Abstract:
Provided are a circuit and method for sampling a valid command using a valid address window extended for a high-speed operation in a double pumped address scheme memory device. A method for extending the valid address window includes: inputting a valid command signal and a first address signal at the first cycle of a clock signal; inputting a second address signal at the second cycle of the clock signal; generating a decoded command signal and extended first and second internal address signals respectively in response to the command signal and the address signals; and latching and decoding the extended first and second internal address signals in response to the decoded command signal.
Abstract:
A semiconductor memory device and a method of expanding a valid output data window are described. The semiconductor memory device includes a memory cell array and an output circuit. The memory cell array generates read data having a plurality of bits. The output circuit outputs the, read data sequentially in response to a clock signal in a normal mode. On the other hand, the output circuit selectively outputs the bits of the read data by latching bits to be tested among bits of the read data, and by electrically disconnecting bits not to be tested among bits of the read data in response to a plurality of switch control signals in a test mode. Therefore a valid data window of an output data may be expanded.
Abstract:
A termination value for a pin of a semiconductor device is set to a first value if a pin signal has a first logic state at an edge of a control signal, and to a second value if the pin signal has a second logic state at the edge of the control signal. Alternatively, a respective logic state of a first control signal is determined at an edge of a second control signal, and a respective logic state of the pin signal is determined at the edge of the second control signal. The termination value is set depending on such respective logic states.
Abstract:
Digital duty cycle correction circuits are provided including a duty cycle detector circuit configured to generate first and second control values associated with a first internal clock signal and a second internal clock signal, respectively. A comparator circuit is also provided and is configured to compare the first control value to the second control value and provide a comparison result. A counter circuit is configured to perform an addition and/or a subtraction operation responsive to the comparison result to provide a digital code. A digital to analog converter is configured to generate third and fourth control values responsive to the digital code. Finally, a duty cycle corrector circuit is configured to receive first and second external clock signals and the first through fourth control values and generate the first and second internal clock signals having a corrected duty cycle. The first and second control values are received over a first path and the third and fourth control values are received over a second path, different from the first path. Related methods of operating duty cycle correction circuits are also provided.
Abstract:
A solution for ruthenium chemical mechanical planarization containing a nitric acid and an oxidizer is disclosed. A method of forming ruthenium pattern using a polished ruthenium layer is also disclosed. The disclosed solution improves the polishing speed of ruthenium under low polishing pressure, reduces the dishing of ruthenium and decreases scratches generated in the interlayer insulating film. As a result, the disclosed solution and methods improve the techniques for device isolation and reduction of step coverage.
Abstract:
An improved missile restraining apparatus capable of effectively protecting a missile from an external impact and quickly releasing a missile restraining state when launching missile, which includes a pair of protrusions having a circular cross-section and formed in the rear portion of a missile, and a pair of brackets fixed to the inner surface of a launch tube and formed so that a pair of restraining grooves corresponding to said protrusions are formed in a predetermined direction, wherein one end of said restraining groove has a circular cross-section, and the other end thereof is shaped to have an elongating axis longer than the diameter of the protrusion in the radial direction and to have the same shorter axis as the restraining groove in the vertical direction.
Abstract:
A method of forming a semiconductor device can include forming an insulation layer using a material having a composition selected to provide resistance to subsequent etching process. The composition of the material can be changed to reduce the resistance of the material to the subsequent etching process at a predetermined level in the insulation layer. The subsequent etching process can be performed on the insulation layer to remove an upper portion of the insulation layer above the predetermined level and leave a lower portion of the insulation layer below the predetermined level between adjacent conductive patterns extending through the lower portion of the insulation layer. A low-k dielectric material can be formed on the lower portion of the insulation layer between the adjacent conductive patterns to replace the upper portion of the insulation layer above the predetermined level.
Abstract:
A method for fabricating a semiconductor device includes sequentially forming an interlayer insulating layer and a hard mask pattern including a first opening on a substrate including a lower pattern, forming a trench exposing the lower pattern in the interlayer insulating layer using the hard mask pattern, forming a liner layer including a first part formed along sidewalls and a bottom surface of the trench and a second part formed along a top surface of the hard mask pattern, forming a sacrificial pattern exposing the second part of the liner layer in the trench, removing the second part of the liner layer and the hard mask pattern using the sacrificial pattern, and after the removing of the hard mask pattern, removing the sacrificial pattern to expose the first part of the liner layer.
Abstract:
Disclosed herein is a structure of an FPC integrated touch panel. According to preferred embodiments of the present invention, a transparent substrate configured of a flexible transparent film is provided and an extension part protruded to the transparent substrate is integrally formed with the transparent substrate, such that a separate FPC needs not to be manufactured, thereby saving process time and manufacturing costs. In addition, the exemplary embodiments of the present invention bend an inactive area unnecessarily occupying an area of the transparent substrate to a side of the touch panel, thereby implementing a touch panel widening a substantial area of an active region.
Abstract:
A method of tailoring conformality of a film deposited on a patterned surface includes: (I) depositing a film by PEALD or pulsed PECVD on the patterned surface; (II) etching the film, wherein the etching is conducted in a pulse or pulses, wherein a ratio of an etching rate of the film on a top surface and that of the film on side walls of the patterns is controlled as a function of the etching pulse duration and the number of etching pulses to increase a conformality of the film; and (III) repeating (I) and (II) to satisfy a target film thickness.