pressures pressing the substrate to the polishing surface at a central portion and a peripheral portion are adjusted.

公开(公告)号：US06447385B1

公开(公告)日：2002-09-10

申请号：US09605989

申请日：2000-06-29

申请人： Tetsuji Togawa ,  Nobuyuki Takada

发明人： Tetsuji Togawa ,  Nobuyuki Takada

IPC分类号： B24B500

CPC分类号： B24B37/345

摘要： A polishing apparatus applicable to a dry-in/dry-out polishing system is capable of increasing the capacity of processing substrates to be polished, e.g. semiconductor wafers, per unit of time and per unit area of installation. A polishing unit includes a turntable having a polishing surface, and at least two wafer carriers each adapted to hold a wafer and to press the wafer against the polishing surface. Each wafer carrier is supported by a pivot shaft and movable between a polishing position where the wafer is polished on the turntable and a transfer position for transferring the wafer. The at least two wafer carriers can be situated at the polishing position simultaneously and also alternately.

摘要翻译： 适用于干式/干式抛光系统的抛光装置能够增加处理待抛光衬底的能力，例如， 半导体晶片，每单位时间和每单位安装面积。 抛光单元包括具有抛光表面的转盘和至少两个晶片载体，每个晶片载体适于保持晶片并将晶片压靠在抛光表面上。 每个晶片载体由枢转轴支撑，并且可在转盘上抛光晶片的抛光位置和用于转移晶片的转移位置之间移动。 至少两个晶片载体可以同时并且交替地位于抛光位置。

公开(公告)号：US06409582B1

公开(公告)日：2002-06-25

申请号：US09531589

申请日：2000-03-20

申请人： Tetsuji Togawa ,  Kuniaki Yamaguchi ,  Shunichiro Kojima ,  Toyomi Nishi

发明人： Tetsuji Togawa ,  Kuniaki Yamaguchi ,  Shunichiro Kojima ,  Toyomi Nishi

IPC分类号： B24B722

CPC分类号： B24B37/345 ,  B08B3/02 ,  B24B41/005 ,  H01L21/67051

摘要： A polishing apparatus is used for polishing a workpiece such as a semiconductor wafer to a flat mirror finish. The polishing apparatus, includes a turntable having a polishing surface thereon, and a top ring for holding a workpiece to be polished and pressing the workpiece against the polishing surface on the turntable. A pusher is disposed in a position for transferring the workpiece to and from the top ring, and has a workpiece support which can be lifted to a position close to the top ring for transferring the workpiece to and from the top ring. When the workpiece support receives a polished workpiece and is lowered, a cleaning liquid is ejected substantially simultaneously from three cleaning nozzle units that are disposed in respective three positions to clean the upper and lower surfaces of the workpiece and the lower surface of the top ring.

摘要翻译： 抛光装置用于将诸如半导体晶片的工件抛光到平面镜面。 抛光装置包括其上具有抛光表面的转台和用于保持要抛光的工件的顶环，并将工件压靠在转盘上的抛光表面上。 推动器设置在用于将工件传递到顶环的位置并且具有可以被提升到靠近顶环的位置的工件支撑件，用于将工件传送到顶环和从顶环移出。 当工件支撑件接收到抛光的工件并且被降低时，基本上同时从设置在三个位置的清洁喷嘴单元喷射清洁液体，以清洁工件的上表面和下表面以及顶环的下表面。

公开(公告)号：US06338669B1

公开(公告)日：2002-01-15

申请号：US09509997

申请日：2000-06-15

申请人： Tetsuji Togawa ,  Kuniaki Yamaguchi

发明人： Tetsuji Togawa ,  Kuniaki Yamaguchi

IPC分类号： B24B100

CPC分类号： B24B57/02 ,  B24B37/04

摘要： This invention relates to a polishing machine for polishing an article such as a semiconductor wafer. A movable arm is located at a liquid supply position for supplying a liquid such as a polishing liquid onto a polishing surface of a turntable. The arm is also adapted to be moved to and held at a retracted position radially outside the polishing surface. At the liquid supply position, liquid supply nozzles supported on the arm are brought into a condition such that the nozzles are close to a position on the polishing surface where the liquid is to be supplied, whereby the liquid is accurately supplied onto the position. Holding the arm at the retracted position makes it easy to conduct a maintenance work for the polishing surface and so on.

摘要翻译： 本发明涉及一种用于抛光诸如半导体晶片的物品的抛光机。 可移动臂位于用于将诸如抛光液体的液体供应到转台的抛光表面上的液体供应位置。 臂也适于被移动并保持在抛光表面的径向外侧的缩回位置。 在液体供给位置，支撑在臂上的液体供给喷嘴处于这样的状态，使得喷嘴靠近要供应液体的抛光表面上的位置，从而将液体精确地供应到该位置。 将臂保持在缩回位置使得易于进行抛光表面的维护工作等。

公开(公告)号：US06319105B1

公开(公告)日：2001-11-20

申请号：US09327650

申请日：1999-06-08

申请人： Tetsuji Togawa ,  Takeshi Sakurai ,  Nobuyuki Takada

发明人： Tetsuji Togawa ,  Takeshi Sakurai ,  Nobuyuki Takada

IPC分类号： B24B2900

CPC分类号： B24B53/017 ,  H01L21/67051

摘要： A polishing apparatus includes a cleaning device for critical cleaning of a top ring or a dressing tool to obtain high quality polishing by minimizing surface damage caused by contaminants originating from the top ring and/or dressing tool. The polishing apparatus includes a polishing table; a workpiece holding member for pressing a workpiece onto the polishing table; a dressing tool for conditioning a work surface provided on the polishing table. A cleaning device is provided for cleaning the dressing tool and/or the workpiece holding member. The cleaning device is provided with a spray nozzle for directing a cleaning solution toward at least an upper surface of the workpiece holding member or the dressing tool.

摘要翻译： 抛光装置包括清洁装置，用于通过最小化由顶环和/或修整工具产生的污染物引起的表面损伤来对顶环或修整工具进行临界清洁以获得高质量的抛光。 抛光装置包括：抛光台; 工件保持构件，用于将工件压在抛光台上; 用于调节设置在抛光台上的工作表面的修整工具。 提供了用于清洁修整工具和/或工件保持构件的清洁装置。 清洁装置设置有用于将清洁溶液引导至至少工件保持构件或修整工具的上表面的喷嘴。

公开(公告)号：US06312312B1

公开(公告)日：2001-11-06

申请号：US09175561

申请日：1998-10-20

申请人： Tetsuji Togawa ,  Nobuyuki Takada ,  Seiji Katsuoka ,  Hiroyuki Osawa

发明人： Tetsuji Togawa ,  Nobuyuki Takada ,  Seiji Katsuoka ,  Hiroyuki Osawa

IPC分类号： B24B722

CPC分类号： B24B37/345 ,  B23Q7/06 ,  B24B37/04

摘要： A polishing apparatus is used for polishing a workpiece such as a semiconductor wafer to a flat mirror finish. The polishing apparatus includes a turntable having a polishing surface, a top ring for supporting the workpiece to be polished and pressing the workpiece against the polishing surface, and a transferring device for transferring the workpiece between the top ring and the transferring device. The transferring device includes a stage having a support surface for supporting the workpiece, an actuating unit for moving the stage in a vertical direction, and a guide member disposed radially outwardly of the stage and having a guide surface of an inverted conical shape. The centering of the workpiece is conducted by bringing a periphery of the workpiece into contact with the guide surface, and then the workpiece is transferred from the transferring device to the top ring by raising the stage.

摘要翻译： 抛光装置用于将诸如半导体晶片的工件抛光到平面镜面。 抛光装置包括具有研磨面的转台，用于支撑待研磨的工件的顶环，将工件压靠在研磨面上，以及用于在顶环和转印装置之间传递工件的转印装置。 转印装置包括具有用于支撑工件的支撑表面的台，用于沿垂直方向移动台的致动单元和设置在该台的径向外侧并具有倒圆锥形形状的引导表面的引导构件。 通过使工件的周边与引导面接触来进行工件的定心，然后通过升高工作台将工件从传送装置传送到顶环。

公开(公告)号：US6074276A

公开(公告)日：2000-06-13

申请号：US215147

申请日：1998-12-18

申请人： Miki Shibata ,  Toyomi Nishi ,  Hidetaka Nakao ,  Tetsuji Togawa

发明人： Miki Shibata ,  Toyomi Nishi ,  Hidetaka Nakao ,  Tetsuji Togawa

IPC分类号： B24B37/04 ,  B24B49/00 ,  B24B55/00 ,  B24B55/12 ,  B24B57/02 ,  H01L21/302 ,  B24B7/24

CPC分类号： B24B57/02 ,  B24B37/005 ,  B24B37/04 ,  B24B49/00 ,  B24B55/00 ,  B24B55/12 ,  H01L21/302 ,  Y10T137/5762

摘要： A polishing apparatus is used for polishing a workpiece such as a semiconductor wafer to a flat mirror finish. The polishing apparatus includes a polishing section for polishing a surface of a workpiece, a cleaning section for cleaning the workpiece which has been polished, a first liquid leakage sensor provided in the polishing section for detecting a liquid leakage which occurs in the polishing section, and a second liquid leakage sensor provided in the cleaning section for detecting a liquid leakage which occurs in the cleaning section. The polishing apparatus further includes a controlling device for stopping the supply of liquid to the polishing section or the cleaning section in which the liquid leakage occurs when either one of the first and second liquid leakage sensors detects the liquid leakage.

摘要翻译： 抛光装置用于将诸如半导体晶片的工件抛光到平面镜面。 抛光装置包括用于抛光工件表面的抛光部分，用于清洁已经被抛光的工件的清洁部分，设置在用于检测在抛光部分中发生的液体泄漏的抛光部分中的第一液体泄漏传感器，以及 第二液体泄漏传感器，设置在清洁部分中，用于检测在清洁部分中发生的液体泄漏。 抛光装置还包括一个控制装置，用于当第一和第二液体泄漏传感器中的任何一个检测到液体泄漏时，停止向抛光部分或清洁部分供应液体泄漏。

公开(公告)号：US08641480B2

公开(公告)日：2014-02-04

申请号：US13036114

申请日：2011-02-28

申请人： Masayuki Nakanishi ,  Tetsuji Togawa ,  Kenya Ito ,  Masaya Seki ,  Kenji Iwade ,  Takeo Kubota ,  Takeshi Nishioka

发明人： Masayuki Nakanishi ,  Tetsuji Togawa ,  Kenya Ito ,  Masaya Seki ,  Kenji Iwade ,  Takeo Kubota ,  Takeshi Nishioka

IPC分类号： B24B1/00

CPC分类号： B24B1/00 ,  B24B55/00

摘要： A polishing apparatus can effectively prevent abrasive particles from falling off a polishing tape during polishing. The polishing apparatus includes: a polishing head for polishing a peripheral portion of a substrate by pressing a surface of a polishing tape, having abrasive particles fixed on the surface, against the peripheral portion of the substrate while allowing the polishing tape to travel in one direction; and a conditioning apparatus, disposed upstream of the polishing head in the traveling direction of the polishing tape, for conditioning the surface of the polishing tape in advance in order to prevent the abrasive particles from falling off the surface of the polishing tape during polishing.

摘要翻译： 抛光装置可以有效地防止研磨颗粒在抛光过程中从抛光带上脱落。 抛光装置包括：抛光头，用于通过将具有固定在表面上的研磨颗粒的研磨带的表面按压在基板的周边部分上，同时允许研磨带沿单向移动来抛光基板的周边部分 ; 以及调整装置，其设置在研磨带的行进方向上的抛光头的上游，用于预先调整研磨带的表面，以防止研磨颗粒在抛光期间从研磨带的表面脱落。

公开(公告)号：US08292694B2

公开(公告)日：2012-10-23

申请号：US12618033

申请日：2009-11-13

申请人： Tetsuji Togawa ,  Toshio Watanabe ,  Hiroyuki Yano ,  Gen Toyota ,  Kenji Iwade ,  Yoshikuni Tateyama

发明人： Tetsuji Togawa ,  Toshio Watanabe ,  Hiroyuki Yano ,  Gen Toyota ,  Kenji Iwade ,  Yoshikuni Tateyama

IPC分类号： B24B49/00

CPC分类号： B24B37/015 ,  B24B41/061 ,  B24B55/02

摘要： A substrate holding mechanism, a substrate polishing apparatus and a substrate polishing method have functions capable of minimizing an amount of heat generated during polishing of a substrate to be polished and of effectively cooling a substrate holding part of the substrate holding mechanism, and also capable of effectively preventing a polishing solution and polishing dust from adhering to an outer peripheral portion of the substrate holding part and drying thereon. The substrate holding mechanism has a mounting flange, a support member 6 and a retainer ring. A substrate to be polished is held on a lower side of the support member surrounded by the retainer ring, and the substrate is pressed against a polishing surface of a polishing table. The mounting flange is provided with a flow passage contiguous with at least the retainer ring. A temperature-controlled gas is supplied through the flow passage to cool the mounting flange, the support member and the retainer ring. The retainer ring is provided with a plurality of through-holes communicating with the flow passage to spray the gas flowing through the flow passage onto the polishing surface of the polishing table.

摘要翻译： 基板保持机构，基板研磨装置和基板研磨方法具有能够使待研磨基板的抛光时产生的热量最小化的功能，并有效地冷却基板保持机构的基板保持部，并且还能够 有效地防止研磨液和抛光尘埃附着在基板保持部的外周部并干燥。 基板保持机构具有安装凸缘，支撑构件6和保持环。 待研磨的基板被保持在由保持环包围的支撑构件的下侧，并且基板被压靠在抛光台的抛光表面上。 安装凸缘设置有至少与保持环相邻的流动通道。 通过流路供给温度控制气体以冷却安装凸缘，支撑构件和保持环。 保持环设置有与流路连通的多个通孔，以将流过流道的气体喷射到抛光台的抛光表面上。

公开(公告)号：US07670206B2

公开(公告)日：2010-03-02

申请号：US10559135

申请日：2004-06-17

申请人： Tetsuji Togawa ,  Koichi Fukaya ,  Mitsuo Tada ,  Taro Takahashi ,  Yasunari Suto

发明人： Tetsuji Togawa ,  Koichi Fukaya ,  Mitsuo Tada ,  Taro Takahashi ,  Yasunari Suto

IPC分类号： B24B49/00

CPC分类号： B24B37/013 ,  B24B49/105 ,  B24B49/12 ,  B24B49/16

摘要： The present invention relates to a substrate polishing apparatus and a substrate polishing method for polishing a substrate such as a semiconductor wafer to a flat finish. The substrate polishing apparatus includes a polishing table (100) having a polishing surface (101), a substrate holder (1) for holding and pressing a substrate (W) against the polishing surface (101) of the polishing table (100), and a film thickness measuring device (200) for measuring a thickness of a film on the substrate (W). The substrate holder (1) has a plurality of pressure adjustable chambers (22 to 25), and pressures in the respective chambers (22 to 25) are adjusted based on the film thickness measured by the film thickness measuring device (200).