公开(公告)号：US20050239371A1

公开(公告)日：2005-10-27

申请号：US11169796

申请日：2005-06-30

申请人： Tetsuji Togawa

发明人： Tetsuji Togawa

IPC分类号： B24B37/005 ,  B24B37/04 ,  B24B37/30 ,  B24B37/32 ,  B24B49/16 ,  F15B11/06 ,  G05D16/20 ,  H01L21/304 ,  B24B49/00

CPC分类号： B24B37/30 ,  B24B49/16

摘要： A pressure control system is used for eliminating individual differences of a plurality of pressure controllers used for controlling pressures of a plurality of pressure-controlled sections. The pressure control system includes a plurality of pressure controllers for supplying a pressurized fluid to a plurality of pressure-controlled sections, a master pressure controller for supplying a pressurized fluid having a reference pressure, a plurality of calibration chambers corresponding to the pressure controllers. The pressure control system further includes differential-pressure detecting devices provided in the calibration chambers to detect a differential pressure between the pressurized fluid supplied from the master pressure controller and the pressurized fluid supplied from the pressure controller, and an arithmetic device configured to receive a signal from the differential-pressure detecting device and adjust an output of the pressure controller so that the above differential pressure becomes zero or approximately zero.

摘要翻译： 压力控制系统用于消除用于控制多个压力控制部分的压力的多个压力控制器的个体差异。 压力控制系统包括用于向多个压力控制部分供应加压流体的多个压力控制器，用于供应具有参考压力的加压流体的主压力控制器，对应于压力控制器的多个校准室。 压力控制系统还包括设置在校准室中的差压检测装置，用于检测从主压力控制器供给的加压流体与从压力控制器供给的加压流体之间的压力差;以及运算装置，被配置为接收信号 并且调节压力控制器的输出，使得上述压差变为零或大约为零。

公开(公告)号：US06957998B2

公开(公告)日：2005-10-25

申请号：US10097568

申请日：2002-03-15

申请人： Tetsuji Togawa

发明人： Tetsuji Togawa

IPC分类号： B24B53/00 ,  B24B37/005 ,  B24B37/30 ,  B24B49/16 ,  B24B53/017 ,  B24B53/02 ,  H01L21/304 ,  B24B49/00 ,  B24B51/00

CPC分类号： B24B37/30 ,  B24B47/06 ,  B24B49/16 ,  B24B53/017

摘要： A polishing apparatus for polishing a substrate comprises a polishing table having a polishing surface, and a substrate holding apparatus for holding a substrate to be polished and pressing the substrate against the polishing surface. The substrate holding apparatus comprises a vertically movable top ring body for holding a substrate, and a fluid supply source for supplying a fluid under a positive pressure or a negative pressure to a hermetically sealed chamber which is defined in the top ring body so as to control pressure under which the substrate is pressed against the polishing surface. The substrate holding apparatus further comprises a measuring device disposed in a fluid passage interconnecting the hermetically sealed chamber and the fluid supply source for measuring a flow rate of the fluid in the fluid passage.

公开(公告)号：US20050159082A1

公开(公告)日：2005-07-21

申请号：US11078495

申请日：2005-03-14

申请人： Kunihiko Sakurai ,  Tetsuji Togawa ,  Nobuyuki Takada ,  Satoshi Wakabayashi ,  Kenichiro Saito ,  Masahiko Sekimoto ,  Takuji Hayama ,  Daisuke Koga

发明人： Kunihiko Sakurai ,  Tetsuji Togawa ,  Nobuyuki Takada ,  Satoshi Wakabayashi ,  Kenichiro Saito ,  Masahiko Sekimoto ,  Takuji Hayama ,  Daisuke Koga

IPC分类号： B24B37/04 ,  H01L21/306 ,  B24B49/00

CPC分类号： B24B37/345 ,  B24B37/042 ,  H01L21/30625

摘要： A polishing apparatus is used for polishing a workpiece such as a semiconductor wafer to a flat mirror finish. The polishing apparatus comprises a turntable having a polishing surface, a top ring for holding a workpiece and pressing the workpiece against the polishing surface to polish the workpiece, at least three cleaning apparatuses for cleaning polished workpieces, and a transfer structure for transferring the polished workpieces between at least three cleaning apparatuses. The polishing apparatus further includes a rotary transporter disposed in a position which can be accessed by said top rings and having a plurality of portions positioned on a predetermined circumference from a center of rotation of the rotary transporter for holding the workpieces.

摘要翻译： 抛光装置用于将诸如半导体晶片的工件抛光到平面镜面。 抛光装置包括具有抛光表面的转台，用于保持工件的顶环，并将工件压靠抛光表面抛光工件，用于清洁抛光工件的至少三个清洁装置和用于传送抛光工件的转印结构 在至少三个清洁装置之间。 抛光装置还包括旋转输送器，其设置在可由所述顶环接近的位置，并且具有从旋转运送器的旋转中心定位在预定圆周上的多个部分，用于保持工件。

公开(公告)号：US20050118935A1

公开(公告)日：2005-06-02

申请号：US11028629

申请日：2005-01-05

申请人： Tetsuji Togawa ,  Ikutaro Noji ,  Keisuke Namiki ,  Hozumi Yasuda ,  Shunichiro Kojima ,  Kunihiko Sakurai ,  Nobuyuki Takada ,  Osamu Nabeya ,  Makoto Fukushima ,  Hideki Takayanagi

发明人： Tetsuji Togawa ,  Ikutaro Noji ,  Keisuke Namiki ,  Hozumi Yasuda ,  Shunichiro Kojima ,  Kunihiko Sakurai ,  Nobuyuki Takada ,  Osamu Nabeya ,  Makoto Fukushima ,  Hideki Takayanagi

IPC分类号： B24B37/005 ,  B24B37/04 ,  B24B37/30 ,  B24B41/06 ,  H01L21/304 ,  B24B1/00

CPC分类号： B24B37/30 ,  B24B41/061

摘要： The present invention relates to a substrate holding apparatus for holding a substrate to be polished and pressing the substrate against a polishing surface. The substrate holding apparatus comprises a top ring body for holding a substrate, an elastic pad for being brought into contact with the substrate, and a support member for supporting the elastic pad. The substrate holding apparatus further comprises a contact member mounted on a lower surface of the support member and disposed in a space formed by the elastic pad and the support member. The contact member has an elastic membrane for being brought into contact with the elastic pad. A first pressure chamber is defined in the contact member, and a second pressure chamber is defined outside of the contact member. The substrate holding apparatus further comprises a fluid source for independently supplying a fluid into, or creating a vacuum in, the first pressure chamber and the second pressure chamber.

摘要翻译： 本发明涉及一种用于保持待抛光的基板并将基板压靠在抛光表面上的基板保持装置。 基板保持装置包括用于保持基板的顶环体，用于与基板接触的弹性垫，以及用于支撑弹性垫的支撑构件。 基板保持装置还包括安装在支撑构件的下表面上并设置在由弹性垫和支撑构件形成的空间中的接触构件。 接触构件具有用于与弹性垫接触的弹性膜。 第一压力室限定在接触构件中，并且第二压力室限定在接触构件的外部。 基板保持装置还包括用于独立地向第一压力室和第二压力室供应流体或产生真空的流体源。

公开(公告)号：US06878044B2

公开(公告)日：2005-04-12

申请号：US10750823

申请日：2004-01-05

申请人： Kunihiko Sakurai ,  Tetsuji Togawa ,  Nobuyuki Takada ,  Satoshi Wakabayashi ,  Kenichiro Saito ,  Masahiko Sekimoto ,  Takuji Hayama ,  Daisuke Koga

发明人： Kunihiko Sakurai ,  Tetsuji Togawa ,  Nobuyuki Takada ,  Satoshi Wakabayashi ,  Kenichiro Saito ,  Masahiko Sekimoto ,  Takuji Hayama ,  Daisuke Koga

IPC分类号： B24B37/04 ,  H01L21/306 ,  B24B7/00

CPC分类号： B24B37/345 ,  B24B37/042 ,  H01L21/30625

摘要： A polishing apparatus is used for polishing a workpiece such as a semiconductor wafer to a flat mirror finish. The polishing apparatus comprises a turntable having a polishing surface, a top ring for holding a workpiece and pressing the workpiece against the polishing surface to polish the workpiece, at least three cleaning apparatuses for cleaning polished workpieces, and a transfer structure for transferring the polished workpieces between at least three cleaning apparatuses. The polishing apparatus further includes a rotary transporter disposed in a position which can be accessed by said top rings and having a plurality of portions positioned on a predetermined circumference from a center of rotation of the rotary transporter for holding the workpieces.

公开(公告)号：US20050064703A1

公开(公告)日：2005-03-24

申请号：US10976040

申请日：2004-10-29

申请人： Fumio Kondo ,  Koji Mishima ,  Akira Tanaka ,  Yoko Suzuki ,  Tetsuji Togawa ,  Hiroaki Inoue

发明人： Fumio Kondo ,  Koji Mishima ,  Akira Tanaka ,  Yoko Suzuki ,  Tetsuji Togawa ,  Hiroaki Inoue

IPC分类号： B65G49/07 ,  B24B37/04 ,  B24B49/16 ,  C23C18/16 ,  C25D5/00 ,  C25D5/50 ,  C25D7/12 ,  H01L21/00 ,  H01L21/02 ,  H01L21/288 ,  H01L21/304 ,  H01L21/3205 ,  H01L21/321 ,  H01L21/673 ,  H01L21/677 ,  H01L21/768 ,  H01L23/52 ,  H01L21/4763

CPC分类号： H01L21/67161 ,  B24B37/005 ,  B24B37/042 ,  B24B37/245 ,  B24B37/345 ,  B24B41/061 ,  B24B49/16 ,  C23C18/1632 ,  C23C18/1653 ,  C25D7/123 ,  H01L21/02074 ,  H01L21/02087 ,  H01L21/0209 ,  H01L21/288 ,  H01L21/2885 ,  H01L21/3212 ,  H01L21/67167 ,  H01L21/67173 ,  H01L21/67184 ,  H01L21/67219 ,  H01L21/6723 ,  H01L21/67393 ,  H01L21/67396 ,  H01L21/67772 ,  H01L21/7684 ,  H01L21/76843 ,  H01L21/76849 ,  H01L21/76864 ,  H01L21/76873 ,  H01L21/76874 ,  H01L21/76877

摘要： A substrate processing method comprising steps for forming a copper film on a surface of a substrate. These steps includes the step of filling a first metal in the trenches so as to form a plated film of the first metal on an entire surface of the substrate by electroplating, wherein the electromagnetic field is adjusted by the virtual anode so that differences of thickness of the plated film between the central portion and the peripheral portion of the substrate being minimized, and polishing and removing the plated film by pressing the substrate to the polishing surface, wherein the pressures pressing the substrate to the polishing surface at a central portion and a peripheral portion are adjusted.

摘要翻译： 一种基板处理方法，包括在基板的表面上形成铜膜的步骤。 这些步骤包括在沟槽中填充第一金属以便通过电镀在基板的整个表面上形成第一金属的镀膜的步骤，其中电磁场由虚拟阳极调节，使得厚度差异 基板的中央部分和周边部分之间的镀膜最小化，并且通过将基板压在抛光表面上来研磨和去除镀膜，其中将基板压在抛光表面上的压力在中心部分和周边 部分进行调整。

公开(公告)号：US06852019B2

公开(公告)日：2005-02-08

申请号：US09973842

申请日：2001-10-11

申请人： Tetsuji Togawa ,  Ikutaro Noji ,  Keisuke Namiki ,  Hozumi Yasuda ,  Shunichiro Kojima ,  Kunihiko Sakurai ,  Nobuyuki Takada ,  Osamu Nabeya ,  Makoto Fukushima ,  Hideki Takayanagi

发明人： Tetsuji Togawa ,  Ikutaro Noji ,  Keisuke Namiki ,  Hozumi Yasuda ,  Shunichiro Kojima ,  Kunihiko Sakurai ,  Nobuyuki Takada ,  Osamu Nabeya ,  Makoto Fukushima ,  Hideki Takayanagi

IPC分类号： B24B37/005 ,  B24B37/04 ,  B24B37/30 ,  B24B41/06 ,  H01L21/304 ,  B24B7/22

CPC分类号： B24B37/30 ,  B24B41/061

摘要： The present invention relates to a substrate holding apparatus for holding a substrate to be polished and pressing the substrate against a polishing surface. The substrate holding apparatus comprises a top ring body for holding a substrate, an elastic pad for being brought into contact with the substrate, and a support member for supporting the elastic pad. The substrate holding apparatus further comprises a contact member mounted on a lower surface of the support member and disposed in a space formed by the elastic pad and the support member. The contact member has an elastic membrane for being brought into contact with the elastic pad. A first pressure chamber is defined in the contact member, and a second pressure chamber is defined outside of the contact member. The substrate holding apparatus further comprises a fluid source for independently supplying a fluid into, or creating a vacuum in, the first pressure chamber and the second pressure chamber.

公开(公告)号：US06558226B1

公开(公告)日：2003-05-06

申请号：US09643882

申请日：2000-08-23

申请人： Nobuyuki Takada ,  Tetsuji Togawa

发明人： Nobuyuki Takada ,  Tetsuji Togawa

IPC分类号： B24B500

CPC分类号： B24B37/105 ,  B24B53/017

摘要： There is disclosed a polishing apparatus comprising: a polishing table having a first axis and a counterweight provided on the polishing table. The polishing table is adapted to be subjected to a circular orbital motion in which the first axis of the polishing table is rotated about an orbit center axis while the orientation of the polishing table is kept substantially constant. The counterweight cancels a centrifugal force generated by the circular orbital motion of the polishing table.

摘要翻译： 公开了一种抛光装置，包括：抛光台，其具有设置在抛光台上的第一轴和配重。 抛光台适于进行圆周轨道运动，其中抛光台的第一轴线围绕轨道中心轴线旋转，同时抛光台的取向基本保持不变。 配重消除由抛光台的圆周轨道运动产生的离心力。

公开(公告)号：US06428400B1

公开(公告)日：2002-08-06

申请号：US09612939

申请日：2000-07-10

申请人： Tetsuji Togawa ,  Kuniaki Yamaguchi

发明人： Tetsuji Togawa ,  Kuniaki Yamaguchi

IPC分类号： B24B900

CPC分类号： H01L21/67057 ,  B24B37/04 ,  B24B57/02

摘要： A polishing plant including a polishing apparatus having a top ring for holding a workpiece and a turn table for polishing a surface of the workpiece held by the top ring. A cleaning apparatus has cleaning machines for cleaning the workpiece polished by the polishing apparatus. At least one drainage pipe connected to the polishing apparatus discharges a waste liquid from the polishing apparatus, and at least one drainage pipe connected to the cleaning apparatus discharges a waste liquid from the cleaning apparatus are provided as separate plural drainage pipe lines, depending on the type of waste liquid. By use of the polishing plant of the present invention, treatment of waste liquids can be efficiently conducted.

摘要翻译： 一种抛光装置，包括具有用于保持工件的顶环的抛光装置和用于抛光由顶环保持的工件的表面的转台。 清洁装置具有清洁由抛光装置抛光的工件的清洁机。 连接到抛光装置的至少一个排水管从抛光装置排出废液，并且连接到清洁装置的至少一个排水管将来自清洁装置的废液排出，作为单独的多个排水管线设置，这取决于 废液类型。 通过使用本发明的研磨装置，可以有效地进行废液的处理。

公开(公告)号：US06390901B1

公开(公告)日：2002-05-21

申请号：US09397916

申请日：1999-09-17

申请人： Hirokuni Hiyama ,  Yutaka Wada ,  Kazuto Hirokawa ,  Hisanori Matsuo ,  Tetsuji Togawa ,  Satoshi Wakabayashi

发明人： Hirokuni Hiyama ,  Yutaka Wada ,  Kazuto Hirokawa ,  Hisanori Matsuo ,  Tetsuji Togawa ,  Satoshi Wakabayashi

IPC分类号： B24B2900

CPC分类号： B24B37/11 ,  B24D9/085

摘要： An object of the present invention is to provide a polishing apparatus with a grinding plate that can easily and reliably be installed on and detached from a turntable. The polishing apparatus has a grinding plate tool, fixedly mounted on the turntable, which includes the grinding plate, and a top ring for holding a workpiece to be polished and pressing the workpiece against the grinding plate in sliding contact therewith for polishing a surface of the workpiece to a flat, mirror finish. A clamping mechanism is mounted in the turntable for fixing an outer circumferential flange of the grinding plate tool to the turntable.

摘要翻译： 本发明的目的是提供一种具有研磨板的抛光装置，其可以容易且可靠地安装在转台上和从转盘上拆下。 抛光装置具有固定安装在转盘上的研磨板工具，其包括研磨板，以及用于保持要抛光的工件的顶环，并将工件抵靠研磨板与其滑动接触，以抛光其中的表面 工件平整，镜面光洁。 夹持机构安装在转盘中，用于将研磨板工具的外周凸缘固定到转台上。