公开(公告)号：US20020179122A1

公开(公告)日：2002-12-05

申请号：US10164164

申请日：2002-06-05

Applicant: Semitool, Inc.

Inventor： Raymon F. Thompson ,  Clif Neil

IPC: B08B003/02

CPC classification number: H01L21/67313 ,  B08B3/02 ,  Y10S134/901 ,  Y10S134/902 ,  Y10S414/14

Abstract: In a method for processing flat media, such as semiconductor wafers, first and second cassettes carrying wafers are loaded into a dual position rotor. The cassettes are restrained within the rotor by support tubes and hold down pins. Processing capacity is increased, as two cassettes are simultaneously processed.

Abstract translation: 在用于处理诸如半导体晶片的扁平介质的方法中，将携带晶片的第一和第二盒装载到双位置转子中。 通过支撑管和压紧销将盒子限制在转子内。 随着两个盒被同时处理，处理能力增加。

公开(公告)号：US20020154976A1

公开(公告)日：2002-10-24

申请号：US10159879

申请日：2002-05-29

Applicant: Semitool, Inc.

Inventor： Randy Harris ,  David Peterson ,  Jeffry Davis

IPC: B65B021/02 ,  B65G065/04 ,  B65G065/34 ,  B65B069/00

CPC classification number: H01L21/67057 ,  Y10S134/902 ,  Y10S414/135 ,  Y10S414/138

Abstract: A process system for processing semiconductor wafers includes a stocker module, and immersion module, and a process module. A process robot moves on a lateral rail to transfer wavers between the modules. The immersion module is separated from the other modules, to avoid transmission of vibration. Immersion tanks are radially positioned within the immersion module, to provide a compact design. An immersion robot moves batches of wafers on an end effector between the immersion tanks. The end effector may be detachable from the immersion robot, so that the immersion robot can move a second batch of wafers, while the first batch of wafers undergoes an immersion process.

公开(公告)号：US20020150449A1

公开(公告)日：2002-10-17

申请号：US10163837

申请日：2002-06-05

Applicant: Semitool, Inc.

Inventor： Gordon Ray Nelson ,  Daniel P. Bexten ,  Jeffry A. Davis

IPC: B65G049/07

CPC classification number: H01L21/68707 ,  H01L21/67742 ,  H01L21/67754 ,  H01L21/67769 ,  H01L21/67772 ,  H01L21/67775 ,  H01L21/67778 ,  H01L21/67781 ,  Y10S414/137

Abstract: An automated semiconductor processing system has an indexer bay perpendicularly aligned with a process bay within a clean air enclosure. An indexer in the indexer bay provides stocking or storage for work in progress semiconductor wafers. Process chambers are located in the process bay: A process robot moves between the indexer bay and process bay to carry semi-conductor wafers to and from the process chambers. The process robot has a robot arm vertically moveable along a lift rail. Semiconductor wafers are carried offset from the robot arm, to better avoid contamination. The automated system is compact and requires less clean room floor space.

Abstract translation: 自动半导体处理系统具有与清洁空气封闭体内的工艺间隔垂直对准的分度器托架。 索引器托架中的索引器为进行中的半导体晶片提供放样或存储。 过程室位于过程室中：过程机器人在分度器托架和过程间隔之间移动，以将半导体晶片运送到过程室和从处理室运送。 过程机器人具有可沿着升降轨道垂直移动的机器人手臂。 半导体晶片从机器人手臂偏移，以更好地避免污染。 自动化系统紧凑，需要较少的洁净室空间。

公开(公告)号：US20020144973A1

公开(公告)日：2002-10-10

申请号：US10150631

申请日：2002-05-17

Applicant: Semitool, Inc.

Inventor： Brian Aegerter ,  Curt T. Dundas ,  Michael Jolley ,  Tom L. Ritzdorf ,  Steven L. Peace ,  Gary L. Curtis ,  Raymon F. Thompson

IPC: H01B013/00

CPC classification number: H01L21/67017 ,  C23F1/18 ,  H01L21/32134 ,  H01L21/6708 ,  Y10S438/928 ,  Y10S438/963

Abstract: In a process for treating a workpiece such as a semiconductor wafer, a processing fluid is selectively applied or excluded from an outer peripheral margin of at least one of the front or back sides of the workpiece. Exclusion and/or application of the processing fluid occurs by applying one or more processing fluids to the workpiece while the workpiece and a reactor holding the workpiece are spinning. The flow rate of the processing fluids, fluid pressure, and/or spin rate are used to control the extent to which the processing fluid is selectively applied or excluded from the outer peripheral margin.

Abstract translation: 在处理诸如半导体晶片的工件的处理中，处理流体被选择性地从工件的前侧或后侧中的至少一个的外周边缘施加或排除。 通过在工件和保持工件的反应器旋转的同时将一种或多种加工流体施加到工件来发生加工流体的排除和/或应用。 处理流体的流量，流体压力和/或旋转速率用于控制从外周边缘选择性地施加或排除处理流体的程度。

公开(公告)号：US6432214B2

公开(公告)日：2002-08-13

申请号：US11344098

申请日：1998-07-10

Applicant: SEMITOOL INC

Inventor： BRYER CHARLES JAMES ,  BEXTEN DANIEL P ,  NORBY JERRY R

IPC: B08B3/02 ,  H01L21/00 ,  B08B7/04

CPC classification number: H01L21/6704 ,  B08B3/02 ,  Y10S134/902

Abstract: A machine for cleaning containers has inside and outside arrays of nozzles arranged to spray a cleaning solution onto containers supported on a spinning rotor. Used cleaning solution is diverted to a reclaim tank for reuse, thereby allowing low-cost cleaning with concentrated chemicals, and with the creation of less liquid waste requiring disposal. In a method for removing contaminants from flat media or silicon wafer containers or carriers, a mixture of surfactant and de-ionized water is sprayed onto containers on a spinning rotor. The used cleaning solution is collected, filtered and reused.

Abstract translation: 用于清洁容器的机器具有内部和外部喷嘴阵列，布置成将清洁溶液喷射到支撑在旋转转子上的容器上。 使用的清洁溶液被转移到回收罐中以便重新使用，从而允许使用浓缩的化学品进行低成本的清洁，并且减少需要处理的废液。 在从平坦介质或硅晶片容器或载体中除去污染物的方法中，将表面活性剂和去离子水的混合物喷雾到旋转转子上的容器上。 使用过的清洁溶液被收集，过滤并重复使用。

公开(公告)号：US20020100495A1

公开(公告)日：2002-08-01

申请号：US10043716

申请日：2002-01-09

Applicant: Semitool, Inc.

Inventor： Dan Bexten ,  Jerry Norby

IPC: B08B003/02

CPC classification number: H01L21/6704 ,  B08B3/02 ,  B08B9/0861 ,  B08B9/093 ,  H01L21/67051

Abstract: A machine for cleaning containers such as flat media carriers has inside and outside arrays of nozzles arranged to spray a cleaning solution onto containers supported on a spinning rotor in a chamber. The cleaning solution, a mixture of water and a detergent or surfactant, is prepared by drawing out surfactant directly from a surfactant bulk storage vessel by means of a metering pump. The flow rate of the water is measured by a flow meter and in combination with the metering pump, a proper amount of surfactant is injected into the water line to produce a mixture with a desired surfactant concentration for removing contaminants. The mixture is injected into the water line at a mixing control valve to ensure that the water and surfactant are thoroughly mixed before being injected into the media carrier. Where the wafer carrier is provided with multiple rinse manifolds for spraying the carrier, a flow meter and mixing control valve are provided in the water inlet line for each manifold and a separate metering pump is provided for injecting surfactant into each water line to ensure that a proper amount of surfactant is injected into each water line to produce a surfactant/water mixture with a desired surfactant concentration.

Abstract translation: 用于清洁诸如平坦介质载体的容器的机器具有内部和外部喷嘴阵列，布置成将清洁溶液喷射到在室中旋转的转子上支撑的容器上。 清洁溶液，水和洗涤剂或表面活性剂的混合物通过用计量泵从表面活性剂散装储存容器中直接抽出表面活性剂来制备。 通过流量计测量水的流量，并与计量泵组合，将适量的表面活性剂注入到水管线中以产生具有所需表面活性剂浓度以除去污染物的混合物。 将混合物在混合控制阀处注入水管线中，以确保水和表面活性剂在注入介质载体之前被充分混合。 在晶片载体上设置有多个用于喷涂载体的冲洗歧管的情况下，在每个歧管的进水管线中设置流量计和混合控制阀，并且提供单独的计量泵，用于将表面活性剂注入到每个水管线中，以确保 将适量的表面活性剂注入每条水线以产生具有所需表面活性剂浓度的表面活性剂/水混合物。

公开(公告)号：US20010050060A1

公开(公告)日：2001-12-13

申请号：US09921840

申请日：2001-08-02

Applicant: SEMITOOL, INC.

Inventor： Gary L. Curtis ,  Raymon F. Thompson

IPC: C23C016/00

CPC classification number: H01L21/67017 ,  B08B3/04 ,  H01L21/32134 ,  H01L21/6708 ,  Y10S134/902

Abstract: An apparatus for processing a workpiece in a micro-environment includes a workpiece housing connected to be rotated by a motor. The workpiece housing forms a substantially closed processing chamber where one or more processing fluids are distributed across at least one face of the workpiece by centrifugal force generated during rotation of the housing. A sump is connected to an inlet and an outlet in the chamber. Rotation of the workpiece housing recirculates fluid into the chamber.

Abstract translation: 用于在微环境中处理工件的装置包括连接以由电动机旋转的工件壳体。 工件壳体形成基本封闭的处理室，其中一个或多个处理流体通过在壳体旋转期间产生的离心力分布在工件的至少一个面上。 贮槽连接到腔室中的入口和出口。 工件壳体的旋转使流体进入腔室。

公开(公告)号：US20010047752A1

公开(公告)日：2001-12-06

申请号：US09921854

申请日：2001-08-02

Applicant: SEMITOOL, INC.

Inventor： Gary L. Curtis ,  Raymon F. Thompson

IPC: B05C011/02

CPC classification number: H01L21/67017 ,  B08B3/04 ,  H01L21/32134 ,  H01L21/6708 ,  Y10S134/902

Abstract: An apparatus for processing a workpiece in a micro-environment includes a workpiece housing connected to a motor for rotation. The workpiece housing forms a processing chamber where one or more processing fluids are distributed across at least one face of the workpiece by centrifugal force generated during rotation of the housing. An array of workpiece housings are contained within an enclosure. A robot moves workpieces into and out of the workpiece housings.

Abstract translation: 用于在微环境中处理工件的装置包括连接到用于旋转的电动机的工件壳体。 工件壳体形成处理室，其中一个或多个处理流体通过在壳体旋转期间产生的离心力分布在工件的至少一个表面上。 工件外壳的阵列包含在外壳内。 机器人将工件移入和移出工件外壳。

公开(公告)号：US20010017143A1

公开(公告)日：2001-08-30

申请号：US09836080

申请日：2001-04-16

Applicant: Semitool, Inc.

Inventor： Eric J. Bergman

IPC: B08B007/04

CPC classification number: H01L21/02054 ,  B08B3/08 ,  B08B7/00 ,  B08B2203/005 ,  B08B2230/01 ,  Y10S134/902 ,  Y10S438/906

Abstract: The invention encompasses methods for cleaning surfaces of wafers or other semiconductor articles. Oxidizing is performed using an oxidation solution which is wetted onto the surface. The oxidation solution can include one or more of: water, ozone, hydrogen chloride, sulfric acid, or hydrogen peroxide. A rinsing step removes the oxidation solution and inhibits further activity. The rinsed surface is thereafter preferably subjected to a drying step. The surface is exposed to an oxide removal vapor to remove semiconductor oxide therefrom. The oxide removal vapor can include one or more of: acids, such as a hydrogen halide, for example hydrogen fluoride or hydrogen chloride; water; isopropyl alcohol; or ozone. The processes can use centrifugal processing and spraying actions.

Abstract translation: 本发明包括用于清洁晶片或其它半导体产品表面的方法。 使用被润湿到表面上的氧化溶液进行氧化。 氧化溶液可以包括水，臭氧，氯化氢，硫酸或过氧化氢中的一种或多种。 漂洗步骤除去氧化溶液并抑制进一步的活性​​。 此后，漂洗后的表面优选进行干燥步骤。 将表面暴露于氧化物去除蒸气以从其中除去半导体氧化物。 氧化物去除蒸气可以包括一种或多种：酸，例如卤化氢，例如氟化氢或氯化氢; 水; 异丙醇 或臭氧。 这些工艺可以使用离心加工和喷涂动作。