Non-volatile memory cells and method for fabricating non-volatile memory cells
    5.
    发明申请
    Non-volatile memory cells and method for fabricating non-volatile memory cells 审中-公开
    非易失性存储单元和用于制造非易失性存储单元的方法

    公开(公告)号:US20070096198A1

    公开(公告)日:2007-05-03

    申请号:US11262309

    申请日:2005-10-28

    IPC分类号: H01L29/788

    摘要: The invention relates to non-volatile memory cells. Further, the invention relates to a method for fabricating non-volatile memory cells. Memory cells are formed on a semiconductor wafer having a protruding element with a top surface. A transistor is formed having a first part, a second part, and a third part. The first part includes a first junction region and a first charge trapping layer on the top surface. The second part includes a second junction region and charge trapping layer on the top surface. The third part has a gate electrode and a gate dielectric layer at least partially on sidewalls of the protruding element. The gate electrode contacts the first and second charge trapping layers.

    摘要翻译: 本发明涉及非易失性存储单元。 此外,本发明涉及一种制造非易失性存储单元的方法。 存储单元形成在具有顶表面的突出元件的半导体晶片上。 晶体管形成有第一部分,第二部分和第三部分。 第一部分包括顶表面上的第一接合区域和第一电荷俘获层。 第二部分包括顶表面上的第二结区和电荷捕获层。 第三部分至少部分地在突出元件的侧壁上具有栅极电极和栅极电介质层。 栅电极接触第一和第二电荷捕获层。

    Semiconductor memory device
    6.
    发明申请
    Semiconductor memory device 有权
    半导体存储器件

    公开(公告)号:US20060267084A1

    公开(公告)日:2006-11-30

    申请号:US11139976

    申请日:2005-05-31

    IPC分类号: H01L29/76

    摘要: A semiconductor memory device comprises a plurality of memory cells, each memory cell having a respective transistor. The transistor comprises a transistor body of a first conductivity type, a drain area and a source area each having a second conductivity type, wherein said drain area and source area are embedded in the transistor body on a first surface of said transistor body, a gate structure having a gate dielectric layer and a gate electrode. Said gate structure is arranged between said drain area and said source area. An emitter area of said first conductivity type is provided wherein said emitter area is arranged on top of said drain area.

    摘要翻译: 半导体存储器件包括多个存储单元,每个存储单元具有相应的晶体管。 晶体管包括第一导电类型的晶体管体,漏极区域和源极区域,每个具有第二导电类型,其中所述漏极区域和源极区域嵌入在所述晶体管本体的第一表面上的晶体管本体中,栅极 具有栅极电介质层和栅电极的结构。 所述栅极结构布置在所述漏极区域和所述源极区域之间。 提供了所述第一导电类型的发射极区域,其中所述发射极区域布置在所述漏极区域的顶部。

    Semiconductor memory device
    10.
    发明申请
    Semiconductor memory device 审中-公开
    半导体存储器件

    公开(公告)号:US20060267064A1

    公开(公告)日:2006-11-30

    申请号:US11139977

    申请日:2005-05-31

    IPC分类号: H01L29/94

    摘要: The semiconductor memory device comprises a plurality of memory cells. Each memory cell comprises a respective transistor and a respective capacitor unit. The transistor comprises a transistor body of a first conductivity type, a drain area and a source area each having a second conductivity type, the drain area and source area are embedded in the transistor body on a first surface of the transistor body, and a gate structure having a gate dielectric layer and a gate electrode, the gate structure is arranged between the drain area and the source area. An isolation trench is arranged adjacent to said transistor body, having a dielectric layer and a conductive material, wherein the isolation trench is at least partially filled with the conductive material. The conductive material is isolated by said dielectric layer from the transistor body. The capacitor unit is formed by the transistor body representing a first electrode and the conductive material representing the second electrode.

    摘要翻译: 半导体存储器件包括多个存储单元。 每个存储单元包括相应的晶体管和相应的电容器单元。 晶体管包括第一导电类型的晶体管体,漏极区域和源极区域,每个具有第二导电类型,漏极区域和源极区域嵌入在晶体管本体的第一表面上,并且栅极 具有栅极介电层和栅电极的结构,栅极结构布置在漏极区域和源极区域之间。 绝缘沟槽被布置成与所述晶体管本体相邻,具有电介质层和导电材料,其中隔离沟槽至少部分地被导电材料填充。 导电材料通过所述介电层与晶体管本体隔离。 电容器单元由表示第一电极的晶体管体和表示第二电极的导电材料形成。