公开(公告)号：US5876273A

公开(公告)日：1999-03-02

申请号：US625291

申请日：1996-04-01

申请人： Hiroyuki Yano ,  Katsuya Okumura ,  Norio Kimura ,  Tomoyuki Yahiro ,  Hozumi Yasuda

发明人： Hiroyuki Yano ,  Katsuya Okumura ,  Norio Kimura ,  Tomoyuki Yahiro ,  Hozumi Yasuda

IPC分类号： B24B37/30 ,  B24B29/02

CPC分类号： B24B37/30

摘要： A polishing apparatus is provided which improves uniformity across the surface of a polished wafer. The apparatus includes a wafer carrier, a guide ring coupled to a lower portion of the wafer carrier, a circular plate coupled to a first inner circumference portion of the guide ring distant from the wafer carrier, and a cavity, formed within an area bounded by the lower portion of the wafer carrier, an inner circumference of the circular plate, and a second inner circumference portion of the guide ring between the circular plate and the lower portion of the wafer carrier, the circular plate holding the wafer to be polished in the cavity.

摘要翻译： 提供了一种改善抛光晶片表面均匀性的抛光装置。 该装置包括晶片载体，联接到晶片载体的下部的引导环，耦合到远离晶片载体的引导环的第一内周部分的圆形板，以及形成在由 晶片载体的下部，圆形板的内圆周和导向环的第二内周部分在圆形板和晶片载体的下部之间，圆形板将待抛光的晶片保持在 腔。

公开(公告)号：US5839947A

公开(公告)日：1998-11-24

申请号：US795511

申请日：1997-02-05

申请人： Norio Kimura ,  Kunihiko Sakurai ,  Tetsuji Togawa ,  Seiji Katsuoka ,  Toyomi Nishi

发明人： Norio Kimura ,  Kunihiko Sakurai ,  Tetsuji Togawa ,  Seiji Katsuoka ,  Toyomi Nishi

IPC分类号： B24B53/007 ,  B24B53/017 ,  B24B5/00 ,  B24B29/00

CPC分类号： B24B53/017

摘要： A polishing apparatus is used for polishing a workpiece such as a semiconductor wafer to a flat mirror finish. The polishing apparatus includes a turntable having a polishing surface thereon, a top ring, for holding a workpiece to be polished and pressing the workpiece against the polishing surface, which is movable between a polishing position inside of the turntable and a standby position outside of the turntable, and a first device for keeping at least a lower surface of the top ring wet while the top ring is in the standby position. The polishing apparatus further includes a dressing tool for dressing the polishing surface on the turntable, and a second device for keeping at least a lower surface of the dressing tool wet while the dressing tool is in a standby position.

摘要翻译： 抛光装置用于将诸如半导体晶片的工件抛光到平面镜面。 抛光装置包括其上具有抛光表面的转台，用于保持要抛光的工件的顶环，并将工件压靠在抛光表面上，该抛光表面可在转盘内部的抛光位置和位于转盘外部的待机位置之间移动 转盘和用于在顶环处于待机位置时保持顶环的至少下表面湿润的第一装置。 抛光装置还包括用于修整转台上的抛光表面的修整工具，以及用于在修整工具处于待机位置时保持敷料工具的至少下表面湿润的第二装置。

公开(公告)号：US5716264A

公开(公告)日：1998-02-10

申请号：US683424

申请日：1996-07-18

申请人： Norio Kimura ,  Ritsuo Kikuta ,  You Ishii ,  Masayoshi Hirose

发明人： Norio Kimura ,  Ritsuo Kikuta ,  You Ishii ,  Masayoshi Hirose

IPC分类号： B24B37/00 ,  B24B53/007 ,  B24B21/18

CPC分类号： B24B53/017

摘要： A polishing apparatus is employed to polish an object to be polished by urging the surface of the object to be polished against the surface of a polishing cloth and causing a relative movement therebetween, while supplying a polishing liquid into an area between the object to be polished and the polishing cloth. A plurality of nozzles spray respective fluid jets to strike against the surface of the cloth. The plurality of nozzles include more than one type of nozzle which vary flow velocity, flow rate, angle of spray, and cross-sectional configuration of a jet. The plurality of nozzles have axes positioned at a location at different distances from the rotation axis of the polishing cloth.

摘要翻译： 抛光装置用于通过将待抛光物体的表面推压在抛光布的表面上并在其之间相对移动，同时将抛光液体提供到待抛光对象之间的区域中来抛光待抛光物体 和抛光布。 多个喷嘴喷射相应的流体射流以抵靠布的表面。 多个喷嘴包括不止一种类型的喷嘴，其改变流速，流速，喷射角度和射流的横截面构造。 多个喷嘴具有位于与抛光布的旋转轴线不同的距离处的轴线。

公开(公告)号：US5653624A

公开(公告)日：1997-08-05

申请号：US527422

申请日：1995-09-13

申请人： Seiji Ishikawa ,  Norio Kimura ,  Katsuyuki Aoki

发明人： Seiji Ishikawa ,  Norio Kimura ,  Katsuyuki Aoki

IPC分类号： B24B37/10 ,  B24B5/00 ,  B24B29/00

CPC分类号： B24B37/105

摘要： A compact polishing apparatus requires less operating space than a conventional polishing apparatus generally used for polishing semiconductor wafers. The present apparatus has a swing shaft to provide a swing motion to a pressing device including a top ring member. There are three ranges of swing motion, i.e. a polishing range which is a small motion range used for polishing a wafer within the confined area of a turntable, a receiving range which is a medium motion range used for loading/unloading of a wafer in an area beyond the turntable, and a standby range which is a large motion range used for moving the top ring member to a standby or rinsing position in an area beyond the turntable. Because of the swing-based arrangement of the components in the present apparatus, isolation of critical components is easily achieved, thus resulting in low maintenance costs and long service life of the present apparatus. These advantages offer significant cost savings in the management of polishing operations.

摘要翻译： 紧凑的抛光装置比通常用于抛光半导体晶片的常规抛光装置需要较少的操作空间。 本装置具有摆动轴，以向包括顶环构件的按压装置提供摆动运动。 有三个摆动运动范围，即抛光范围，该抛光范围是用于在转台的受限区域内抛光晶片的小运动范围，作为用于将晶片加载/卸载的介质运动范围的接收范围 以及用于将顶环构件移动到转台之外的区域中的待机或冲洗位置的大的运动范围的待机范围。 由于本装置中的部件的基于摆动的布置，容易实现关键部件的隔离，因此导致本装置的维护成本低和使用寿命长。 这些优点为抛光操作的管理提供了显着的成本节约。

公开(公告)号：US5643056A

公开(公告)日：1997-07-01

申请号：US550117

申请日：1995-10-30

申请人： Masayoshi Hirose ,  Seiji Ishikawa ,  Norio Kimura ,  Yoshimi Sasaki ,  Kouki Yamada ,  Fujio Aoyama ,  Noburu Shimizu ,  Katsuya Okumura

发明人： Masayoshi Hirose ,  Seiji Ishikawa ,  Norio Kimura ,  Yoshimi Sasaki ,  Kouki Yamada ,  Fujio Aoyama ,  Noburu Shimizu ,  Katsuya Okumura

IPC分类号： B24B7/22 ,  B24B29/02 ,  B24B37/07 ,  B24B37/10 ,  H01L21/304 ,  B24B1/00

CPC分类号： B24B7/228 ,  B24B29/02 ,  B24B37/04

摘要： A drum-type polishing apparatus for producing a flat mirror polish on an object such as a semiconductor wafer, is capable of three degrees of freedom of movement of a drum member with respect to the wafer. The relative movements can be made, successively or simultaneously, at right angles to an axis of the drum, parallel to the surface of the wafer, as well as at any desired angular orientations. Combined with a follower device to provide automatic compensation for unevenness in pressing pressure applied to the wafer during polishing, the polishing apparatus offers outstanding uniformity in polishing quality and high productivity, even for large diameter wafers, with a comparatively modest investment in both facility space and equipment cost.

摘要翻译： 用于在诸如半导体晶片的物体上制造平面镜抛光的滚筒式抛光装置能够使鼓构件相对于晶片具有三个自由度的移动。 相对运动可以连续或同时地与滚筒的轴线成直角，平行于晶片的表面以及任何期望的角度取向。 结合跟随装置，为抛光期间对晶片施加的压力压力的不均匀性提供自动补偿，抛光装置即使对于大直径晶片也具有优异的抛光质量均匀性和高生产率，在设备空间和 设备成本

公开(公告)号：US5616063A

公开(公告)日：1997-04-01

申请号：US309193

申请日：1994-09-20

申请人： Katsuya Okumura ,  Riichirou Aoki ,  Hiromi Yajima ,  Masako Kodera ,  Shirou Mishima ,  Atsushi Shigeta ,  Masayoshi Hirose ,  Norio Kimura ,  Seiji Ishikawa

发明人： Katsuya Okumura ,  Riichirou Aoki ,  Hiromi Yajima ,  Masako Kodera ,  Shirou Mishima ,  Atsushi Shigeta ,  Masayoshi Hirose ,  Norio Kimura ,  Seiji Ishikawa

IPC分类号： H01L21/302 ,  B08B1/04 ,  B24B27/00 ,  B24B37/04 ,  B24B37/34 ,  B24B51/00 ,  B24B55/12 ,  H01L21/00 ,  H01L21/677 ,  B24B49/00

CPC分类号： H01L21/67167 ,  B08B1/04 ,  B08B13/00 ,  B24B27/0023 ,  B24B37/04 ,  B24B37/345 ,  B24B51/00 ,  B24B55/12 ,  H01L21/67028 ,  H01L21/67046 ,  H01L21/67057 ,  H01L21/67161 ,  H01L21/67219 ,  H01L21/67745

摘要： A polishing apparatus is a cluster type of apparatus having a plurality of units which perform various operations. The polishing apparatus includes a universal transfer robot having at least one arm for transferring a workpiece, a plurality of units disposed around the universal transfer robot and including a loading unit for receiving the workpiece to be polished, at least one polishing unit for polishing the workpiece, at least one washing unit for washing the workpiece which has been polished and an unloading unit for receiving the cleaned workpiece. Discrete mechanisms respectively transfer a clean workpiece and a dirty workpiece amongst the units.

摘要翻译： 抛光装置是具有执行各种操作的多个单元的集群类型的装置。 抛光装置包括具有用于传送工件的至少一个臂的通用传送机器人，设置在通用传送机器人周围的多个单元，并且包括用于接收被抛光工件的装载单元，用于抛光工件的至少一个抛光单元 至少一个用于清洗已经被抛光的工件的洗涤单元和用于接收清洁的工件的卸载单元。 离散机构分别在单元之间传送清洁的工件和脏工件。

公开(公告)号：US5476414A

公开(公告)日：1995-12-19

申请号：US124550

申请日：1993-09-22

申请人： Masayoshi Hirose ,  Manabu Tsujimura ,  Seiji Ishikawa ,  Norio Kimura ,  You Ishii

发明人： Masayoshi Hirose ,  Manabu Tsujimura ,  Seiji Ishikawa ,  Norio Kimura ,  You Ishii

IPC分类号： B24B37/10 ,  B24B37/30 ,  H01L21/304 ,  B24B7/22

CPC分类号： H01L21/02024 ,  B24B37/107 ,  B24B37/30

摘要： A workpiece such as a semiconductor wafer is supported on a top ring and polished by an abrasive cloth on a turntable while the top ring is being pressed against the turntable and the turntable and the top ring are being rotated. The top ring is coupled to a top ring drive shaft, coupled to a pressure cylinder for pressing the top ring, and to a motor for rotating the top ring. A spherical bearing is interposed between the top ring and the top ring drive shaft for allowing the top ring to align with the upper surface of the moving turntable. A torque transmitting mechanism is operatively coupled between the top ring and the top ring drive shaft for rotating the top ring in synchronization with the top ring drive shaft.

摘要翻译： 诸如半导体晶片的工件被支撑在顶环上并且通过研磨布在转盘上抛光，同时顶环被压靠在转台上，并且转台和顶环正在旋转。 顶环联接到顶环驱动轴，联接到用于按压顶环的压力缸，以及用于旋转顶环的电动机。 在顶环和顶环驱动轴之间插入有球面轴承，用于允许顶环与活动转台的上表面对准。 扭矩传递机构可操作地联接在顶环和顶环驱动轴之间，用于与顶环驱动轴同步地旋转顶环。

公开(公告)号：US09194826B2

公开(公告)日：2015-11-24

申请号：US12103354

申请日：2008-04-15

申请人： Toru Kaga ,  Kenji Terao ,  Masahiro Hatakeyama ,  Kenji Watanabe ,  Yoshihiko Naito ,  Takeshi Murakami ,  Norio Kimura

发明人： Toru Kaga ,  Kenji Terao ,  Masahiro Hatakeyama ,  Kenji Watanabe ,  Yoshihiko Naito ,  Takeshi Murakami ,  Norio Kimura

IPC分类号： G21K5/04 ,  G01N23/203 ,  G01N23/225 ,  H01J37/28

CPC分类号： G01N23/203 ,  G01N23/2251 ,  G01N2223/6116 ,  H01J37/28 ,  H01J2237/004 ,  H01J2237/022 ,  H01J2237/2446 ,  H01J2237/2817

摘要： The electron beam apparatus is provided with a stage for mounting a sample thereon, a primary optical system for generating an electron beam having an irradiation area and irradiating the electron beam onto the sample, a secondary optical system for detecting electrons which have been generated through the irradiation of the electron beam onto the sample and have acquired structural information of the sample and acquiring an image of the sample about a viewing area and an irradiation area changing section for changing the position of the irradiation area with respect to the viewing area.

摘要翻译： 电子束装置设置有用于在其上安装样品的载物台，用于产生具有照射区域并将电子束照射到样品上的电子束的主光学系统，用于检测通过 将电子束照射到样品上并获取样品的结构信息并获取关于观察区域的样品的图像和用于改变照射区域相对于观察区域的位置的照射区域改变部分。

公开(公告)号：US08937283B2

公开(公告)日：2015-01-20

申请号：US12937145

申请日：2009-04-10

申请人： Masahiro Hatakeyama ,  Takeshi Murakami ,  Yoshihiko Naito ,  Kenji Terao ,  Norio Kimura ,  Kenji Watanabe

发明人： Masahiro Hatakeyama ,  Takeshi Murakami ,  Yoshihiko Naito ,  Kenji Terao ,  Norio Kimura ,  Kenji Watanabe

IPC分类号： H01J37/29 ,  H01J37/28 ,  H01J37/244 ,  H01L21/66

CPC分类号： H01J37/28 ,  H01J37/22 ,  H01J37/244 ,  H01J37/29 ,  H01J2237/24475 ,  H01J2237/24585 ,  H01J2237/24592 ,  H01J2237/2805 ,  H01J2237/2806 ,  H01J2237/2817 ,  H01L22/12

摘要： A technique capable of improving the ability to observe a specimen using an electron beam in an energy region which has not been conventionally given attention is provided. This specimen observation method comprises: irradiating the specimen with an electron beam; detecting electrons to be observed which have been generated and have obtained information on the specimen by the electron beam irradiation; and generating an image of the specimen from the detected electrons to be observed. The electron beam irradiation comprises irradiating the specimen with the electron beam with a landing energy set in a transition region between a secondary emission electron region in which secondary emission electrons are detected and a mirror electron region in which mirror electrons are detected, thereby causing the secondary emission electrons and the mirror electrons to be mixed as the electrons to be observed. The detection of the electrons to be observed comprises performing the detection in a state where the secondary emission electrons and the mirror electrons are mixed. Observation and inspection can be quickly carried out for a fine foreign material and pattern of 100 nm or less.

摘要翻译： 提供了一种技术，其能够提高在未经常被注意的能量区域中使用电子束观察样本的能力。 该样本观察方法包括：用电子束照射样本; 检测已经产生的待观察的电子，并通过电子束照射获得关于样品的信息; 以及从所检测的电子产生待观察的样本的图像。 电子束照射包括用电子束照射样本，其中在其中检测到二次发射电子的二次发射电子区域和其中检测到反射镜电子的镜电子区域之间的过渡区域中设置的着陆能量，从而使次级 发射电子和镜电子作为待观察的电子进行混合。 要观察的电子的检测包括在二次发射电子和镜电子混合的状态下进行检测。 对于100nm以下的细小异物和图案，可以快速进行观察和检查。

公开(公告)号：US08636275B2

公开(公告)日：2014-01-28

申请号：US13067381

申请日：2011-05-27

申请人： Mamoru Kambayashi ,  Motoya Sano ,  Hideki Tobinaga ,  Shinya Kitaoka ,  Atsushi Kanaya ,  Norio Kimura ,  Michitaka Suzuki ,  Yoshito Suzuki

发明人： Mamoru Kambayashi ,  Motoya Sano ,  Hideki Tobinaga ,  Shinya Kitaoka ,  Atsushi Kanaya ,  Norio Kimura ,  Michitaka Suzuki ,  Yoshito Suzuki

IPC分类号： B65H83/00

CPC分类号： B65H3/0684 ,  B65H3/5261 ,  B65H5/025 ,  B65H2402/31 ,  B65H2404/2693 ,  B65H2511/20 ,  B65H2515/34 ,  B65H2220/02 ,  B65H2220/11

摘要： An automatic document feeder includes a separating and feeding unit which has a separating member and a paper feeding member coming into contact with the separating member at a predetermined separating pressure, and separates and feeds an original sheet by sheet from a bundle of originals placed on an original placing table; a conveying unit which conveys the original separated by the separating and feeding unit toward a scanning position; a separating pressure switching unit which applies and releases the separating pressure and which is controlled by a control unit to release the separating pressure after a leading edge of a preceding sheet of the original has passed through the separating and feeding unit and to apply the separating pressure before a sheet of original separated and fed next to the preceding sheet of original is fed from the bundle of original to the separating and feeding unit.

摘要翻译： 自动进稿器包括分离和进给单元，该分离和进给单元具有分离构件和供纸构件，其以预定的分离压力与分离构件接触，并且将原始的一张一张的纸张从放置在 原始放置表; 传送单元，其将由分离和进给单元分离的原稿传送到扫描位置; 分离压力切换单元，其施加并释放所述分离压力，并且由所述原件的前边缘的前缘通过所述分离和供给单元之后由控制单元控制以释放所述分离压力，并施加所述分离压力 在将原稿分离并供给的原稿的一张原稿从原稿束馈送到分离和进给单元之前。