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149 条记录 (耗时 0.028 秒)

    GRATING COUPLER FOR INTER-CHIP OPTICAL COUPLING
    74.
    发明申请
    GRATING COUPLER FOR INTER-CHIP OPTICAL COUPLING 有权
    用于芯片间光耦合的光栅耦合器

    公开(公告)号：US20150260913A1

    公开(公告)日：2015-09-17

    申请号：US13588242

    申请日：2012-08-17

    申请人： Guoliang Li ,  Ying L. Luo ,  Xuezhe Zheng ,  John E. Cunningham ,  Ashok V. Krishnamoorthy

    发明人： Guoliang Li ,  Ying L. Luo ,  Xuezhe Zheng ,  John E. Cunningham ,  Ashok V. Krishnamoorthy

    IPC分类号： G02B6/124 ,  G02B6/134 ,  G02B6/34 ,  G02B6/122

    CPC分类号： G02B6/4296 ,  G02B6/12004 ,  G02B6/1228 ,  G02B6/124 ,  G02B6/1347 ,  G02B6/34 ,  G02B2006/12188 ,  H01S5/02252 ,  H01S5/026 ,  H01S5/1014 ,  H01S5/1032 ,  H01S5/14 ,  H01S5/187

    摘要： A photonic integrated circuit (PIC) that includes an optical source that provides an optical signal having a wavelength is described. This optical source includes a reflecting layer, a bottom cladding layer, an active layer (such as a III-V semiconductor) having a bandgap wavelength that exceeds that of silicon, and a top cladding layer. Moreover, an optical coupler (such as a grating coupler) that couples the optical signal out of a plane of the active layer is included in a region of the active layer. In this region, the top cladding layer is absent. Furthermore, in an adjacent region, the top cladding layer includes an inverse taper so that the top cladding layer is tapered down from a width distal from the region. In conjunction with the optical coupler, the inverse taper may facilitate low-loss optical coupling of the optical signal between the PIC and another PIC.

    摘要翻译： 描述了包括提供具有波长的光信号的光源的光子集成电路（PIC）。 该光源包括反射层，底部包层，具有超过硅的带隙波长的有源层（例如III-V半导体）和顶部覆层。 此外，将有源层的平面耦合光信号的光耦合器（诸如光栅耦合器）包括在有源层的区域中。 在该区域中，顶层包层不存在。 此外，在相邻区域中，顶部包层具有倒锥形，使得顶部包层从远离该区域的宽度向下锥形。 结合光耦合器，逆锥度可以促进PIC和另一个PIC之间的光信号的低损耗光耦合。

    Optical device with reduced thermal tuning energy
    75.
    发明授权
    Optical device with reduced thermal tuning energy 有权
    具有减少热调谐能量的光学器件

    公开(公告)号：US08768170B2

    公开(公告)日：2014-07-01

    申请号：US13156144

    申请日：2011-06-08

    申请人： Ashok V. Krishnamoorthy ,  Xuezhe Zheng ,  Guoliang Li ,  John E. Cunningham

    发明人： Ashok V. Krishnamoorthy ,  Xuezhe Zheng ,  Guoliang Li ,  John E. Cunningham

    IPC分类号： H04J14/02

    CPC分类号： H04J14/02 ,  G02F1/0147 ,  G02F1/025 ,  G02F2203/15 ,  H04B10/506 ,  H04B10/572 ,  H04J14/0212

    摘要： An optical device that includes multiple optical modulators having target operating wavelengths that are distributed over a band of wavelengths and actual operating wavelengths is described. For example, the target operating wavelengths of adjacent optical modulators may be separated by a wavelength increment. Moreover, because of differences between the actual operating wavelengths and the target operating wavelengths of the optical modulators, tuning elements may be used to tune the optical modulators so that the actual operating wavelengths match corresponding carrier wavelengths in a set of optical signals. Furthermore, control logic in the optical device may assign the optical modulators to the corresponding carrier wavelengths based at least on differences between the carrier wavelengths and the actual operating wavelengths, thereby reducing an average tuning energy associated with the tuning elements.

    摘要翻译： 描述了一种光学装置，其包括具有分布在波长带和实际工作波长上的目标工作波长的多个光调制器。 例如，相邻光调制器的目标工作波长可以被波长增量分开。 此外，由于实际工作波长与光调制器的目标工作波长之间的差异，调谐元件可用于调谐光调制器，使得实际工作波长匹配一组光信号中的对应载波波长。 此外，光学装置中的控制逻辑可以至少基于载波波长和实际工作波长之间的差异将光调制器分配给相应的载波波长，从而减少与调谐元件相关联的平均调谐能量。

    Three-dimensional macro-chip including optical interconnects
    76.
    发明授权
    Three-dimensional macro-chip including optical interconnects 有权
    三维宏片包括光互连

    公开(公告)号：US08768123B2

    公开(公告)日：2014-07-01

    申请号：US13566598

    申请日：2012-08-03

    申请人： Jin Yao ,  Xuezhe Zheng ,  Ashok V. Krishnamoorthy ,  John E. Cunningham

    发明人： Jin Yao ,  Xuezhe Zheng ,  Ashok V. Krishnamoorthy ,  John E. Cunningham

    IPC分类号： G02B6/02

    CPC分类号： G02B6/13 ,  G02B6/12002

    摘要： A multi-chip module (MCM) includes a stack of chips that are coupled using optical interconnects. On a first surface of a middle chip in the stack, there are: a first optical coupler, an optical waveguide, which is coupled to the first optical coupler, and a second optical coupler, which is coupled to the optical waveguide. The first optical coupler redirects an optical signal from the optical waveguide to a first direction (which is not in the plane of the first surface), or from the first direction to the optical waveguide. The second optical coupler redirects the optical signal from the optical waveguide to a second direction (which is not in the plane of the first surface), or from the second direction to the optical waveguide. An optical path associated with the second direction passes through an opening in a substrate in the middle chip.

    摘要翻译： 多芯片模块（MCM）包括使用光学互连耦合的一堆芯片。 在堆叠中的中间芯片的第一表面上，存在：耦合到第一光耦合器的第一光耦合器，光波导和耦合到光波导的第二光耦合器。 第一光学耦合器将来自光波导的光信号重定向到第一方向（其不在第一表面的平面中）或从第一方向到光波导。 第二光耦合器将来自光波导的光信号重定向到第二方向（其不在第一表面的平面中）或从第二方向到光波导。 与第二方向相关联的光路通过中间芯片中的基板的开口。

    ENERGY-EFFICIENT OPTICAL SOURCE
    78.
    发明申请
    ENERGY-EFFICIENT OPTICAL SOURCE 有权
    能源效率的光源

    公开(公告)号：US20130195461A1

    公开(公告)日：2013-08-01

    申请号：US13361866

    申请日：2012-01-30

    申请人： Ashok V. Krishnamoorthy ,  Xuezhe Zheng ,  John E. Cunningham

    发明人： Ashok V. Krishnamoorthy ,  Xuezhe Zheng ,  John E. Cunningham

    IPC分类号： H04J14/02

    CPC分类号： H04J14/02 ,  H04B10/506 ,  H04J14/0221

    摘要： An optical source includes a set of N light sources that provide a corresponding set of N optical signals having N carrier wavelengths. These optical signals are combined into a seed optical signal and transported to a substrate using an optical fiber. This substrate includes a set of K optical amplifiers that amplify the seed optical signal and provide a set of M output optical signals on a corresponding set of M output optical waveguides (where M is less than K). In this way, a total power of the set of M output optical signals may be significantly larger than that of the seed optical signal, thereby ensuring that a majority of a power efficiency of the optical source is associated with power efficiencies of the set of K optical amplifiers instead of power efficiencies of the set of N light sources.

    摘要翻译： 光源包括一组N个光源，其提供具有N个载波波长的相应的一组N个光信号。 这些光信号被组合成种子光信号，并使用光纤传输到基板。 该衬底包括一组放大种子光信号的K个放大器，并在相应的一组M个输出光波导（其中M小于K）上提供一组M个输出光信号。 以这种方式，一组M个输出光信号的总功率可以显着大于种子光信号的总功率，从而确保光源的大部分功率效率与该组K的功率效率相关联 光放大器而不是N组光源的功率效率。

    DIRECT INTERLAYER OPTICAL COUPLER
    79.
    发明申请
    DIRECT INTERLAYER OPTICAL COUPLER 有权
    直接中间层光耦合器

    公开(公告)号：US20130121635A1

    公开(公告)日：2013-05-16

    申请号：US13293624

    申请日：2011-11-10

    申请人： Hiren D. Thacker ,  Xuezhe Zheng ,  Ivan Shubin ,  Kannan Raj ,  John E. Cunningham ,  Ashok V. Krishnamoorthy

    发明人： Hiren D. Thacker ,  Xuezhe Zheng ,  Ivan Shubin ,  Kannan Raj ,  John E. Cunningham ,  Ashok V. Krishnamoorthy

    IPC分类号： G02B6/26 ,  B23P11/00

    CPC分类号： G02B6/26 ,  Y10T29/49826

    摘要： In an MCM, an optical signal is conveyed by an optical waveguide disposed on a surface of a first substrate to an optical coupler having a vertical facet. This optical coupler has an optical mode that is different than the optical mode of the optical waveguide. For example, the spatial extent of the optical mode associated with the optical coupler may be larger, thereby reducing optical losses and sensitivity to alignment errors. Then, the optical signal is directly coupled from the vertical facet to a facing vertical facet of an identical optical coupler on another substrate, and the optical signal is conveyed in another optical waveguide disposed on the other substrate.

    摘要翻译： 在MCM中，光信号由设置在第一基板的表面上的光波导传送到具有垂直面的光耦合器。 该光耦合器具有与光波导的光学模式不同的光学模式。 例如，与光耦合器相关联的光学模式的空间范围可能更大，从而减少光学损耗和对准误差的灵敏度。 然后，光信号从另一基板上的垂直面到同一光耦合器的面向垂直面直接耦合，并且光信号在设置在另一基板上的另一光波导中传送。

    THREE-DIMENSIONAL MACRO-CHIP INCLUDING OPTICAL INTERCONNECTS
    80.
    发明申请
    THREE-DIMENSIONAL MACRO-CHIP INCLUDING OPTICAL INTERCONNECTS 有权
    三维宏块包括光学互连

    公开(公告)号：US20120321251A1

    公开(公告)日：2012-12-20

    申请号：US13566598

    申请日：2012-08-03

    申请人： Jin Yao ,  Xuezhe Zheng ,  Ashok V. Krishnamoorthy ,  John E. Cunningham

    发明人： Jin Yao ,  Xuezhe Zheng ,  Ashok V. Krishnamoorthy ,  John E. Cunningham

    IPC分类号： G02B6/26

    CPC分类号： G02B6/13 ,  G02B6/12002

    摘要： A multi-chip module (MCM) includes a stack of chips that are coupled using optical interconnects. On a first surface of a middle chip in the stack, there are: a first optical coupler, an optical waveguide, which is coupled to the first optical coupler, and a second optical coupler, which is coupled to the optical waveguide. The first optical coupler redirects an optical signal from the optical waveguide to a first direction (which is not in the plane of the first surface), or from the first direction to the optical waveguide. The second optical coupler redirects the optical signal from the optical waveguide to a second direction (which is not in the plane of the first surface), or from the second direction to the optical waveguide. An optical path associated with the second direction passes through an opening in a substrate in the middle chip.

    摘要翻译： 多芯片模块（MCM）包括使用光学互连耦合的一堆芯片。 在堆叠中的中间芯片的第一表面上，存在：耦合到第一光耦合器的第一光耦合器，光波导和耦合到光波导的第二光耦合器。 第一光学耦合器将来自光波导的光信号重定向到第一方向（其不在第一表面的平面中）或从第一方向到光波导。 第二光耦合器将来自光波导的光信号重定向到第二方向（其不在第一表面的平面中）或从第二方向到光波导。 与第二方向相关联的光路通过中间芯片中的基板的开口。