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176 条记录 (耗时 0.04 秒)

    Laser apparatus
    71.
    发明授权
    Laser apparatus 有权
    激光设备

    公开(公告)号：US08170071B2

    公开(公告)日：2012-05-01

    申请号：US12398191

    申请日：2009-03-05

    申请人： Masataka Nakazawa ,  Akihito Suzuki ,  Toshihiko Hirooka ,  Masato Yoshida ,  Kazunori Shiota

    发明人： Masataka Nakazawa ,  Akihito Suzuki ,  Toshihiko Hirooka ,  Masato Yoshida ,  Kazunori Shiota

    IPC分类号： H01S3/30

    CPC分类号： H01S3/0675 ,  H01S3/06712 ,  H01S3/06791 ,  H01S3/08031 ,  H01S3/09415 ,  H01S3/1608 ,  H01S3/1693

    摘要： Provided is a laser apparatus including: a DFB fiber laser 40 including, as an amplitude medium, a rare earth doped silica optical fiber codoped with a high concentration of aluminum; an optical feedback path 50 formed by a ring-shaped optical fiber; and an optical coupler 70 a) feeding back a part of an output of the DFB fiber laser 40 to the DFB fiber laser 40 via the optical feedback path 50, and b) outputting, to outside, another part of the output of the DFB fiber laser 40, where the optical fiber forming the optical feedback path 50 is longer than a length at which a relaxation oscillation noise in the output to the outside becomes −110 dB/Hz.

    摘要翻译： 提供了一种激光装置，其包括：DFB光纤激光器40，其包括作为振幅介质的掺杂有高浓度铝的稀土掺杂二氧化硅光纤; 由环形光纤形成的光学反馈路径50; 和光耦合器70a）经由光反馈路径50将DFB光纤激光器40的输出的一部分反馈到DFB光纤激光器40，以及b）向DFB光纤输出的另一部分输出外部 激光器40，其中形成光学反馈路径50的光纤比输出到外部的弛豫振荡噪声变为-110dB / Hz的长度长。

    CMP polishing slurry and polishing method
    72.
    发明授权
    CMP polishing slurry and polishing method 有权
    CMP抛光浆料和抛光方法

    公开(公告)号：US08168541B2

    公开(公告)日：2012-05-01

    申请号：US12902337

    申请日：2010-10-12

    申请人： Masato Fukasawa ,  Masato Yoshida ,  Naoyuki Koyama ,  Yuto Ootsuki ,  Chiaki Yamagishi ,  Kazuhiro Enomoto ,  Kouji Haga ,  Yasushi Kurata

    发明人： Masato Fukasawa ,  Masato Yoshida ,  Naoyuki Koyama ,  Yuto Ootsuki ,  Chiaki Yamagishi ,  Kazuhiro Enomoto ,  Kouji Haga ,  Yasushi Kurata

    IPC分类号： C09K13/00 ,  C09K3/14

    CPC分类号： H01L21/31053 ,  C09G1/02 ,  C09K3/1409 ,  C09K3/1463

    摘要： The present invention relates to a CMP polishing slurry, comprising cerium oxide particles, a dispersing agent, a water-soluble polymer and water, wherein the water-soluble polymer is a compound having a skeleton of any one of an N-mono-substituted product and an N,N-di-substituted product of any one selected from the group consisting of acrylamide, methacrylamide and α-substituted products thereof. The amount of the water-soluble polymer is preferably in the range of 0.01 part or more by weight and 10 parts or less by weight for 100 parts by weight of the polishing slurry. Thus it is possible to provide a polishing slurry and a polishing method which make it possible to polish a film made of silicon oxide or the like effectively and rapidly and further control the process therefore easily in CMP technique for flattening an interlayer insulating film, a BPSG film, an insulator film for shallow trench isolation, and other films.

    摘要翻译： 本发明涉及一种包括氧化铈颗粒，分散剂，水溶性聚合物和水的CMP抛光浆料，其中水溶性聚合物是具有任意一种N-单取代产物的骨架的化合物 和选自丙烯酰胺，甲基丙烯酰胺及其α-取代产物的任意一种的N，N-二取代的产物。 对于100重量份的研磨浆料，水溶性聚合物的量优选为0.01重量份以上且10重量份以下。 因此，可以提供一种研磨浆料和抛光方法，其可以有效和快速地对由氧化硅等制成的膜进行抛光，因此在用于使层间绝缘膜，BPSG的平坦化的CMP技术中容易地进一步控制该工艺 薄膜，用于浅沟槽隔离的绝缘膜，以及其他薄膜。

    CMP abrasive, method for polishing substrate and method for manufacturing semiconductor device using the same, and additive for CMP abrasive
    76.
    发明授权
    CMP abrasive, method for polishing substrate and method for manufacturing semiconductor device using the same, and additive for CMP abrasive 有权
    CMP研磨剂，用于研磨基材的方法和使用该方法制造半导体器件的方法以及用于CMP磨料的添加剂

    公开(公告)号：US08002860B2

    公开(公告)日：2011-08-23

    申请号：US12484973

    申请日：2009-06-15

    申请人： Naoyuki Koyama ,  Kouji Haga ,  Masato Yoshida ,  Keizou Hirai ,  Toranosuke Ashizawa ,  Youiti Machii

    发明人： Naoyuki Koyama ,  Kouji Haga ,  Masato Yoshida ,  Keizou Hirai ,  Toranosuke Ashizawa ,  Youiti Machii

    IPC分类号： B24D3/02 ,  C09C1/68 ,  C09K3/14 ,  B24B1/00 ,  B24B7/19 ,  B24B7/30

    CPC分类号： H01L21/31053 ,  C09G1/02 ,  C09K3/1409 ,  C09K3/1463 ,  H01L21/30625

    摘要： The present invention discloses a CMP abrasive comprising cerium oxide particles, a dispersant, an organic polymer having an atom or a structure capable of forming a hydrogen bond with a hydroxyl group present on a surface of a film to be polished and water, a method for polishing a substrate comprising polishing a film to be polished by moving a substrate on which the film to be polished is formed and a polishing platen while pressing the substrate against the polishing platen and a polishing cloth and supplying the CMP abrasive between the film to be polished and the polishing cloth, a method for manufacturing a semiconductor device comprising the steps of the above-mentioned polishing method, and an additive for a CMP abrasive comprising an organic polymer having an atom or a structure capable of forming a hydrogen bond with a hydroxyl group present on a surface of a film to be polished, and water.

    摘要翻译： 本发明公开了一种CMP研磨剂，其包含氧化铈颗粒，分散剂，具有能够与待抛光的膜表面上存在的羟基形成氢键的原子或结构的有机聚合物和水， 抛光衬底，其包括通过移动其上形成有待抛光的膜的衬底抛光待抛光的膜和抛光台板，同时将衬底压靠在抛光台板和抛光布上并将CMP磨料供应在待抛光的膜之间 抛光布，半导体器件的制造方法，包括上述抛光方法的步骤和用于CMP研磨剂的添加剂，其包含具有能够与羟基形成氢键的原子或结构的有机聚合物 存在于要抛光的膜的表面上，以及水。

    Laser oscillator
    80.
    发明授权
    Laser oscillator 有权
    激光振荡器

    公开(公告)号：US07898733B2

    公开(公告)日：2011-03-01

    申请号：US12422758

    申请日：2009-04-13

    申请人： Kazunori Shiota ,  Shin Masuda ,  Masataka Nakazawa ,  Masato Yoshida

    发明人： Kazunori Shiota ,  Shin Masuda ,  Masataka Nakazawa ,  Masato Yoshida

    IPC分类号： H04B10/17 ,  H01S3/00

    CPC分类号： H01S3/06791 ,  H01S3/0675 ,  H01S3/08 ,  H01S3/094042 ,  H01S3/1109 ,  H01S3/1118

    摘要： A laser oscillator includes a ring resonator. The ring resonator includes an optical circulator having first, second, third, and fourth ports and a first optical amplification fiber connected to the optical circulator. Light incident on the first port is exited from the second port, and light incident on the second port is exited from the third port. The fourth port provides an exciting light and injects the exciting light into the ring resonator through the first port. The first optical amplification fiber amplifies light exited from the third port with the exciting light provided by the fourth port. The laser oscillator also includes an optical member connected to the optical circulator. The optical member reflects at least a part of the light exited from the second port and injects the same into the second port again.

    摘要翻译： 激光振荡器包括环形谐振器。 环形谐振器包括具有第一，第二，第三和第四端口的光循环器和连接到光循环器的第一光放大光纤。 第一个港口的光线从第二个港口出发，第二个港口的光线从第三个港口出来。 第四个端口提供激发光，并通过第一个端口将激发光注入环形谐振器。 第一光放大光纤利用由第四端口提供的激发光放大从第三端口退出的光。 激光振荡器还包括连接到光循环器的光学构件。 光学构件反射从第二端口退出的光的至少一部分，并再次将其注入第二端口。