公开(公告)号：US5171412A

公开(公告)日：1992-12-15

申请号：US749096

申请日：1991-08-23

申请人： Homoyoun Talieh ,  Avi Tepman ,  Hoa Thi Kieu ,  Chien-Rhone Wang

发明人： Homoyoun Talieh ,  Avi Tepman ,  Hoa Thi Kieu ,  Chien-Rhone Wang

IPC分类号： C23C14/04 ,  C23C14/22 ,  C23C14/34 ,  C23C14/54 ,  C23C14/58 ,  C23C28/00 ,  H01L21/203 ,  H01L21/28 ,  H01L21/285 ,  H01L21/321 ,  H01L21/768

CPC分类号： C23C14/046 ,  C23C14/34 ,  H01L21/2855 ,  H01L21/321 ,  H01L21/76877

摘要： The improved material deposition process of the present invention utilizes a first, low temperature deposition step followed by a second, high temperature/high power deposition step. In the first deposition step a collimation plate is placed between the sputtering target and the substrate, such that a collimated stream of sputtered material is deposited upon the substrate. The collimated stream provides a seed layer which aids in eliminating voids by partially filling the holes and grooves in the surface of the substrate. The second deposition step is conducted as a high temperature sputtering deposition. At the high temperature the sputtered material joins and flows with the seed layer, whereby the holes and grooves are more easily filled without voids and an improved planarized layer is achieved.

公开(公告)号：US08398832B2

公开(公告)日：2013-03-19

申请号：US11229139

申请日：2005-09-15

申请人： Jaim Nulman ,  Sergio Edelstein ,  Mani Subramani ,  Zheng Xu ,  Howard E. Grunes ,  Avi Tepman ,  John C. Forster ,  Praburam Gopalraja

发明人： Jaim Nulman ,  Sergio Edelstein ,  Mani Subramani ,  Zheng Xu ,  Howard E. Grunes ,  Avi Tepman ,  John C. Forster ,  Praburam Gopalraja

IPC分类号： C23C14/34

CPC分类号： C23C14/34 ,  H01J37/321 ,  H01J37/34

摘要： A sputtering coil for a plasma chamber in a semiconductor fabrication system is provided. The sputtering coil couples energy into a plasma and also provides a source of sputtering material to be sputtered onto a workpiece from the coil to supplement material being sputtered from a target onto the workpiece. Alternatively a plurality of coils may be provided, one primarily for coupling energy into the plasma and the other primarily for providing a supplemental source of sputtering material to be sputtered on the workpiece.

公开(公告)号：US07774887B2

公开(公告)日：2010-08-17

申请号：US12102846

申请日：2008-04-14

申请人： Joseph Yudovsky ,  Avi Tepman ,  Kenneth R. Reynolds ,  Younes Achkire ,  Dan A. Marohl ,  Steve G. Ghanayem ,  Alexander S. Polyak ,  Gary Ettinger ,  Haochuan Zhang ,  Hui Chen

发明人： Joseph Yudovsky ,  Avi Tepman ,  Kenneth R. Reynolds ,  Younes Achkire ,  Dan A. Marohl ,  Steve G. Ghanayem ,  Alexander S. Polyak ,  Gary Ettinger ,  Haochuan Zhang ,  Hui Chen

IPC分类号： B08B7/00 ,  A47L25/00

CPC分类号： H01L21/67046 ,  B08B1/04

摘要： A scrubber box is provided that includes a tank adapted to receive a substrate for cleaning, supports outside of the tank and adapted to couple to ends of scrubber brushes disposed within the tank, a motor mounted to each of the supports and adapted to rotate the scrubber brushes, a base to which the supports are pivotally mounted via spherical bearings adapted to permit toe-in of the scrubber brushes, a brush gap actuator adapted, via a crank and rocker mechanism, to substantially simultaneously pivot the supports toward or away from each other so as to permit the scrubber brushes to substantially simultaneously achieve or break contact with the substrate, and a toe-in actuator adapted to move two of the spherical bearings toward or away from each other so as to adjust a toe-in angle between the scrubber brushes.

摘要翻译： 提供了一种洗涤器箱，其包括适于接收用于清洁的基底的罐，支撑在罐外部并且适于耦合到设置在罐内的洗涤器刷的端部;马达，其安装到每个支撑件上并适于旋转洗涤器 电刷，支架通过适于允许洗涤器刷子进入的球面轴承可枢转地安装的基座，经由曲柄和摇臂机构适应的基本上同时地使支撑件朝向或远离彼此枢转的电刷间隙致动器 以便允许洗涤器刷子基本上同时实现或断开与基板的接触，以及适于将两个球形轴承朝向或远离彼此移动的脚趾致动器，以便调节洗涤器之间的束缚角度 刷子

公开(公告)号：US20100084023A1

公开(公告)日：2010-04-08

申请号：US12247013

申请日：2008-10-07

申请人： Chris Melcer ,  Thuy Britcher ,  Avi Tepman ,  Simon Y. Yavelberg ,  Sheshraj L. Tulshibagwale

发明人： Chris Melcer ,  Thuy Britcher ,  Avi Tepman ,  Simon Y. Yavelberg ,  Sheshraj L. Tulshibagwale

IPC分类号： F16K11/00

CPC分类号： H01L21/67219 ,  B24B37/04 ,  B24B57/02 ,  H01L21/67017 ,  Y10T137/0396 ,  Y10T137/877

摘要： Embodiments described herein provide an application for delivery of fluids within substrate processing systems. More particularly, embodiments described herein provide applications for delivery of processing chemicals within substrate processing systems. In one embodiment, a fluid delivery system is provided. The fluid delivery system comprises a bulk fluid source for supplying fluids, a fluid delivery module for controlling and monitoring a ratio of fluids flowing from the bulk fluid source, a first stream line positioned downstream from the fluid delivery module, a first switch positioned along the first stream line, a second stream line positioned downstream from the fluid delivery module, and a second switch positioned along the second stream line, wherein the fluid delivery module splits the fluids from the bulk fluid source into two streams flowing through the first stream line and the second stream line according to a pre-defined ratio.

摘要翻译： 本文所述的实施例提供了在衬底处理系统内输送流体的应用。 更具体地，本文描述的实施例提供了在衬底处理系统内递送处理化学品的应用。 在一个实施例中，提供流体输送系统。 流体输送系统包括用于供应流体的体液源，流体输送模块，用于控制和监测从大量流体源流出的流体的比例，位于流体输送模块下游的第一流线，沿着流体输送模块定位的第一开关 第一流线，位于流体输送模块下游的第二流线和沿着第二流线定位的第二开关，其中流体输送模块将流体从本体流体源分流成流过第一流线的两股流， 第二条流线根据预定义的比例。

公开(公告)号：US20080038998A1

公开(公告)日：2008-02-14

申请号：US11876202

申请日：2007-10-22

申请人： Alexander Polyak ,  Avi Tepman

发明人： Alexander Polyak ,  Avi Tepman

IPC分类号： B24B7/04

CPC分类号： B24B37/04 ,  B24B37/042 ,  B24B57/02

摘要： A polishing fluid delivery apparatus has been provided that in one embodiment includes a support member, a dispense arm, a polishing fluid delivery tube and a variable restricting device. The dispense arm extends from an upper portion of the support member and has an outlet of the delivery tube coupled thereto. The restricting device interfaces with the delivery tube and is adapted to provide a variable restriction to flow passing through the delivery tube. In another embodiment, the restricting device is a pinch valve and the tube in continuous from the outlet to beyond a portion that interfaces with the pinch valve. In yet another embodiment, the position of the dispense arm is controllable.

摘要翻译： 已经提供了一种抛光流体输送装置，其在一个实施例中包括支撑构件，分配臂，抛光流体输送管和可变限制装置。 分配臂从支撑构件的上部延伸并且具有与其连接的输送管的出口。 限制装置与输送管接口并且适于对通过输送管的流动提供可变的限制。 在另一个实施例中，限制装置是夹管阀，并且管从出口连续到超过与夹紧阀相接合的部分。 在另一个实施例中，分配臂的位置是可控的。

公开(公告)号：US20060246690A1

公开(公告)日：2006-11-02

申请号：US11476945

申请日：2006-06-27

申请人： Yezdi Dordi ,  Donald Olgado ,  Ratson Morad ,  Peter Hey ,  Mark Denome ,  Michael Sugarman ,  Mark Lloyd ,  Anna Lloyd ,  Joseph Stevens ,  Dan Marohl ,  Ho Shin ,  Eugene Ravinovich ,  Robin Cheung ,  Ashok Sinha ,  Avi Tepman ,  Dan Carl ,  George Birkmaier

发明人： Yezdi Dordi ,  Donald Olgado ,  Ratson Morad ,  Peter Hey ,  Mark Denome ,  Michael Sugarman ,  Mark Lloyd ,  Anna Lloyd ,  Joseph Stevens ,  Dan Marohl ,  Ho Shin ,  Eugene Ravinovich ,  Robin Cheung ,  Ashok Sinha ,  Avi Tepman ,  Dan Carl ,  George Birkmaier

IPC分类号： H01L21/20 ,  B05D3/00 ,  B05C13/00 ,  B05C13/02

CPC分类号： H01L21/6723 ,  C25D7/123 ,  C25D17/001 ,  C25D17/06 ,  C25D21/02 ,  C25D21/12 ,  H01L21/2885 ,  H01L21/67028 ,  H01L21/67051 ,  H01L21/6708 ,  H01L21/67126 ,  H01L21/67167 ,  H01L21/67184 ,  H01L21/67745 ,  H01L21/68707 ,  H01L21/68721 ,  H01L21/68728 ,  H01L21/68742 ,  H05K3/241

摘要： The present invention provides an electro-chemical deposition system that is designed with a flexible architecture that is expandable to accommodate future designs and gap fill requirements and provides satisfactory throughput to meet the demands of other processing systems. The electro-chemical deposition system generally comprises a mainframe having a mainframe wafer transfer robot, a loading station disposed in connection with the mainframe, one or more processing cells disposed in connection with the mainframe, and an electrolyte supply fluidly connected to the one or more electrical processing cells. Preferably, the electro-chemical deposition system includes a spin-rinse-dry (SRD) station disposed between the loading station and the mainframe, a rapid thermal anneal chamber attached to the loading station, and a system controller for controlling the electro-chemical deposition process and the components of the electro-chemical deposition system.

公开(公告)号：US20050167048A1

公开(公告)日：2005-08-04

申请号：US10970365

申请日：2004-10-21

申请人： Alexander Polyak ,  Avi Tepman

发明人： Alexander Polyak ,  Avi Tepman

IPC分类号： B24B37/04 ,  B24B53/007 ,  H01L21/3105 ,  C23F1/00

CPC分类号： B24B53/017 ,  H01L21/31053

摘要： In a first aspect, a first apparatus is provided for a chemical mechanical polishing (CMP) process. The first apparatus includes (1) a rotatable member; (2) an end effector adapted to receive and retain a conditioning disk; and (3) an elastic device disposed between the rotatable member and the end effector. The elastic device is (a) adapted to rotate the end effector via a torque from the rotatable member, and (b) flexibly extensible so as to impart a force to the end effector while permitting the end effector to deviate from a perpendicular alignment with the rotatable member in order for a conditioning surface of the conditioning disk to conform to an irregular polishing surface of a pad being conditioned. Numerous other aspects are provided, including methods and apparatus for using liquid or gas to deter polishing slurry or debris from entering the conditioning head.

摘要翻译： 在第一方面，提供了用于化学机械抛光（CMP）工艺的第一设备。 第一装置包括（1）可旋转构件; （2）适于接收和保持调节盘的端部执行器; 和（3）设置在可旋转构件和末端执行器之间的弹性装置。 弹性装置是（a）适于通过来自可旋转构件的扭矩旋转末端执行器，以及（b）柔性可伸展的，以便向末端执行器施加力，同时允许末端执行器偏离与 可旋转构件，以便调节盘的调节表面与被调节的垫的不规则抛光表面相一致。 提供了许多其它方面，包括使用液体或气体来阻止抛光浆料或碎屑进入调节头的方法和装置。

公开(公告)号：US20050087212A1

公开(公告)日：2005-04-28

申请号：US10976012

申请日：2004-10-28

申请人： Joseph Yudovsky ,  Avi Tepman ,  Kenneth Reynolds ,  Younes Achkire ,  Dan Marohl ,  Steve Ghanayem ,  Alexander Polyak ,  Gary Ettinger ,  Haochuan Zhang ,  Hui Chen

发明人： Joseph Yudovsky ,  Avi Tepman ,  Kenneth Reynolds ,  Younes Achkire ,  Dan Marohl ,  Steve Ghanayem ,  Alexander Polyak ,  Gary Ettinger ,  Haochuan Zhang ,  Hui Chen

IPC分类号： B08B1/04 ,  H01L21/00

CPC分类号： H01L21/67046 ,  B08B1/04

摘要： A scrubber box is provided that includes a tank adapted to receive a substrate for cleaning, supports outside of the tank and adapted to couple to ends of scrubber brushes disposed within the tank, a motor mounted to each of the supports and adapted to rotate the scrubber brushes, a base to which the supports are pivotally mounted via spherical bearings adapted to permit toe-in of the scrubber brushes, a brush gap actuator adapted, via a crank and rocker mechanism, to substantially simultaneously pivot the supports toward or away from each other so as to permit the scrubber brushes to substantially simultaneously achieve or break contact with the substrate, and a toe-in actuator adapted to move two of the spherical bearings toward or away from each other so as to adjust a toe-in angle between the scrubber brushes.

摘要翻译： 提供了一种洗涤器箱，其包括适于接收用于清洁的基底的罐，支撑在罐外部并且适于耦合到设置在罐内的洗涤器刷的端部;马达，其安装到每个支撑件上并适于旋转洗涤器 电刷，支架通过适于允许洗涤器刷子进入的球面轴承可枢转地安装的基座，经由曲柄和摇臂机构适应的基本上同时地使支撑件朝向或远离彼此枢转的电刷间隙致动器 以便允许洗涤器刷子基本上同时实现或断开与基板的接触，以及适于将两个球形轴承朝向或远离彼此移动的脚趾致动器，以便调节洗涤器之间的束缚角度 刷子

公开(公告)号：US06571657B1

公开(公告)日：2003-06-03

申请号：US09664607

申请日：2000-09-18

申请人： Donald J. Olgado ,  Avi Tepman ,  Timothy J. Franklin

发明人： Donald J. Olgado ,  Avi Tepman ,  Timothy J. Franklin

IPC分类号： B25J1700

CPC分类号： H01L21/67126 ,  B25J9/1638 ,  C25D7/12 ,  G05B2219/40351 ,  G05B2219/41457 ,  H01L21/2885 ,  H01L21/67051 ,  H01L21/67742 ,  H01L21/68707 ,  H05K3/241 ,  Y10T74/20311

摘要： The present invention provides an apparatus and associated method in which the apparatus comprises a multiple blade robot and a compensating device. The multiple blade robot includes at least one set of robot blades. The compensating device adjusts for differences in spacing between the set of robot blades and spacing between two or more cells. In different embodiments, the compensating device may be coupled to one or more of the process cells, one or more of the substrate holder systems, or one or more of the robot blades.

摘要翻译： 本发明提供了一种装置和相关联的方法，其中该装置包括多叶片机器人和补偿装置。 多刀片机器人包括至少一组机器人刀片。 补偿装置调节机器人刀片组之间的间距和两个或更多个单元之间的间隔的差异。 在不同的实施例中，补偿装置可以耦合到一个或多个处理单元，一个或多个基板保持器系统或一个或多个机器人叶片。

公开(公告)号：US06509069B1

公开(公告)日：2003-01-21

申请号：US08848936

申请日：1997-05-01

申请人： Robert E. Davenport ,  Avi Tepman

发明人： Robert E. Davenport ,  Avi Tepman

IPC分类号： C23C1600

CPC分类号： H01L21/67109 ,  C23C14/541 ,  C23C14/564 ,  H01L21/67103 ,  H01L21/68 ,  H01L21/6831 ,  Y10S269/903 ,  Y10S277/913 ,  Y10S277/922 ,  Y10S277/932 ,  Y10T279/23 ,  Y10T403/477 ,  Y10T403/479

摘要： The present invention pertains to an apparatus and method useful in semiconductor processing. The apparatus and method can be used to provide a seal which enables a first portion of a semiconductor processing chamber to be operated at a first pressure while a second portion of the semiconductor processing chamber is operated at a second, different pressure. The sealing apparatus and method enable processing of a semiconductor substrate under a partial vacuum which renders conductive/convective heat transfer impractical, while at least a portion of the substrate support platform is under a pressure adequate to permit heat transfer using a conductive/convective heat transfer means. The sealing apparatus comprises a thin, metal-comprising layer, typically in the form of a strip or band, brazed to at least two different surfaces within said processing chamber, whereby the first and second portions of the semiconductor processing chamber are pressure isolated from each other. Preferably, the metal-comprising layer exhibits a cross-sectional thickness of less than about 0.039 in. (1 mm). The invention is particularly useful when there is a differential in linear expansion coefficient of at least 3×10−3 in./in./° C., measured at 600° C., between the surfaces to be bridged by the thin, metal-comprising layer.

摘要翻译： 本发明涉及一种在半导体处理中有用的装置和方法。 该装置和方法可用于提供密封件，其能够使半导体处理室的第一部分以第一压力操作，同时半导体处理室的第二部分在第二不同压力下操作。密封装置和 方法能够在部分真空下处理半导体衬底，这使得导电/对流热传递不切实际，而衬底支撑平台的至少一部分处于足以允许使用导电/对流传热装置的热传递的压力下。 密封装置包括通常为带状或带状的薄的含金属的层，钎焊到所述处理室内的至少两个不同的表面，由此半导体处理室的第一和第二部分与每一个压力隔离 其他。 优选地，含金属层的横截面厚度小于约0.039英寸（1mm）。当线性膨胀系数差为至少3×10 -3 in / in时，本发明特别有用。 /℃，在600℃下测量，待被薄的含金属层覆盖的表面之间。