公开(公告)号：USD445699S1

公开(公告)日：2001-07-31

申请号：US29132741

申请日：2000-11-13

Applicant: Kevin Lin

Designer： Kevin Lin

公开(公告)号：US06238974B1

公开(公告)日：2001-05-29

申请号：US09475212

申请日：1999-12-29

Applicant: Horng-Nan Chern ,  Kevin Lin ,  Kun-Chi Lin

Inventor： Horng-Nan Chern ,  Kevin Lin ,  Kun-Chi Lin

IPC: H01L218242

CPC classification number: H01L28/84 ,  H01L21/76895 ,  H01L27/10852

Abstract: A process of fabricating a bottom electrode for the storage capacitors of DRAM is disclosed. The process includes first forming an insulation layer on the surface of the device substrate, with the insulation layer patterned to form a contact opening that exposes a source/drain region of the memory cell transistor. A first conductive layer then covers the insulation layer and fills into the contact opening, with the first conductive layer contacting the exposed source/drain region. A native oxide layer is then formed on the surface of the first conductive layer. A second electrically conductive layer is then formed and patterned to form a recess substantially above the location of the contact opening in the insulation layer. A layer of HSG—Si then covers the surface of the second conductive layer and the surface of the recess, and the HSG—Si layer and the second conductive layer are patterned to form the bottom electrode of the capacitor. The recess and its covering HSG—Si layer increase the effective surface area of the bottom electrode of the capacitor.

Abstract translation: 公开了制造用于DRAM的存储电容器的底部电极的工艺。 该方法包括首先在器件衬底的表面上形成绝缘层，其中图案化绝缘层以形成暴露存储单元晶体管的源/漏区的接触开口。 然后，第一导电层覆盖绝缘层并填充到接触开口中，第一导电层与暴露的源极/漏极区接触。 然后在第一导电层的表面上形成自然氧化物层。 然后形成第二导电层并图案化以形成基本上在绝缘层中的接触开口位置上方的凹部。 然后，HSG-Si层覆盖第二导电层的表面和凹部的表面，并且对HSG-Si层和第二导电层进行图案化以形成电容器的底部电极。 凹槽及其覆盖的HSG-Si层增加了电容器底部电极的有效表面积。

公开(公告)号：US06190041B1

公开(公告)日：2001-02-20

申请号：US09327478

申请日：1999-06-09

Applicant: James Huang ,  Kevin Lin

Inventor： James Huang ,  Kevin Lin

IPC: G01K100

CPC classification number: G01J5/08 ,  A61B5/01 ,  G01J5/04 ,  G01J5/049 ,  G01J5/0818 ,  G01J5/0834 ,  G01J5/62

Abstract: The shutter construction of a tympanic thermometer comprises a base formed with a horizontal groove and a vertical slot that communicate with each other, wherein said horizontal groove is for mounting a wave guiding duct; a supporting frame formed at the rear end of said base and formed with at least a first engaging portion and at least a second engaging portion; a shutter plate mounted in said vertical slot for closing said wave guiding duct; a linking element, the fore end of the linking element being coupled to the lower portion of said shutter plate and the rear end of the linking element being engaged with said first engaging portion of said supporting frame so that the fore end of the linking element can be swayed up and down relative to the rear end thereof; a spring element, the fore end of the spring element being coupled to said linking element; and an actuating element, the fore end of the actuating element being engaged with said second engaging portion of said supporting frame and the rear end of the supporting frame being coupled to the rear end of said spring element so that the rear end of said actuating element can be swayed up and down relative to the fore end of said actuating element, thereby said linking element can be moved down by said spring element when said actuating element is pressed down.

Abstract translation: 鼓膜温度计的快门结构包括形成有水平槽和垂直槽的基座，所述垂直槽彼此连通，其中所述水平槽用于安装波导管; 支撑框架，形成在所述底座的后端，并形成有至少第一接合部分和至少第二接合部分; 安装在所述垂直槽中的挡板，用于关闭所述波导管; 联接元件的前端联接到所述活门板的下部，并且连接元件的后端与所述支撑框架的所述第一接合部分接合，使得连接元件的前端可以 相对于其后端上下摆动; 弹簧元件，弹簧元件的前端联接到所述连接元件; 和致动元件，所述致动元件的前端与所述支撑框架的所述第二接合部分接合，并且所述支撑框架的后端联接到所述弹簧元件的后端，使得所述致动元件的后端 可以相对于所述致动元件的前端上下摆动，由此当所述致动元件被按压时，所述连接元件可以被所述弹簧元件向下移动。

公开(公告)号：US6074955A

公开(公告)日：2000-06-13

申请号：US189116

申请日：1998-11-09

Applicant: Kevin Lin ,  Chia-Wen Liang ,  Kun-Chi Lin

Inventor： Kevin Lin ,  Chia-Wen Liang ,  Kun-Chi Lin

IPC: H01L21/311 ,  H01L21/60 ,  H01L21/768 ,  H01L21/8242

CPC classification number: H01L27/10852 ,  H01L21/76816 ,  H01L21/76897 ,  H01L21/31144 ,  H01L27/10873 ,  H01L27/10882

Abstract: A method of fabricating a node contact window. A substrate having devices and a first dielectric layer is provided. Bit lines having spacer are formed on the first dielectric layer and a second is formed on the first dielectric layer. A hard material layer is then formed on the second dielectric layer. An opening is formed within the second dielectric layer to expose the spacer and the first dielectric layer. A polysilicon spacer is then formed on the sidewalls of the opening. A node contact window is formed by etching through the first dielectric layer to expose the substrate.

Abstract translation: 一种制造节点接触窗口的方法。 提供具有器件和第一介电层的衬底。 具有间隔物的位线形成在第一电介质层上，第二电极形成在第一电介质层上。 然后在第二电介质层上形成硬质材料层。 在第二电介质层内形成开口以露出间隔物和第一介电层。 然后在开口的侧壁上形成多晶硅间隔物。 通过蚀刻穿过第一电介质层形成节点接触窗，露出衬底。

公开(公告)号：US20150171010A1

公开(公告)日：2015-06-18

申请号：US14133385

申请日：2013-12-18

Applicant: Robert L. Bristol ,  Kevin Lin ,  Kanwal Jit Singh ,  Alan M. Myers ,  Richard E. Schenker

Inventor： Robert L. Bristol ,  Kevin Lin ,  Kanwal Jit Singh ,  Alan M. Myers ,  Richard E. Schenker

IPC: H01L23/522 ,  H01L21/027 ,  H01L21/311 ,  H01L21/768

CPC classification number: H01L21/76897 ,  H01L21/0274 ,  H01L21/31111 ,  H01L21/31144 ,  H01L21/76802 ,  H01L21/76808 ,  H01L21/76816 ,  H01L21/76825 ,  H01L23/522 ,  H01L23/5226 ,  H01L23/5329 ,  H01L2924/0002 ,  H01L2924/00

Abstract: Self-aligned via and plug patterning with photobuckets for back end of line (BEOL) interconnects is described. In an example, an interconnect structure for an integrated circuit includes a first layer of the interconnect structure disposed above a substrate, the first layer having a first grating of alternating metal lines and dielectric lines in a first direction. The dielectric lines have an uppermost surface higher than an uppermost surface of the metal lines. The integrated circuit also includes a second layer of the interconnect structure disposed above the first layer of the interconnect structure. The second layer includes a second grating of alternating metal lines and dielectric lines in a second direction, perpendicular to the first direction. The dielectric lines have a lowermost surface lower than a lowermost surface of the metal lines of the second grating. The dielectric lines of the second grating overlap and contact, but are distinct from, the dielectric lines of the first grating. The integrated circuit also includes a region of dielectric material disposed between the metal lines of the first grating and the metal lines of the second grating, and in a same plane as upper portions of the dielectric lines of the first grating and lower portions of the dielectric lines of the second grating. The region of dielectric material is composed of a cross-linked photolyzable material.

Abstract translation: 描述了用于后端（BEOL）互连的带有光触点的自对准通孔和插头图案。 在一个示例中，用于集成电路的互连结构包括设置在衬底上方的互连结构的第一层，第一层具有在第一方向上交替的金属线和介质线的第一光栅。 介质线具有高于金属线的最上表面的最上表面。 集成电路还包括布置在互连结构的第一层之上的互连结构的第二层。 第二层包括垂直于第一方向的第二方向的交替金属线和介质线的第二光栅。 介质线具有比第二光栅的金属线的最下表面低的最低表面。 第二光栅的介质线与第一光栅的介质线重叠并接触，但不同。 集成电路还包括设置在第一光栅的金属线和第二光栅的金属线之间的电介质材料区域，并且在与第一光栅的介质线的上部和电介质的下部相同的平面中 第二光栅的线。 介电材料的区域由交联的可光致发光材料组成。

公开(公告)号：US20140083858A1

公开(公告)日：2014-03-27

申请号：US13624288

申请日：2012-09-21

Applicant: Weng Hong Teh ,  Kevin Lin ,  Feras Eid ,  Qing Ma

Inventor： Weng Hong Teh ,  Kevin Lin ,  Feras Eid ,  Qing Ma

IPC: B01D43/00 ,  H05K3/30

CPC classification number: H05K1/0272 ,  H01L21/568 ,  H01L24/19 ,  H01L24/20 ,  H01L25/50 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2924/1815 ,  H01L2924/18162 ,  H05K1/0212 ,  H05K1/185 ,  H05K3/0097 ,  H05K2201/097 ,  H05K2203/1536 ,  H05K2203/308 ,  Y10T29/4913

Abstract: Methods of forming a microelectronic packaging structure and associated structures formed thereby are described. Those methods may include attaching a microfluidic die to a package structure, wherein the microfluidic die comprises a plurality of asymmetric electrodes that may be coupled with signal pads disposed within the package structure.

Abstract translation: 描述了形成微电子封装结构的方法及由此形成的相关结构。 这些方法可以包括将微流体管芯附接到封装结构，其中微流体管芯包括可以与设置在封装结构内的信号焊盘耦合的多个不对称电极。

公开(公告)号：US08658677B2

公开(公告)日：2014-02-25

申请号：US13543760

申请日：2012-07-06

Applicant: Bijan Almassian ,  Martin J. Sadowski ,  Xu Kevin Lin

Inventor： Bijan Almassian ,  Martin J. Sadowski ,  Xu Kevin Lin

IPC: A61K31/44

CPC classification number: C07D235/30 ,  C07D213/38 ,  C07D213/53

Abstract: Compounds are provided according to formula I: where R, R′, R3, R4, R5, and R6 are as defined herein. Provided compounds and pharmaceutical compositions thereof are useful for the prevention and treatment of a variety of conditions in mammals including humans, including by way of non-limiting example, Alzheimer's Disease, Down's syndrome, Parkinson's Disease, and others.

Abstract translation: 根据式I提供化合物：其中R，R'，R 3，R 4，R 5和R 6如本文所定义。 提供的化合物及其药物组合物可用于预防和治疗包括人在内的哺乳动物中的多种病症，包括作为非限制性实例，阿尔茨海默病，唐氏综合征，帕金森病等。

公开(公告)号：US20110295349A1

公开(公告)日：2011-12-01

申请号：US13121088

申请日：2008-09-26

Applicant: Kevin Lin

Inventor： Kevin Lin

IPC: A61B18/18

CPC classification number: A61N5/0619 ,  A61N5/0616 ,  A61N2005/0643 ,  A61N2005/066

Abstract: A portable far-infrared physiotherapy equipment for thermal moxibustion may comprise at least a heating unit and a power control device connected to the heating unit for supplying power to the latter. The power control device may comprise: a charging control circuit connected to a power supply port to receive power supply from an external power source; an electricity storage unit connected to the charging control circuit to be charged; a power output control unit connecting the charging control circuit and the electricity storage unit to the heating unit respectively to enable to transfer power to the heating unit; and a micro controller unit connected to the electricity storage unit, the charging control circuit and the power output control unit to enable to control them. The present far-infrared physiotherapy equipment for thermal moxibustion is portable and convenient for users.

Abstract translation: 用于热灸的便携式远红外物理治疗设备可以包括至少一个加热单元和连接到加热单元的功率控制装置，用于向后者供电。 功率控制装置可以包括：充电控制电路，连接到电源端口以从外部电源接收电力供应; 连接到要充电的充电控制电路的蓄电单元; 功率输出控制单元，分别将充电控制电路和蓄电单元连接到加热单元，以便能够将功率传递到加热单元; 以及连接到蓄电单元，充电控制电路和功率输出控制单元的微控制器单元，以便能够控制它们。 目前用于热灸的远红外理疗设备便于携带，方便用户使用。

公开(公告)号：US20110163083A1

公开(公告)日：2011-07-07

申请号：US13062856

申请日：2008-09-09

Applicant: Kevin Lin

Inventor： Kevin Lin

IPC: H05B1/02

CPC classification number: H05B1/02 ,  A47J27/21058 ,  F24H1/185 ,  F24H9/2014 ,  F24H9/2021 ,  G05D23/1931

Abstract: A heating control device for a heating apparatus comprises a power control unit connected between an external power source and a heating unit of the heating apparatus to transfer power therebetween; a first temperature sensor provided near the heating unit for detecting the temperature thereof; a second temperature sensor provided at a portion of the heating apparatus for containing an object to be heated and for detecting the temperature of the object; a storage unit for storing temperature reference values; a micro controller unit electrically connected to the first and second temperature sensors, the power control unit and the storage unit, which is used to receive temperature signals from the sensors, compare the detected temperatures to the temperature reference values, and command the power control unit to supply the heating unit with different powers. A heating control method therefore is also disclosed.

Abstract translation: 一种用于加热装置的加热控制装置包括连接在外部电源和加热装置的加热单元之间的功率控制单元，用于在其间传递动力; 第一温度传感器，设置在加热单元附近，用于检测其温度; 第二温度传感器，设置在加热装置的一部分，用于容纳待加热物体并检测物体的温度; 用于存储温度参考值的存储单元; 电连接到第一和第二温度传感器的微控制器单元，用于从传感器接收温度信号的功率控制单元和存储单元将检测到的温度与温度参考值进行比较，并且命令功率控制单元 为不同功率的加热单元供电。 因此，还公开了一种加热控制方法。

公开(公告)号：US20100136919A1

公开(公告)日：2010-06-03

申请号：US12452617

申请日：2008-07-28

Applicant: Satha Sathananthan ,  Kevin Lin ,  Thanh Bui ,  Dobrica Vasic

Inventor： Satha Sathananthan ,  Kevin Lin ,  Thanh Bui ,  Dobrica Vasic

IPC: H04B17/00 ,  H04L27/28

CPC classification number: H04L25/0232

Abstract: The present invention relates to methods that can be used in a wireless communication system, and systems adapted to use such methods. In a preferred form the methods are useful in channel estimation in a wireless communication system using orthogonal frequency division multiplexing (OFDM). The system is provided with a control block to optimise channel estimation.

Abstract translation: 本发明涉及可用于无线通信系统的方法，以及适用于使用这种方法的系统。 在优选形式中，该方法在使用正交频分复用（OFDM）的无线通信系统中的信道估计中是有用的。 该系统具有控制块以优化信道估计。