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    Light emitting diode package and fabrication method thereof
    73.
    发明申请
    Light emitting diode package and fabrication method thereof 审中-公开
    发光二极管封装及其制造方法

    公开(公告)号：US20070241362A1

    公开(公告)日：2007-10-18

    申请号：US11730965

    申请日：2007-04-05

    申请人： Kyung Taeg Han ,  In Tae Yeo ,  Hun Joo Hahm ,  Chang Ho Song ,  Seong Yeon Han ,  Yoon Sung Na ,  Dae Yeon Kim ,  Ho Sik Ahn ,  Young Sam Park

    发明人： Kyung Taeg Han ,  In Tae Yeo ,  Hun Joo Hahm ,  Chang Ho Song ,  Seong Yeon Han ,  Yoon Sung Na ,  Dae Yeon Kim ,  Ho Sik Ahn ,  Young Sam Park

    IPC分类号： H01L33/00

    CPC分类号： H01L33/62 ,  H01L33/486 ,  H01L33/642 ,  H01L33/647 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014

    摘要： An LED package and a fabrication method therefor. The LED package includes first and second lead frames made of heat and electric conductors, each of the lead frames comprising a planar base and extensions extending in opposed directions and upward directions from the base. The package also includes a package body made of a resin and configured to surround the extensions of the first and second lead frames to fix the first and second lead frames while exposing underside surfaces of the first and second lead frames. The LED package further includes a light emitting diode chip disposed on an upper surface of the base of the first lead frame and electrically connected to the bases of the first and second lead frames, and a transparent encapsulant for encapsulating the light emitting diode chip.

    摘要翻译： 一种LED封装及其制造方法。 LED封装包括由热和电导体制成的第一引线框架和第二引线框架，每个引线框架包括平面基座和从基座向相反方向和向上方向延伸的延伸部分。 封装还包括由树脂制成的封装主体，并且被配置为围绕第一引线框架和第二引线框架的延伸部分以固定第一和第二引线框架同时暴露第一引线框架和第二引线框架的下侧表面。 LED封装还包括设置在第一引线框架的基座的上表面上并电连接到第一引线框架和第二引线框架的基座的发光二极管芯片，以及用于封装发光二极管芯片的透明密封剂。

    Vertical light emitting type backlight module
    74.
    发明授权
    Vertical light emitting type backlight module 失效
    垂直发光型背光模组

    公开(公告)号：US07097337B2

    公开(公告)日：2006-08-29

    申请号：US10917383

    申请日：2004-08-13

    申请人： Hyung Suk Kim ,  Young Sam Park ,  Hun Joo Hahm ,  Jung Kyu Park ,  Young June Jeong

    发明人： Hyung Suk Kim ,  Young Sam Park ,  Hun Joo Hahm ,  Jung Kyu Park ,  Young June Jeong

    IPC分类号： F21V8/00

    CPC分类号： G02F1/133603 ,  F21K9/00 ,  F21Y2105/10 ,  F21Y2115/10

    摘要： Disclosed herein is a vertical light emitting type backlight module, for irradiating white light to the rear side of a liquid crystal display in the perpendicular direction. The vertical light emitting type backlight module comprises a) one or more LED array modules, each comprising a substrate having conductive patterns printed on upper and lower surfaces of the substrate, respectively, a plurality of LED devices mounted on the upper and lower surfaces of the substrate, respectively, for emitting light toward the front of respective surfaces of the substrate with the LED devices mounted thereon, and a plurality of lenses formed to surround the LED devices, respectively, for directing the light emitted from the LED devices in a direction perpendicular to the LED while being within a predetermined angle from an axis parallel to a plane of the backlight module, the substrate being mounted perpendicular to the plane of the backlight module such that the light emitted from the LED devices is emitted in a direction approximately parallel to the plane of the backlight module, and b) a reflection plate for each of the LED array modules for reflecting the light spread in the horizontal direction to change path of the light to the perpendicular direction.

    摘要翻译： 本文公开了一种用于在垂直方向上将白光照射到液晶显示器的后侧的垂直发光型背光模块。 垂直发光型背光模块包括：a）一个或多个LED阵列模块，每个LED阵列模块分别包括印刷在基板的上表面和下表面上的导电图案的基板，安装在基板的上表面和下表面上的多个LED装置 基板，分别用于在安装有LED器件的基板的各个表面的前面发射光，以及分别形成为围绕LED器件的多个透镜，用于将LED器件发出的光沿垂直方向引导 在与来自平行于背光模块的平面的轴线处于预定角度内的LED上，所述基板垂直于所述背光模块的平面安装，使得从所述LED装置发射的光在大致平行于 背光模块的平面，以及b）用于反射光sp的每个LED阵列模块的反射板 在水平方向读取，以将光线的路径改变为垂直方向。

    Process for producing nitride semiconductor light-emitting device
    75.
    发明授权
    Process for producing nitride semiconductor light-emitting device 失效
    氮化物半导体发光元件的制造方法

    公开(公告)号：US07063997B2

    公开(公告)日：2006-06-20

    申请号：US10893924

    申请日：2004-07-20

    申请人： Dong Hyun Cho ,  Masayoshi Koike ,  Hun Joo Hahm

    发明人： Dong Hyun Cho ,  Masayoshi Koike ,  Hun Joo Hahm

    IPC分类号： H01L21/00

    CPC分类号： H01L33/007 ,  H01L21/0237 ,  H01L21/0242 ,  H01L21/02458 ,  H01L21/0254 ,  H01L21/02579 ,  H01L21/0262

    摘要： A process for producing a nitride semiconductor light-emitting device includes the steps of preparing a substrate, growing a p-type nitride semiconductor layer on the substrate by the MOCVD process using hydrazine-based gas as a nitrogen precursor and N2 gas as a carrier gas, forming an active layer on the p-type nitride semiconductor layer, forming an n-type conductive nitride semiconductor layer on the active layer, and forming p- and n-electrodes in electrical connection with the p- and n-type nitride semiconductors, respectively.

    摘要翻译： 制造氮化物半导体发光器件的方法包括以下步骤：制备衬底，通过使用肼系气体作为氮前体的MOCVD法在衬底上生长p型氮化物半导体层， 气体作为载气，在p型氮化物半导体层上形成有源层，在有源层上形成n型导电氮化物半导体层，形成与p电极电连接的p型和n型电极 和n型氮化物半导体。

    Light emitting diode device
    76.
    发明授权
    Light emitting diode device 失效
    发光二极管装置

    公开(公告)号：US06972439B1

    公开(公告)日：2005-12-06

    申请号：US10916525

    申请日：2004-08-12

    申请人： Hyung Suk Kim ,  Young Sam Park ,  Hun Joo Hahm ,  Jung Kyu Park ,  Young June Jeong

    发明人： Hyung Suk Kim ,  Young Sam Park ,  Hun Joo Hahm ,  Jung Kyu Park ,  Young June Jeong

    IPC分类号： G02F1/13357 ,  H01L29/22 ,  H01L33/54 ,  H01L33/60

    CPC分类号： H01L33/54 ,  H01L33/60

    摘要： Disclosed herein is a light emitting diode (LED) device. The light emitting diode device comprises a package formed with a terminal for applying an electrical signal, one or more LED chips mounted on the package such that the LED chips are electrically connected to the terminal, a lens formed to surround the LED chips on the package for changing path of light emitted from the LED chips to the horizontal direction with the difference of the refraction rates of the media, and a reflector formed on the lens for reflecting the light, emitted above the lens without being refracted in the horizontal direction at the lens, to the horizontal direction. The LED device reflects the light, which is deviated from the optical design range of the lens and emitted above the lens, back to the lens, thereby preventing the hot spot from being generated, and enhancing horizontal emission efficiency of the light.

    摘要翻译： 这里公开了一种发光二极管（LED）装置。 发光二极管装置包括形成有用于施加电信号的端子的封装，安装在封装上的一个或多个LED芯片，使得LED芯片电连接到端子，形成为围绕封装上的LED芯片的透镜 用于随着介质的折射率的差异而将从LED芯片发射的光的路径改变到水平方向，以及形成在透镜上的用于反射透镜的反射器的反射器，而不是在透镜的上方沿水平方向折射 镜头，水平方向。 LED装置将从透镜的光学设计范围偏离的光反射回透镜，从而防止产生热点，提高光的水平发光效率。

    Light emitting diode package and fabrication method thereof
    77.
    发明授权
    Light emitting diode package and fabrication method thereof 有权
    发光二极管封装及其制造方法

    公开(公告)号：US08735931B2

    公开(公告)日：2014-05-27

    申请号：US12907348

    申请日：2010-10-19

    申请人： Kyung Taeg Han ,  In Tae Yeo ,  Hun Joo Hahm ,  Chang Ho Song ,  Seong Yeon Han ,  Yoon Sung Na ,  Dae Yeon Kim ,  Ho Sik Ahn ,  Young Sam Park

    发明人： Kyung Taeg Han ,  In Tae Yeo ,  Hun Joo Hahm ,  Chang Ho Song ,  Seong Yeon Han ,  Yoon Sung Na ,  Dae Yeon Kim ,  Ho Sik Ahn ,  Young Sam Park

    IPC分类号： H01L33/62

    CPC分类号： H01L33/62 ,  H01L33/486 ,  H01L33/642 ,  H01L33/647 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014

    摘要： An LED package and a fabrication method therefor. The LED package includes first and second lead frames made of heat and electric conductors, each of the lead frames comprising a planar base and extensions extending in opposed directions and upward directions from the base. The package also includes a package body made of a resin and configured to surround the extensions of the first and second lead frames to fix the first and second lead frames while exposing underside surfaces of the first and second lead frames. The LED package further includes a light emitting diode chip disposed on an upper surface of the base of the first lead frame and electrically connected to the bases of the first and second lead frames, and a transparent encapsulant for encapsulating the light emitting diode chip.

    摘要翻译： 一种LED封装及其制造方法。 LED封装包括由热和电导体制成的第一引线框架和第二引线框架，每个引线框架包括平面基座和从基座向相反方向和向上方向延伸的延伸部分。 封装还包括由树脂制成的封装主体，并且被配置为围绕第一引线框架和第二引线框架的延伸部分以固定第一和第二引线框架同时暴露第一引线框架和第二引线框架的下侧表面。 LED封装还包括设置在第一引线框架的基座的上表面上并电连接到第一引线框架和第二引线框架的基座的发光二极管芯片，以及用于封装发光二极管芯片的透明密封剂。

    Plane light source and LCD backlight unit having the same
    78.
    发明授权
    Plane light source and LCD backlight unit having the same 有权
    平面光源和具有相同的LCD背光单元

    公开(公告)号：US08488081B2

    公开(公告)日：2013-07-16

    申请号：US12839945

    申请日：2010-07-20

    申请人： Seong Yeon Han ,  Hun Joo Hahm ,  Hyung Suk Kim ,  Young June Jeong ,  Young Sam Park ,  Chul Hee Yoo

    发明人： Seong Yeon Han ,  Hun Joo Hahm ,  Hyung Suk Kim ,  Young June Jeong ,  Young Sam Park ,  Chul Hee Yoo

    IPC分类号： G02F1/1335

    CPC分类号： G02F1/133603

    摘要： There are provided a plane light source and an LCD backlight unit having the same. A plane light source including light emitting device matrixes each having a plurality of light emitting devices arranged in rows and columns on a substrate according to an aspect of the invention includes: a first matrix having a plurality of light emitting devices arranged in rows and columns; and a second matrix having a plurality of light emitting devices arranged in rows and columns, the light emitting devices each located within a rectangle formed by four adjacent light emitting devices included in the first matrix, and forming angles θ satisfying the condition of 45°≦θ≦55° therebetween on the basis of a horizontal direction, wherein among pitches between one light emitting devices included in the light emitting device matrixes and another lighting light emitting device adjacent to the light emitting device, a pitch P1 between the light emitting device and the light emitting device diagonally across from the light emitting device satisfies the condition of 25 mm≦P1≦29 mm, and a pitch P2 between the light emitting device and another light emitting device located in a horizontal direction satisfies the condition of 34 mm≦P2≦38 mm.

    摘要翻译： 提供有平面光源和具有该平面光​​源的LCD背光单元。 根据本发明的一个方面的包括发光器件矩阵的平面光源包括：具有排列成行和列的多个发光器件的发光器件矩阵，包括：具有排列成行和列的多个发光器件的第一矩阵; 以及具有排列成行和列的多个发光器件的第二矩阵，所述发光器件各自位于由包括在所述第一矩阵中的四个相邻的发光器件形成的矩形内，并且形成满足条件为45°@ 其中基于水平方向的θ@ 55°，其中在包括在发光器件矩阵中的一个发光器件和与发光器件相邻的另一个照明发光器件之间的间距中，发光器件与 发光器件对角地穿过发光器件的发光器件满足25mm @ P1 @ 29mm的条件，并且发光器件和位于水平方向的另一个发光器件之间的间距P2满足条件为34mm @ P2 @ 38毫米。