摘要:
An integrated circuit is described. The integrated circuit may comprise a multitude of floating-gate electrodes, wherein at least one of the floating-gate electrodes has a lower width and an upper width, the lower width being larger than the upper width, and wherein the at least one of the floating-gate electrodes comprises a transition metal. A corresponding manufacturing method for an integrated circuit is also described.
摘要:
Embodiments of the invention relate generally to a method for manufacturing an integrated circuit, a method for manufacturing a cell arrangement, an integrated circuit, a cell arrangement, and a memory module. In an embodiment of the invention, a method for manufacturing an integrated circuit having a cell arrangement is provided, including forming at least one semiconductor fin structure having an area for a plurality of fin field effect transistors, wherein the area of each fin field effect transistor includes a first region having a first fin structure width, a second region having a second fin structure width, wherein the second fin structure width is smaller than the first fin structure width. Furthermore, a plurality of charge storage regions are formed on or above the second regions of the semiconductor fin structure.
摘要:
The invention relates to integrated circuits, to a cell, to a cell arrangement, to a method for manufacturing an integrated circuit, to a method for manufacturing a cell, and to a memory module. In an embodiment of the invention, an integrated circuit is provided having a cell, the cell including a low-k dielectric layer, a first high-k dielectric layer disposed above the low-k dielectric layer, a charge trapping layer disposed above the first high-k dielectric layer, and a second high-k dielectric layer disposed above the charge trapping layer.
摘要:
The memory cell array comprises a plurality of parallel fins provided as bitlines arranged at a distance of down to about 40 nm from one another and having a lateral dimension of less than about 30 nm, subdivided into pairs of adjacent first and second fins. A charge-trapping memory layer sequence is arranged on the fins. Wordlines are arranged across the fins, and source/drain regions are located in the fins between the wordlines and at the ends of the fins. There are preferably self-aligned contact areas of the source/drain regions at the ends of the fins, each contact area being common to the fins of one of said pairs. Select transistors and select lines are provided for the first and second fins individually to enable a separate addressing of the memory cells.
摘要:
Memory cell having an auxiliary substrate, on which a first gate insulating layer is formed, a floating gate formed on the first gate insulating layer, an electrically insulating layer formed on the floating gate, a memory gate electrode formed on the electrically insulating layer, a substrate fixed to the memory gate electrode, a second gate insulating layer formed on a part of a surface of the auxiliary substrate, which surface is uncovered by partially removing the auxiliary substrate, a read gate electrode formed on the second gate insulating layer, and two source/drain regions located essentially in a surface region of the remaining material of the auxiliary substrate that is free of the second gate insulating layer and the read gate electrode, a channel region located between the two source/drain regions, wherein the channel region at least partly laterally overlaps the floating gate and the read gate electrode.
摘要:
A semiconductor memory component comprises at least one memory cell. The memory cell comprises a semiconductor body comprised of a body region, a drain region and a source region, a gate dielectric, and a gate electrode. The body region comprises a first conductivity type and a depression between the source and drain regions, and the source and drain regions comprise a second conductivity type. The gate electrode is arranged at least partly in the depression and is insulated from the body, source, and drain regions by the gate dielectric. The body region further comprises a first continuous region with a first dopant concentration and a second continuous region with a second dopant concentration greater than the first dopant concentration. The first continuous region adjoins the drain region, the depression and the source region, and the second region is arranged below the first region and adjoins the first region.
摘要:
The invention relates to a vertical integrated component, a component arrangement and a method for production of a vertical integrated component. The vertical integrated component has a first electrical conducting layer, a mid layer, partly embodied from dielectric material on the first electrical conducting layer, a second electrical conducting layer on the mid layer and a nanostructure integrated in a through hold introduced in the mid layer. A first end section of the nanostructure is coupled to the first electrical conducting layer and a second end section is coupled to the second electrical conducting layer. The mid layer includes a third electrical conducting layer between two adjacent dielectric partial layers, the thickness of which is less than the thickness of at least one of the dielectric partial layers.
摘要:
Memory cells, formed as trench transistors, having a respective floating gate electrode and a control gate electrode at a trench wall above a channel region between doped regions for source and drain are provided with a gate electrode arranged in a further trench, via which gate electrode the channel region present in a semiconductor ridge between the trenches can additionally be driven.
摘要:
A memory cell having a storage capacitor and a vertical switching transistorm, which has a semiconducting nanostructure which has grown on at least part of the storage capacitor and includes a semiconducting nanotube, a bundle of semiconducting nanotubes, or a semiconducting nanorod.
摘要:
Semiconductor memory having memory cells, each including first and second conductively-doped contact regions and a channel region arranged between the latter, formed in a web-like rib made of semiconductor material and arranged one behind the other in this sequence in the longitudinal direction of the rib. The rib has an essentially rectangular shape with an upper side of the rib and rib side faces lying opposite. A memory layer is configured for programming the memory cell, arranged on the upper side of the rib spaced apart by a first insulator layer, and projects in the normal direction of the one rib side face over one of the rib side faces so that the one rib side face and the upper side of the rib form an edge for injecting charge carriers from the channel region into the memory layer. A gate electrode is spaced apart from the one rib side face by a second insulator layer and from the memory layer by a third insulator layer, electrically insulated from the channel region, and configured to control its electrical conductivity.