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公开(公告)号：US12127283B2
公开(公告)日：2024-10-22
申请号：US17621820
申请日：2020-07-03
发明人： Arijit Sen , Koustav Roy , Manasi Ekkundi , Jagadeesh Gandikota
CPC分类号： H04W76/15 , G01S5/0236 , H04W24/10 , H04W28/06 , H04W36/00698 , H04W36/0088
摘要： In an example embodiment, a method of optimizing service delivery performed by a UE operating in EN-DC mode is disclosed. The method comprises detecting that a network service is ongoing at the UE using a first radio access technology (RAT), based on an application request sent by the UE to a network, wherein the first RAT is one of long-term evolution (LTE) and NR. The method further comprises detecting, during the ongoing network service being availed using the first RAT, a frequency of one or more NR network procedures being performed by the UE to be greater than a first threshold frequency. The method further comprises modifying a measurement interval associated with an NR cell measurement procedure, in response to detecting the frequency of the NR network procedures to be greater than the first threshold frequency. Furthermore, the method comprises continuing the Network Service using the first RAT.
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公开(公告)号：US12127163B2
公开(公告)日：2024-10-22
申请号：US17469495
申请日：2021-09-08
发明人： Anil Agiwal , Jaehyuk Jang , Soenghun Kim
摘要： The present disclosure relates to a communication method and system for converging a 5th-Generation (5G) communication system for supporting higher data rates beyond a 4th-Generation (4G) system with a technology for Internet of Things (IoT). The present disclosure may be applied to intelligent services based on the 5G communication technology and the IoT-related technology, such as smart home, smart building, smart city, smart car, connected car, health care, digital education, smart retail, security and safety services. The present disclosure provides a method and apparatus for paging transmission and reception, SI window determination and UL carrier selection.
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83.发明授权公开(公告)号：US12127065B2
公开(公告)日：2024-10-22
申请号：US18507844
申请日：2023-11-13
发明人： Juho Kim , Chinkyu Kang , Kiyong Lee , Yongchul Choi
IPC分类号： H04W4/00 , H04W12/06 , H04W12/088 , H04W12/72 , H04W36/14 , H04W36/30 , H04L65/1016
CPC分类号： H04W36/14 , H04W12/06 , H04W12/088 , H04W12/72 , H04W36/30 , H04L65/1016
摘要： Provided are an electronic device and a control method for providing call continuity in a weak electric field environment. The electronic device according to various embodiments of the present document comprises: a processor; a memory operatively connected to the processor; and a wireless communication circuit operatively connected to the processor and the memory, wherein the processor can control the wireless communication circuit such that the electronic device receives a wireless signal for executing a call with an external electronic device through a first network, check the state of the wireless signal received through the wireless communication circuit, control, on at least a partial basis of a result of checking the checked state of the wireless signal, the wireless communication circuit such that an authentication request for performing the call is transmitted to a second network connected to the electronic device, and control, on at least a partial basis of a result of the authentication request, the wireless communication circuit such that the wireless signal, which is transmitted from the first network, for performing the call with the external electronic device is received through the second network.
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公开(公告)号：US12126929B2
公开(公告)日：2024-10-22
申请号：US18109960
申请日：2023-02-15
发明人： Kioh Jung , Seunghan Lee , Cheolhee Choi , Soonkyoung Choi , Dongyoul Park
CPC分类号： H04N5/2621 , H04N5/2628 , H04N23/675 , H04N23/6812 , H04N23/687 , H04N23/69
摘要： According to certain embodiments, an electronic device comprises: a motion sensor; a first camera module including a lens assembly and a driving circuit configured to move the lens assembly in a direction substantially perpendicular to an optical axis, the first camera module having a first angle of view when the lens assembly is positioned in a reference position; a second camera module having a second angle of view, wherein the first angle of view is entirely in the second angle of view; and at least one processor electrically connected to the motion sensor, the first camera module, and the second camera module, wherein the at least one processor is configured to: control the driving circuit to move the lens assembly based on motion data received from the motion sensor, thereby causing the first camera module to have a third angle of view, offset from the first angle of view by an angle, acquire, from the first camera module, a first image corresponding to the third angle of view, acquire a second image corresponding to the second angle of view from the second camera module, acquire depth information for the first image based on the second image and the motion data, and apply a bokeh effect to the first image based on the depth information.
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公开(公告)号：US12126718B2
公开(公告)日：2024-10-22
申请号：US17421911
申请日：2020-01-02
发明人： Bumhan Kim , Eunbi Kim , Sunjune Kong , Hansang Song
CPC分类号： H04L9/088 , G06F21/602 , G06F21/62 , H04L9/0861 , H04L9/0894 , H04L9/14 , H04L9/30 , H04L9/3263
摘要： An electronic device and a method of operating the electronic device are provided. Data corresponding to a user input is received through a user interface of the electronic device. The data is stored in a normal area of a memory of the electronic device. A quantity of information in the stored data is identified. At least one key is selected from a plurality of keys stored in the memory, based on at least the quantity of information. The data is encrypted using the at least one key. The encrypted data and information indicating the at least one key are transmitted to a secure area of the memory, which requires access authority.
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86.发明授权公开(公告)号：US12126686B2
公开(公告)日：2024-10-22
申请号：US18169887
申请日：2023-02-16
发明人： Sanghoon Cho , Namjin Kim
IPC分类号： H04L67/141 , H04L9/40 , H04L67/50
CPC分类号： H04L67/141 , H04L63/0846 , H04L67/50
摘要： An electronic device includes a communication circuit and a processor, The processor is configured to obtain a connection code related to an external electronic device through the communication circuit, discover the external electronic device through the communication circuit based on the connection code, establish a first secure channel with the external electronic device, based on the connection code, through the communication circuit, and transmit a control command for an internet-of-things (IoT) device to perform a designated action to the external electronic device through the first secure channel using the connection code.
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公开(公告)号：US12126005B2
公开(公告)日：2024-10-22
申请号：US18157105
申请日：2023-01-20
发明人： Naoki Suzuki , Nobuyoshi Yashiro , Yuichi Aihara
IPC分类号： H01M10/0562 , H01M4/133 , H01M4/134 , H01M4/36 , H01M4/38 , H01M4/583 , H01M4/587 , H01M10/052 , H01M10/0585 , H01M4/02
CPC分类号： H01M4/133 , H01M4/134 , H01M4/364 , H01M4/38 , H01M4/587 , H01M10/052 , H01M10/0562 , H01M10/0585 , H01M2004/027 , H01M2300/008
摘要： An all-solid lithium secondary battery, including: a cathode including a cathode active material layer; a solid electrolyte layer; and an anode including an anode active material layer, which forms an alloy or a compound with lithium, wherein the cathode, the solid electrolyte is between the cathode and the anode, wherein the anode active material layer includes about 33 weight percent to about 95 weight percent of an amorphous carbon with respect to the total mass of an anode active material in the anode active material layer, and a ratio of the initial charge capacity of the cathode active material layer to the initial charge capacity of the anode active material layer satisfies 0.01
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公开(公告)号：US12125954B2
公开(公告)日：2024-10-22
申请号：US17689026
申请日：2022-03-08
发明人： Junghun Lee , Kyoungjun Kim , Sun Kim , Seolyoung Choi
CPC分类号： H01L33/56 , H01L25/13 , H01L33/06 , H01L33/32 , H01L33/44 , H01L33/486 , H01L33/62 , H01L2933/0025 , H01L2933/005
摘要： A semiconductor light emitting device package includes a circuit board with an upper pad, a light emitting diode chip on the circuit board and having a first surface facing the circuit board and a second surface opposing the first surface, and the light emitting diode chip including a substrate, a semiconductor stack structure on the substrate that emits ultraviolet light, and electrodes connected to the semiconductor stack structure, connection bumps between the circuit board and the light emitting diode chip, the connection bumps connecting the upper pad and the electrodes, an underfill resin on the upper pad of the circuit board and covering at least a portion of a side surface of the light emitting diode chip, and a passivation layer on the light emitting diode chip and the underfill resin, the passivation layer covering the underfill resin and being spaced apart from the semiconductor stack structure.
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89.发明授权公开(公告)号：US12125869B2
公开(公告)日：2024-10-22
申请号：US17542720
申请日：2021-12-06
发明人： Kiwon Park , Geunwoo Ko , Inho Kim , Sungwook Lee , Jonghyun Lee , Byungchul Choi
IPC分类号： H01L27/15
CPC分类号： H01L27/156
摘要： A semiconductor light emitting device is provided. The semiconductor light emitting device includes a plurality of light emitting structures, each of which includes a first surface and a second surface, a plurality of embossed portions provided on the first surface; a partition wall structure provided on the first surface of the plurality of light emitting structures and including a plurality of partition walls which define a plurality of pixel spaces; and a fluorescent layer provided in the plurality of pixel spaces. A bottom surface of the partition wall structure contacts the plurality of embossed portions.
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公开(公告)号：US12125788B2
公开(公告)日：2024-10-22
申请号：US18386497
申请日：2023-11-02
发明人： Saehan Park , Hoonseok Seo , Gil Hwan Son , Byounghak Hong , Kang Ill Seo
IPC分类号： H01L23/528 , H01L21/768 , H01L21/822 , H01L21/8234 , H01L23/48 , H01L23/498 , H01L23/532 , H01L27/06
CPC分类号： H01L23/5286 , H01L21/76898 , H01L21/8221 , H01L23/481 , H01L27/0694 , H01L23/53209 , H01L23/53228 , H01L23/53242 , H01L23/53257
摘要： Provided is a semiconductor architecture including a wafer, a first semiconductor device provided on a first surface of the wafer, the first semiconductor device being configured to route signals, a second semiconductor device provided on a second surface of the wafer opposite to the first surface of the wafer, the second semiconductor device being configured to supply power, and a buried power rail (BPR) included inside of the wafer and extending from the first surface of the wafer to the second surface of the wafer, the BPR being configured to deliver the power from the second semiconductor device to the first semiconductor device.
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