SOI CMOS COMPATIBLE MULTIPLANAR CAPACITOR
    71.
    发明申请
    SOI CMOS COMPATIBLE MULTIPLANAR CAPACITOR 有权
    SOI CMOS兼容多元电容器

    公开(公告)号:US20090072290A1

    公开(公告)日:2009-03-19

    申请号:US11857770

    申请日:2007-09-19

    IPC分类号: H01L21/70 H01L27/108

    摘要: An isolated shallow trench isolation portion is formed in a top semiconductor portion of a semiconductor-on-insulator substrate along with a shallow trench isolation structure. A trench in the shape of a ring is formed around a doped top semiconductor portion and filled with a conductive material such as doped polysilicon. The isolated shallow trench isolation portion and the portion of a buried insulator layer bounded by a ring of the conductive material are etched to form a cavity. A capacitor dielectric is formed on exposed semiconductor surfaces within the cavity and above the doped top semiconductor portion. A conductive material portion formed in the trench and above the doped top semiconductor portion constitutes an inner electrode of a capacitor, while the ring of the conductive material, the doped top semiconductor portion, and a portion of a handle substrate abutting the capacitor dielectric constitute a second electrode.

    摘要翻译: 孤立的浅沟槽隔离部分形成在绝缘体上半导体衬底的顶部半导体部分以及浅沟槽隔离结构中。 环形形状的沟槽形成在掺杂顶部半导体部分周围,并填充有诸如掺杂多晶硅的导电材料。 隔离的浅沟槽隔离部分和由导电材料的环限定的掩​​埋绝缘体层的部分被蚀刻以形成空腔。 在空腔内的暴露的半导体表面上和掺杂的顶部半导体部分之上形成电容器电介质。 形成在沟槽中并且在掺杂顶部半导体部分上方的导电材料部分构成电容器的内部电极,而导电材料的环,掺杂的顶部半导体部分和与电容器电介质邻接的手柄衬底的一部分构成一个 第二电极。

    Method of fabricating a bipolar transistor having reduced collector-base capacitance
    72.
    发明授权
    Method of fabricating a bipolar transistor having reduced collector-base capacitance 失效
    制造具有减小的集电极 - 基极电容的双极晶体管的方法

    公开(公告)号:US07462547B2

    公开(公告)日:2008-12-09

    申请号:US11633380

    申请日:2006-12-04

    IPC分类号: H01L21/331 H01L27/082

    摘要: A method is provided for fabricating a bipolar transistor that includes growing an epitaxial layer onto an underlaying region having a low dopant concentration and a trench isolation region defining the edges of an active region layer, implanting a portion of the epitaxial layer through a mask to define a collector region having a relatively high dopant concentration, the collector region laterally adjoining a second region of the epitaxial layer having the low dopant concentration; forming an intrinsic base layer overlying the collector region and the second region, the intrinsic base layer including an epitaxial region in conductive communication with the collector region; forming a low-capacitance region laterally separated from the collector region by the second region, the low-capacitance region including a dielectric region disposed in an undercut directly underlying the intrinsic base layer; and forming an emitter layer overlying the intrinsic base layer.

    摘要翻译: 提供了一种用于制造双极晶体管的方法,该双极晶体管包括将外延层生长到具有低掺杂剂浓度的衬底区域和限定有源区域层的边缘的沟槽隔离区域,通过掩模注入外延层的一部分以限定 具有相对较高掺杂剂浓度的集电极区域,所述集电极区域横向邻接所述外延层的具有低掺杂浓度的第二区域; 形成覆盖所述集电极区域和所述第二区域的本征基极层,所述本征基极层包括与所述集电极区域导通连通的外延区域; 形成由所述第二区域与所述集电极区域横向分离的低电容区域,所述低电容区域包括设置在所述本征基极层下方的底切处的电介质区域; 并形成覆盖本征基层的发射极层。

    MONITORING IONIZING RADIATION IN SILICON-ON INSULATOR INTEGRATED CIRCUITS
    73.
    发明申请
    MONITORING IONIZING RADIATION IN SILICON-ON INSULATOR INTEGRATED CIRCUITS 有权
    监测硅绝缘子集成电路中的离子化辐射

    公开(公告)号:US20070252088A1

    公开(公告)日:2007-11-01

    申请号:US11380736

    申请日:2006-04-28

    IPC分类号: G01T1/02

    CPC分类号: G01T1/244

    摘要: A method, device and system for monitoring ionizing radiation. The method including: collecting an ionizing radiation induced charge collected by the depletion region of a diode formed in a silicon layer below an oxide layer buried below a surface of a silicon substrate; and coupling a cathode of the diode to a precharged node of a clocked logic circuit such that the ionizing radiation induced charge collected by a depletion region of the diode will discharge the precharged node and change an output state of the clocked logic circuit.

    摘要翻译: 一种用于监测电离辐射的方法,装置和系统。 该方法包括:收集由埋在硅衬底表面下方的氧化物层下面的硅层中形成的二极管的耗尽区收集的电离辐射感应电荷; 以及将二极管的阴极耦合到时钟逻辑电路的预充电节点,使得由二极管的耗尽区收集的电离辐射感应电荷将放电预充电节点并改变时钟逻辑电路的输出状态。

    Integrated antifuse structure for finfet and cmos devices
    76.
    发明申请
    Integrated antifuse structure for finfet and cmos devices 有权
    Finf集成反熔丝结构和cmos器件

    公开(公告)号:US20060128071A1

    公开(公告)日:2006-06-15

    申请号:US10539333

    申请日:2002-12-20

    IPC分类号: H01L21/82

    摘要: A method is described for fabricating and antifuse structure (100) integrated with a semiconductor device such as a FINFET or planar CMOS devise. A region of semiconducting material (11) is provided overlying an insulator (3) disposed on a substrate (10); an etching process exposes a plurality of corners (111-114) in the semiconducting material. The exposed corners are oxidized to form elongated tips (111t-114t) at the corners; the oxide (31) overlying the tips is removed. An oxide layer (51), such as a gate oxide, is then formed on the semiconducting material and overlying the corners; this layer has a reduced thickness at the corners. A layer of conducting material (60) is formed in contact with the oxide layer (51) at the corners, thereby forming a plurality of possible breakdown paths between the semiconducting material and the layer of conducting material through the oxide layer. Applying a voltage, such as a burn-in voltage, to the structure converts at least one of the breakdown paths to a conducting path (103, 280).

    摘要翻译: 描述了与半导体器件(例如FINFET或平面CMOS器件)集成的制造和反熔丝结构(100)的方法。 设置在设置在基板(10)上的绝缘体(3)上的半导体材料(11)的区域; 蚀刻工艺暴露了半导体材料中的多个拐角(111-114)。 露出的角部被氧化,以形成角落处的细长尖端(111t-114t); 去除顶部上方的氧化物(31)。 然后在半导体材料上形成氧化物层(例如栅极氧化物),并覆盖在角部上; 该层在拐角处具有减小的厚度。 在角部处形成与氧化物层(51)接触的导电材料层(60),从而通过氧化物层在半导体材料和导电材料层之间形成多个可能的击穿路径。 将诸如老化电压的电压施加到结构将至少一个击穿路径转换成导电路径(103,280)。

    Electronically programmable antifuse and circuits made therewith
    78.
    发明申请
    Electronically programmable antifuse and circuits made therewith 有权
    电子可编程反熔丝和由其制成的电路

    公开(公告)号:US20050133884A1

    公开(公告)日:2005-06-23

    申请号:US11051703

    申请日:2005-02-04

    IPC分类号: H01L23/525 H01L29/00

    摘要: An antifuse device (120) that includes a bias element (124) and an programmable antifuse element (128) arranged in series with one another so as to form a voltage divider having an output node (F) located between the bias and antifuse elements. When the antifuse device is in its unprogrammed state, each of the bias element and antifuse element is non-conductive. When the antifuse device is in its programmed state, the bias element remains non-conductive, but the antifuse element is conductive. The difference in the resistance of the antifuse element between its unprogrammed state and programmed state causes the difference in voltages seen at the output node to be on the order of hundreds of mili-volts when a voltage of 1 V is applied across the antifuse device. This voltage difference is so high that it can be readily sensed using a simple sensing circuit (228).

    摘要翻译: 一种反熔丝装置(120),其包括彼此串联布置的偏置元件(124)和可编程反熔丝元件(128),以形成具有位于偏置和反熔丝元件之间的输出节点(F)的分压器。 当反熔丝装置处于其未编程状态时,偏置元件和反熔丝元件中的每一个都是不导电的。 当反熔丝装置处于其编程状态时,偏置元件保持不导电,但是反熔丝元件是导电的。 反熔丝元件在其未编程状态和编程状态之间的电阻差异导致当在反熔断器件上施加1V的电压时,在输出节点处看到的电压差为几百微升。 该电压差非常高以至于可以使用简单的感测电路(228)容易地感测。