公开(公告)号：US20050253284A1

公开(公告)日：2005-11-17

申请号：US10972200

申请日：2004-10-22

申请人： Yu-Po Wang ,  Chien-Ping Huang ,  Cheng-Hsu Hsiao

发明人： Yu-Po Wang ,  Chien-Ping Huang ,  Cheng-Hsu Hsiao

IPC分类号： H01L21/56 ,  H01L21/60 ,  H01L23/13 ,  H01L23/28 ,  H01L23/31 ,  H01L23/498

CPC分类号： H01L23/49822 ,  H01L21/561 ,  H01L23/13 ,  H01L23/3128 ,  H01L24/45 ,  H01L24/48 ,  H01L24/97 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/484 ,  H01L2224/48599 ,  H01L2224/73215 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/00012

摘要： A semiconductor package and a method for fabricating the same are proposed. A substrate having a first circuit layer, a second circuit layer, and a core layer formed between the first and second circuit layers is provided. At least one second opening is formed on the second circuit layer. At least one first opening is formed on the first circuit layer corresponding to the second opening. A plurality of finger holes corresponding to bond fingers on the first circuit layer are formed in the core layer. A through opening is formed in the core layer and communicates with the first and second openings. At least one chip is mounted on the first circuit layer and covers the first opening, with its active surface being exposed to the first opening. An encapsulant is formed to fill the first and second openings and the through opening and encapsulate the chip.

摘要翻译： 提出了一种半导体封装及其制造方法。 提供了具有形成在第一和第二电路层之间的第一电路层，第二电路层和芯层的衬底。 在第二电路层上形成至少一个第二开口。 在对应于第二开口的第一电路层上形成至少一个第一开口。 在芯层中形成与第一电路层上的接合指状对应的多个指孔。 在芯层中形成通孔，并与第一和第二开口连通。 至少一个芯片安装在第一电路层上并且覆盖第一开口，其有源表面暴露于第一开口。 形成密封剂以填充第一和第二开口和通孔并封装芯片。

公开(公告)号：US06444498B1

公开(公告)日：2002-09-03

申请号：US09990752

申请日：2001-11-15

申请人： Chien Ping Huang ,  Tzong-Da Ho ,  Cheng-Hsu Hsiao

发明人： Chien Ping Huang ,  Tzong-Da Ho ,  Cheng-Hsu Hsiao

IPC分类号： H01L2144

CPC分类号： H01L23/49816 ,  H01L21/561 ,  H01L23/3128 ,  H01L23/4334 ,  H01L24/32 ,  H01L24/33 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/48247 ,  H01L2224/73204 ,  H01L2224/73215 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/92147 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/351 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2224/05599 ,  H01L2224/0401

摘要： A method is provided of making a semiconductor package with a heat spreader in which a chip carrier module plate consisting of a plurality of array-arranged chip carriers is mounted with at least one chip on each of the chip carriers. A heat spreader module plate is attached to the chips, with an interface layer formed on a top surface of the heat spreader module plate. The chip carrier module plate, the chips and the heat spreader module plate are encapsulated. Adhesion force between the interface layer and the encapsulant is larger than that between the interface layer and the heat spreader module plate, and adhesion force between the interface layer and the heat spreader module plate is smaller than that between the heat spreader module plate and the encapsulant.

摘要翻译： 提供了一种制造具有散热器的半导体封装的方法，其中由多个阵列布置的芯片载体组成的芯片载体模块板在每个芯片载体上安装有至少一个芯片。 散热器模块板附接到芯片，其中界面层形成在散热器模块板的顶表面上。 芯片载体模块板，芯片和散热器模块板被封装。 界面层与密封剂之间的粘附力大于界面层与散热器模块板之间的粘合力，界面层与散热器模块板之间的粘合力小于散热器模块板与密封剂之间的粘附力 。

公开(公告)号：US08361843B2

公开(公告)日：2013-01-29

申请号：US13195617

申请日：2011-08-01

申请人： Min-Shun Hung ,  Ho-Yi Tsai ,  Chien-Ping Huang ,  Cheng-Hsu Hsiao

发明人： Min-Shun Hung ,  Ho-Yi Tsai ,  Chien-Ping Huang ,  Cheng-Hsu Hsiao

IPC分类号： H01L23/34

CPC分类号： H01L23/4334 ,  H01L21/565 ,  H01L23/3121 ,  H01L23/3128 ,  H01L23/3135 ,  H01L24/48 ,  H01L2224/16225 ,  H01L2224/4824 ,  H01L2224/73204 ,  H01L2224/73215 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2224/0401 ,  H01L2224/45099

摘要： A heat dissipation package structure and method for fabricating the same are disclosed, which includes mounting and electrically connecting a semiconductor chip to a chip carrier through its active surface; mounting a heat dissipation member having a heat dissipation section and a supporting section on the chip carrier such that the semiconductor chip can be received in the space formed by the heat dissipation section and the supporting section, wherein the heat dissipation section has an opening formed corresponding to the semiconductor chip; forming an encapsulant to encapsulate the semiconductor chip, and the heat dissipation member; and thinning the encapsulant to remove the encapsulant formed on the semiconductor chip to expose inactive surface of the semiconductor chip and the top surface of the heat dissipation section from the encapsulant. Therefore, the heat dissipation package structure is fabricated through simplified fabrication steps at low cost, and also the problem that the chip is easily damaged in a package molding process of the prior art is overcome.

摘要翻译： 公开了一种散热封装结构及其制造方法，其包括通过其有源表面安装和电连接半导体芯片到芯片载体; 将具有散热部和支撑部的散热部件安装在所述芯片载体上，使得所述半导体芯片能够容纳在由所述散热部和所述支撑部形成的空间中，其中，所述散热部具有相应形成的开口 到半导体芯片; 形成密封剂以封装半导体芯片和散热构件; 并且使所述密封剂变薄以除去形成在所述半导体芯片上的所述密封剂，以从所述密封剂暴露所述半导体芯片的无效表面和所述散热部分的顶表面。 因此，通过以低成本的简化的制造步骤制造散热封装结构，并且克服了在现有技术的封装成型工艺中芯片容易损坏的问题。

公开(公告)号：US07750467B2

公开(公告)日：2010-07-06

申请号：US11891134

申请日：2007-08-08

申请人： Han-Ping Pu ,  Chien-Ping Huang ,  Cheng-Hsu Hsiao

发明人： Han-Ping Pu ,  Chien-Ping Huang ,  Cheng-Hsu Hsiao

IPC分类号： H01L23/485

CPC分类号： H01L21/561 ,  H01L21/568 ,  H01L23/3114 ,  H01L24/19 ,  H01L24/96 ,  H01L24/97 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16225 ,  H01L2224/20 ,  H01L2224/97 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/15311 ,  H01L2924/18161 ,  H01L2924/18162 ,  H01L2924/351 ,  H01L2224/82 ,  H01L2924/00

摘要： A chip scale package structure and a method for fabricating the same are disclosed. The method includes forming metal pads on a predetermined part of a carrier; mounting chips on the carrier, each of the chips having a plurality of conductive bumps soldered to the metal pads; forming an encapsulant on the carrier to encapsulate the chips and the conductive bumps; removing the carrier to expose the metal pads and even the metal pads with a surface of the encapsulant; forming on the encapsulant a plurality of first conductive traces electrically connected to the metal pads; applying a solder mask on the first conductive traces, and forming a plurality of openings on the solder mask to expose a predetermined part of the first conductive traces; forming a plurality of conductive elements on the predetermined part; and cutting the encapsulant to form a plurality of chip scale package structures.

摘要翻译： 公开了一种芯片级封装结构及其制造方法。 该方法包括在载体的预定部分上形成金属垫; 在载体上安装芯片，每个芯片具有焊接到金属焊盘的多个导电凸块; 在载体上形成密封剂以封装芯片和导电凸块; 移除载体以暴露金属垫和甚至具有密封剂表面的金属垫; 在所述密封剂上形成电连接到所述金属焊盘的多个第一导电迹线; 在所述第一导电迹线上施加焊接掩模，以及在所述焊接掩模上形成多个开口以暴露所述第一导电迹线的预定部分; 在所述预定部分上形成多个导电元件; 以及切割所述密封剂以形成多个芯片级封装结构。

公开(公告)号：US07745262B2

公开(公告)日：2010-06-29

申请号：US12567611

申请日：2009-09-25

申请人： Chien-Ping Huang ,  Cheng-Hsu Hsiao

发明人： Chien-Ping Huang ,  Cheng-Hsu Hsiao

IPC分类号： H01L21/00

CPC分类号： H01L23/3675 ,  H01L21/4871 ,  H01L21/50 ,  H01L21/561 ,  H01L21/6835 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/3677 ,  H01L23/4334 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/16225 ,  H01L2224/16245 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/48247 ,  H01L2224/73215 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/351 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2224/92147 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A heat dissipating package structure includes a chip carrier; a semiconductor chip mounted and electrically connected to the chip carrier; a heat spreader having a first surface, an opposed second surface and a hollow structure, the second surface of the heat spreader being mounted on the chip, wherein the chip is larger in size than the hollow structure such that the chip is partly exposed to the hollow structure; an encapsulant formed between the heat spreader and the chip carrier, for encapsulating the chip, wherein the first surface and sides of the heat spreader are exposed from the encapsulant to dissipate heat produced from the chip; and a plurality of conductive elements disposed on the chip carrier, for electrically connecting the chip to an external device. The present invention also provides a method for fabricating the heat dissipating package structure.

摘要翻译： 散热封装结构包括芯片载体; 安装并电连接到芯片载体的半导体芯片; 具有第一表面，相对的第二表面和中空结构的散热器，散热器的第二表面安装在芯片上，其中芯片的尺寸大于中空结构，使得芯片部分地暴露于 中空结构; 在散热器和芯片载体之间形成的用于封装芯片的密封剂，其中散热器的第一表面和侧面从密封剂暴露以散发从芯片产生的热量; 以及设置在芯片载体上的多个导电元件，用于将芯片电连接到外部设备。 本发明还提供一种制造散热封装结构的方法。

公开(公告)号：US20100052146A1

公开(公告)日：2010-03-04

申请号：US12616834

申请日：2009-11-12

申请人： Yih-Jenn Jiang ,  Han-Ping Pu ,  Chien-Ping Huang ,  Cheng-Hsu Hsiao

发明人： Yih-Jenn Jiang ,  Han-Ping Pu ,  Chien-Ping Huang ,  Cheng-Hsu Hsiao

IPC分类号： H01L23/522 ,  H01L21/56

CPC分类号： H01L23/3121 ,  H01L21/561 ,  H01L21/6835 ,  H01L24/48 ,  H01L24/97 ,  H01L2221/68345 ,  H01L2224/16 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/97 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/351 ,  H01L2224/85 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2224/0401 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor package and a fabrication method are disclosed. The fabrication method includes applying a sacrificial layer on one surface of a metal carrier, applying an insulation layer on the sacrificial layer, and forming through holes in the sacrificial layer and the insulation layer to expose the metal carrier; forming a conductive metallic layer in each through hole; forming a patterned circuit layer on the insulation layer to be electrically connected to the conductive metallic layer; mounting at least a chip on the insulation layer and electrically connecting the chip to the patterned circuit layer; forming an encapsulant to encapsulate the chip and the patterned circuit layer; and removing the metal carrier and the sacrificial layer to expose the insulation layer and conductive metallic layer to allow the conductive metallic layer to protrude from the insulation layer. In the present invention, the distance between the semiconductor package and the external device is increased, and thermal stress caused by difference between the thermal expansion coefficients is reduced, so as to enhance the reliability of the product.

摘要翻译： 公开了半导体封装和制造方法。 制造方法包括在金属载体的一个表面上施加牺牲层，在牺牲层上施加绝缘层，以及在牺牲层和绝缘层中形成通孔以露出金属载体; 在每个通孔中形成导电金属层; 在所述绝缘层上形成图案化电路层，以电连接到所述导电金属层; 将至少一个芯片安装在所述绝缘层上并将所述芯片电连接到所述图案化电路层; 形成密封剂以封装所述芯片和所述图案化电路层; 并且去除金属载体和牺牲层以暴露绝缘层和导电金属层，以允许导电金属层从绝缘层突出。 在本发明中，半导体封装和外部器件之间的距离增加，由于热膨胀系数之差导致的热应力降低，从而提高了产品的可靠性。

公开(公告)号：US07485496B2

公开(公告)日：2009-02-03

申请号：US11648443

申请日：2006-12-29

申请人： Kun-Sheng Chien ,  Shih-Kuang Chiu ,  Han-Ping Pu ,  Cheng-Hsu Hsiao

发明人： Kun-Sheng Chien ,  Shih-Kuang Chiu ,  Han-Ping Pu ,  Cheng-Hsu Hsiao

IPC分类号： H01L21/00

CPC分类号： H01L23/3675 ,  H01L21/4871 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2924/16251

摘要： A semiconductor package with a heat sink and a method for fabricating the same are proposed. A first adhesive of a low Young's modulus is disposed on a corner region of a heat sink mounting area of a substrate. A second adhesive of a high Young's modulus is disposed on the heat sink mounting area except the corner region. The heat sink is mounted on the heat sink mounting area and thereby secured in position to the substrate, by the first and second adhesives. The disposition of the first and second adhesives of different Young's moduli not only prevents detachment of the heat sink from the substrate, but also controls the flatness of the heat sink. The prevent invention does not affect the appearance of the semiconductor package and its ensuing assembly process.

摘要翻译： 提出了具有散热器的半导体封装及其制造方法。 低杨氏模量的第一粘合剂设置在基板的散热器安装区域的拐角区域。 高杨氏模量的第二粘合剂设置在除了拐角区域之外的散热器安装区域上。 散热器安装在散热器安装区域上，从而通过第一和第二粘合剂固定到基板上。 不同杨氏模量的第一和第二粘合剂的配置不仅防止散热器从基板脱离，而且还控制散热器的平坦度。 防止发明不影响半导体封装的外观及其随后的组装过程。

公开(公告)号：US20080308926A1

公开(公告)日：2008-12-18

申请号：US12157831

申请日：2008-06-13

申请人： Min-Shun Hung ,  Ho-Yi Tsai ,  Chien-Ping Huang ,  Cheng-Hsu Hsiao

发明人： Min-Shun Hung ,  Ho-Yi Tsai ,  Chien-Ping Huang ,  Cheng-Hsu Hsiao

IPC分类号： H01L23/34 ,  H01L21/00 ,  H01L23/28 ,  H01L23/52

CPC分类号： H01L23/4334 ,  H01L21/565 ,  H01L23/3121 ,  H01L23/3128 ,  H01L23/3135 ,  H01L24/48 ,  H01L2224/16225 ,  H01L2224/4824 ,  H01L2224/73204 ,  H01L2224/73215 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2224/0401 ,  H01L2224/45099

摘要： A heat dissipation package structure and method for fabricating the same are disclosed, which includes mounting and electrically connecting a semiconductor chip to a chip carrier through its active surface; mounting a heat dissipation member having a heat dissipation section and a supporting section on the chip carrier such that the semiconductor chip can be received in the space formed by the heat dissipation section and the supporting section, wherein the heat dissipation section has an opening formed corresponding to the semiconductor chip; forming an encapsulant to encapsulate the semiconductor chip and the heat dissipation member; and thinning the encapsulant to remove the encapsulant formed on the semiconductor chip to expose inactive surface of the semiconductor chip and the top surface of the heat dissipation section from the encapsulant. Therefore, the heat dissipation package structure is fabricated through simplified fabrication steps at low cost, and also the problem that the chip is easily damaged in a package molding process of the prior art is overcome.

摘要翻译： 公开了一种散热封装结构及其制造方法，其包括通过其有源表面安装和电连接半导体芯片到芯片载体; 将具有散热部和支撑部的散热部件安装在所述芯片载体上，使得所述半导体芯片能够容纳在由所述散热部和所述支撑部形成的空间中，其中，所述散热部具有相应形成的开口 到半导体芯片; 形成密封剂以封装半导体芯片和散热构件; 并且使所述密封剂变薄以除去形成在所述半导体芯片上的所述密封剂，以从所述密封剂暴露所述半导体芯片的无效表面和所述散热部分的顶表面。 因此，通过以低成本的简化的制造步骤制造散热封装结构，并且克服了在现有技术的封装成型工艺中芯片容易损坏的问题。

公开(公告)号：US20080277786A1

公开(公告)日：2008-11-13

申请号：US12156874

申请日：2008-06-05

申请人： Chun-Lung Chen ,  Yu-Po Wang ,  Jeng-Yuan Lai ,  Cheng-Hsu Hsiao

发明人： Chun-Lung Chen ,  Yu-Po Wang ,  Jeng-Yuan Lai ,  Cheng-Hsu Hsiao

IPC分类号： H01L23/48

CPC分类号： H05K1/115 ,  H01L23/3677 ,  H01L23/49822 ,  H01L24/16 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/15174 ,  H01L2924/15311 ,  H05K1/0206 ,  H05K1/112 ,  H05K2201/09627 ,  H05K2201/0979 ,  H05K2201/10674 ,  H01L2224/0401

摘要： A semiconductor package substrate includes a body having an upper surface and a lower surface opposite to one another, a plurality of circuit layers formed in the body, a plurality of solder pads formed on the upper surface of the body, and a plurality of solder ball pads formed on the lower surface of the body. Each of the solder pads is electrically connected to one of the solder ball pads via the circuit layers and conductive structures disposed between the circuit layers, wherein the circuit layers and conductive structures are configured to expand outwardly in a fan-out manner so as to provide more space between the circuit layers closer to the lower surface of the body such that part of the solder pad-solder ball pad electrical connections can comprise a plurality of parallel connected conductive structures formed in the space, thereby enhancing the heat conducting passageway and the effect of heat-dissipation without having to dispose more solder pads on surface of the substrate.

摘要翻译： 半导体封装基板包括具有彼此相对的上表面和下表面的主体，形成在主体中的多个电路层，形成在主体的上表面上的多个焊盘，以及多个焊球 衬垫形成在身体的下表面上。 每个焊盘通过设置在电路层之间的电路层和导电结构电连接到焊球之一，其中电路层和导电结构被配置为以扇出方式向外扩展，以便提供 电路层之间的距离更靠近主体的下表面的空间更多，使得焊料焊盘 - 焊球焊盘电连接的一部分可以包括形成在该空间中的多个平行连接的导电结构，从而增强导热通道和效果 的散热而不必在基板的表面上设置更多的焊盘。

公开(公告)号：US20080277777A1

公开(公告)日：2008-11-13

申请号：US12151902

申请日：2008-05-08

申请人： Chun-Ming Liao ,  Chien-Ping Huang ,  Ho-Yi Tsai ,  Cheng-Hsu Hsiao

发明人： Chun-Ming Liao ,  Chien-Ping Huang ,  Ho-Yi Tsai ,  Cheng-Hsu Hsiao

IPC分类号： H01L23/36

CPC分类号： H01L23/4334 ,  H01L24/73 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48227 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/0401

摘要： A heat dissipation semiconductor package includes a chip carrier, a semiconductor chip, a heat conductive adhesive, a heat dissipation member, and an encapsulant. The semiconductor chip is flip-chip mounted on the chip carrier and defined with a heat conductive adhesive mounting area. Periphery of the heat adhesive mounting area is spaced apart from edge of the semiconductor chip. The heat dissipation member is mounted on the heat conductive adhesive formed in the heat conductive adhesive mounting area. The encapsulant formed between the chip carrier and the heat dissipation member encapsulates the semiconductor chip and the heat conductive adhesive, and embeds edges of the active surface and non-active surface and side edge of the semiconductor chip, thereby increasing bonding area between the encapsulant and the semiconductor chip. The side edges of the heat conductive adhesive and the semiconductor chip are not flush with each other, thereby preventing propagation of delamination.

摘要翻译： 散热半导体封装包括芯片载体，半导体芯片，导热粘合剂，散热构件和密封剂。 半导体芯片倒装芯片安装在芯片载体上，并用导热粘合剂安装区域限定。 热粘合剂安装区域的周边与半导体芯片的边缘间隔开。 散热构件安装在形成在导热粘合剂安装区域中的导热粘合剂上。 形成在芯片载体和散热构件之间的密封剂封装半导体芯片和导热粘合剂，并且嵌入半导体芯片的有源表面和非有源表面和侧边缘的边缘，从而增加密封剂和 半导体芯片。 导热粘合剂和半导体芯片的侧边缘彼此不齐平，从而防止分层的蔓延。