公开(公告)号：US09865522B2

公开(公告)日：2018-01-09

申请号：US14546136

申请日：2014-11-18

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Levi A. Campbell ,  Milnes P. David ,  Dustin W. Demetriou ,  Michael J. Ellsworth, Jr. ,  Roger R. Schmidt ,  Robert E. Simons

IPC: H01L23/473 ,  B29C43/18 ,  B29C43/20 ,  H01L23/427 ,  H05K7/20 ,  B29C70/84 ,  B29C70/88 ,  B29L9/00 ,  B29K101/12 ,  B29K705/00 ,  B29L31/34 ,  H01L23/367 ,  H01L23/40

CPC classification number: H01L23/473 ,  B29C43/18 ,  B29C43/203 ,  B29C70/84 ,  B29C70/88 ,  B29K2101/12 ,  B29K2705/00 ,  B29L2009/00 ,  B29L2031/3406 ,  H01L23/3672 ,  H01L23/4006 ,  H01L23/427 ,  H01L2924/00 ,  H01L2924/0002 ,  H05K7/20254 ,  H05K7/20436 ,  H05K7/20509 ,  H05K7/20772

Abstract: Composite heat sink structures and methods of fabrication are provided, with the composite heat sink structures including: a thermally conductive base having a main heat transfer surface to couple to, for instance, at least one electronic component to be cooled; a compressible, continuous sealing member; and a sealing member retainer compressing the compressible, continuous sealing member against the thermally conductive base; and an in situ molded member. The in situ molded member is molded over and affixed to the thermally conductive base, and is molded over and secures in place the sealing member retainer. A coolant-carrying compartment resides between the thermally conductive base and the in situ molded member, and a coolant inlet and outlet are provided in fluid communication with the coolant-carrying compartment to facilitate liquid coolant flow through the compartment.

公开(公告)号：US09750165B2

公开(公告)日：2017-08-29

申请号：US14792196

申请日：2015-07-06

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Timothy J. Chainer ,  Milnes P. David ,  Madhusudan K. Iyengar ,  Pritish R. Parida ,  Robert E. Simons

IPC: G05D23/00 ,  H05K7/20 ,  F28F27/02 ,  G06F1/20 ,  G05D23/19

CPC classification number: H05K7/20836 ,  F28F27/02 ,  G05D23/1932 ,  G06F1/206 ,  G06F2200/201 ,  Y02D10/16

Abstract: Cooling control methods and systems include measuring a temperature of air provided to one or more nodes by an air-to-liquid heat exchanger; measuring a temperature of at least one component of the one or more nodes and finding a maximum component temperature across all such nodes; comparing the maximum component temperature to a first and second component threshold and comparing the air temperature to a first and second air threshold; and controlling a proportion of coolant flow and a coolant flow rate to the air-to-liquid heat exchanger and the one or more nodes based on the comparisons.

公开(公告)号：US09629286B2

公开(公告)日：2017-04-18

申请号：US14870297

申请日：2015-09-30

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Levi A. Campbell ,  Milnes P. David ,  Dustin W. Demetriou ,  Michael J. Ellsworth, Jr. ,  Roger R. Schmidt ,  Robert E. Simons

IPC: H05K7/20

CPC classification number: H05K7/20781 ,  H05K7/20736 ,  H05K7/20836

Abstract: Thermoelectric-enhanced, rack-level cooling of airflow entering an electronics rack is provided by a cooling apparatus, which includes: an air-to-liquid heat exchanger; a coolant loop coupled to the heat exchanger, the coolant loop including a first loop portion and a second loop portion, where the heat exchanger exhausts heated coolant to the first loop portion and receives cooled coolant from the second loop portion. The cooling apparatus further includes a heat rejection unit and a thermoelectric heat pump(s). The heat rejection unit is coupled to the coolant loop between the first and second loop portions, and provides partially-cooled coolant to the second loop portion. The thermoelectric heat pump is disposed with the first and second loop portions coupled to opposite sides to transfer heat from the partially-cooled coolant within the second loop portion to provide the cooled coolant before entering the air-to-liquid heat exchanger.

公开(公告)号：US09357682B2

公开(公告)日：2016-05-31

申请号：US13758143

申请日：2013-02-04

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Levi A. Campbell ,  Richard C. Chu ,  Milnes P. David ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Robert E. Simons ,  Prabjit Singh ,  Jing Zhang

IPC: F28F13/00 ,  H05K7/20

CPC classification number: H05K7/20836 ,  F28F2265/14

Abstract: An automated multi-fluid cooling method is provided for cooling an electronic component(s). The method includes obtaining a coolant loop, and providing a coolant tank, multiple valves, and a controller. The coolant loop is at least partially exposed to outdoor ambient air temperature(s) during normal operation, and the coolant tank includes first and second reservoirs containing first and second fluids, respectively. The first fluid freezes at a lower temperature than the second, the second fluid has superior cooling properties compared with the first, and the two fluids are soluble. The multiple valves are controllable to selectively couple the first or second fluid into the coolant in the coolant loop, wherein the coolant includes at least the second fluid. The controller automatically controls the valves to vary first fluid concentration level in the coolant loop based on historical, current, or anticipated outdoor air ambient temperature(s) for a time of year.

Abstract translation: 提供了用于冷却电子部件的自动多流体冷却方法。 该方法包括获得冷却剂回路，以及提供冷却剂箱，多个阀和控制器。 在正常操作期间，冷却剂回路至少部分地暴露于室外环境空气温度，并且冷却剂箱分别包括容纳第一和第二流体的第一和第二储存器。 第一流体在比第二流体低的温度下冻结，第二流体与第一流体相比具有优异的冷却性能，并且两种流体是可溶的。 多个阀是可控制的，以选择性地将第一或第二流体耦合到冷却剂回路中的冷却剂中，其中冷却剂至少包括第二流体。 控制器根据一年中的历史，当前或预期的室外空气环境温度，自动控制阀门改变冷却剂回路中的第一个液体浓度水平。

公开(公告)号：US09357674B2

公开(公告)日：2016-05-31

申请号：US14132230

申请日：2013-12-18

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Levi A. Campbell ,  Richard C. Chu ,  Milnes P. David ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

IPC: H05K7/20

CPC classification number: H05K7/20218 ,  H05K7/2039 ,  H05K7/20772 ,  Y10T29/4935

Abstract: Cooling apparatuses, cooled electronic modules, and methods of fabrication are provided which facilitate heat transfer from an electronic component(s). The cooling apparatus includes a liquid-cooled heat sink with a thermally conductive structure having a coolant-carrying compartment including a region of reduced cross-sectional coolant flow area. The heat sink includes a coolant inlet and outlet in fluid communication with the compartment, and the region of reduced cross-sectional coolant flow area provides an increased effective heat transfer coefficient between a main heat transfer surface of the conductive structure and the coolant. The cooling apparatus further includes a coolant loop coupled to the coolant inlet and outlet to facilitate flow of coolant through the coolant-carrying compartment, and a coolant filter positioned to filter contaminants from the coolant passing through the heat sink. The coolant filter has a larger cross-sectional coolant flow area than the region of reduced cross-sectional coolant flow area.

Abstract translation: 提供冷却装置，冷却的电子模块和制造方法，其促进从电子部件的热传递。 冷却装置包括具有导热结构的液冷式散热器，该导热结构具有包括减小横截面冷却剂流动面积的区域的冷却剂输送室。 散热器包括与隔室流体连通的冷却剂入口和出口，并且减小的横截面冷却剂流动区域的区域提供了导电结构的主传热表面与冷却剂之间增加的有效传热系数。 冷却装置还包括联接到冷却剂入口和出口的冷却剂回路，以便于冷却剂流过冷却剂携带室，以及冷却剂过滤器，其被定位成过滤来自穿过散热器的冷却剂的污染物。 冷却剂过滤器具有比截面冷却剂流动面积减小的区域更大的横截面冷却剂流动面积。

公开(公告)号：US09345169B1

公开(公告)日：2016-05-17

申请号：US14546159

申请日：2014-11-18

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Levi A. Campbell ,  Milnes P. David ,  Dustin W. Demetriou ,  Michael J. Ellsworth, Jr. ,  Roger R. Schmidt ,  Robert E. Simons

IPC: H05K7/20 ,  H01L23/34 ,  H01L23/473

CPC classification number: H05K7/20218 ,  H01L23/34 ,  H01L23/3672 ,  H01L23/4006 ,  H01L23/473 ,  H01L2924/0002 ,  H05K7/20254 ,  H05K7/20281 ,  H05K7/20327 ,  H05K7/2039 ,  H05K7/20436 ,  H05K7/20509 ,  H05K7/20772 ,  H01L2924/00

Abstract: Liquid-cooled heat sink assemblies are provided which include: a thermally conductive base structure having a sidewall surface and a main heat transfer surface; and a manifold structure attached to the base structure, with the base structure residing at least in part within a recess in the manifold structure. Together, the base and manifold structures define a coolant-carrying compartment through which liquid coolant flows, at least in part, in a direction substantially parallel to the main heat transfer surface of the base structure, and at least one of the sidewall surface of the thermally conductive base structure or an opposing surface thereto of the manifold structure includes a continuous groove. A sealing member is disposed, at least in part, within the continuous groove, and provides a fluid-tight seal between the thermally conductive base structure and the manifold structure.

Abstract translation: 提供了液冷式散热器组件，其包括：具有侧壁表面和主传热表面的导热基底结构; 以及附接到基部结构的歧管结构，其中基部结构至少部分地位于歧管结构中的凹部内。 基座和歧管结构一起限定了一个冷却剂供给室，液体冷却剂至少部分地沿基本上平行于基础结构的主传热表面的方向流动，并且至少一个侧壁表面 歧管结构的导热基底结构或其相对的表面包括连续的凹槽。 密封构件至少部分地设置在连续槽内，并且在导热基底结构和歧管结构之间提供流体密封的密封。

公开(公告)号：US09332674B2

公开(公告)日：2016-05-03

申请号：US14058581

申请日：2013-10-21

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Levi A. Campbell ,  Richard C. Chu ,  Milnes P. David ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

IPC: H05K7/20 ,  G06F1/20

CPC classification number: H05K7/203 ,  H05K7/20 ,  H05K7/20236 ,  H05K7/20336 ,  H05K7/20781

Abstract: A cooled electronic system and cooling method are provided, wherein a field-replaceable bank of electronic components is cooled by an apparatus which includes an enclosure at least partially surrounding and forming a compartment about the electronic components, a fluid disposed within the compartment, and a heat sink associated with the enclosure. The field-replaceable bank extends, in part, through the enclosure to facilitate operative docking of the electronic components into one or more respective receiving sockets of the electronic system. The electronic components of the field-replaceable bank are, at least partially, immersed within the fluid to facilitate immersion-cooling of the components, and the heat sink facilitates rejection of heat from the fluid disposed within the compartment. In one embodiment, multiple thermal conductors project from an inner surface of the enclosure into the compartment to facilitate transfer of heat from the fluid to the heat sink.

Abstract translation: 提供一种冷却的电子系统和冷却方法，其中一个现场可替换的电子部件组由一种装置冷却，所述装置包括至少部分围绕电子部件周围并形成隔室的外壳，设置在隔间内的流体 与外壳相关的散热器。 现场可更换组件部分地延伸通过外壳以便于将电子部件与电子系统的一个或多个相应的接收插座的操作对接。 现场可更换组的电子部件至少部分地浸没在流体内以便于部件的浸入冷却，并且散热器有助于排除设置在隔室内的流体的热量。 在一个实施例中，多个热导体从壳体的内表面突出到隔室中以便于将热量从流体传递到散热器。

公开(公告)号：US09313920B2

公开(公告)日：2016-04-12

申请号：US14058546

申请日：2013-10-21

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Levi A. Campbell ,  Richard C. Chu ,  Milnes P. David ,  Dustin W. Demetriou ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

IPC: H02B1/00 ,  H02B1/56 ,  H05K7/20 ,  G06F1/20 ,  H05K5/00 ,  F28D15/00 ,  F28F7/00 ,  F28B3/04 ,  F28D15/02 ,  F25B23/00

CPC classification number: H05K7/203 ,  F25B23/006 ,  F28B3/04 ,  F28D15/0266 ,  H05K7/20809 ,  Y10T29/4935

Abstract: Cooling apparatuses and methods are provided facilitating transfer of heat from a working fluid to a coolant. The cooling apparatus includes a vapor condenser which includes a condenser housing with a condensing chamber accommodating the working fluid and coolant, which are in direct contact within the condensing chamber and are immiscible fluids. The condensing chamber includes a working fluid vapor layer and a working fluid liquid layer; and a working fluid vapor inlet facilitates flow of fluid vapor into the condensing chamber, and a working fluid vapor outlet facilitates egress of working fluid liquid from the condensing chamber. A coolant inlet structure facilitates ingress of coolant into the working fluid vapor layer of the condensing chamber in direct contact with the working fluid vapor to facilitate condensing the vapor into working fluid liquid, and the coolant outlet structure facilitates subsequent egress of coolant from the condensing chamber.

Abstract translation: 提供了冷却装置和方法，便于将热量从工作流体传递到冷却剂。 冷却装置包括蒸气冷凝器，其包括具有容纳工作流体和冷却剂的冷凝室的冷凝器壳体，其在冷凝室内直接接触并且是不混溶的流体。 冷凝室包括工作流体蒸汽层和工作流体液体层; 并且工作流体蒸气入口促进流体蒸汽流入冷凝室，并且工作流体蒸气出口便于从冷凝室排出工作流体液体。 冷却剂入口结构有助于将冷却剂进入冷凝室的工作流体蒸汽层，与工作流体蒸汽直接接触，以便于将蒸汽冷凝成工作流体液体，并且冷却剂出口结构便于后续从冷凝室排出冷却剂 。

公开(公告)号：US09303926B2

公开(公告)日：2016-04-05

申请号：US13785236

申请日：2013-03-05

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Robert E. Simons

IPC: F28D15/00 ,  F28D15/02 ,  F28F3/02 ,  F28F3/12 ,  H05K7/20

CPC classification number: F28D15/02 ,  F28F3/022 ,  F28F3/12 ,  H05K7/20654 ,  H05K7/20809

Abstract: Vapor condensers and cooling apparatuses facilitating vapor condensation cooling of a coolant employed in cooling an electronic device or electronic subsystem. The vapor condenser includes a thermally conductive base structure having an operational orientation when the condenser is facilitating vapor condensate formation, and a plurality of thermally conductive condenser fins extending from the thermally conductive base structure. The plurality of thermally conductive condenser fins have a varying cross-sectional perimeter along at least a portion of their length. The cross-sectional perimeters of the plurality of thermally conductive condenser fins are configured to increase in a direction of condensate travel through the thermally conductive base structure.

Abstract translation: 蒸气冷凝器和冷却装置促进用于冷却电子设备或电子子系统的冷却剂的蒸气冷凝冷却。 蒸汽冷凝器包括导热基体结构，当冷凝器促进蒸汽冷凝物形成时，具有工作方向，以及从导热基体结构延伸的多个导热冷凝器翅片。 多个导热冷凝器翅片沿其长度的至少一部分具有变化的横截面周长。 多个导热冷凝器翅片的横截面周长被配置为沿冷凝物行进通过导热基底结构的方向增加。

公开(公告)号：US09291281B2

公开(公告)日：2016-03-22

申请号：US13706557

申请日：2012-12-06

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Levi A. Campbell ,  Richard C. Chu ,  Milnes P. David ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

IPC: F16K31/70 ,  F16K31/00 ,  F28F27/02 ,  F28F27/00 ,  F28F3/12 ,  H05K7/20

CPC classification number: F16K31/002 ,  F28F3/12 ,  F28F27/00 ,  F28F27/02 ,  H05K7/20781 ,  H05K7/20836

Abstract: Cooling apparatuses and methods are presented for facilitating dissipation of heat generated by one or more electronic components. The apparatuses include, for instance, a coolant-cooled heat sink and a thermostat-controlled valve. The heat sink includes one or more coolant-carrying channels and one or more valve wells intersecting the channels. The thermostat-controlled valve is disposed, at least partially, within a respective valve well so as to intersect a respective coolant-carrying channel, and includes a valve disk and a thermal-sensitive actuator mechanically coupled to rotate the valve disk. The valve disk is rotatable between an open position where coolant is allowed to flow through the respective coolant-carrying channel, and a closed position where coolant is blocked from flowing through the respective channel. The actuator rotates the valve disk between the open position and the closed position, dependent on heating of the thermal-sensitive actuator by the electronic component(s).

Abstract translation: 呈现冷却装置和方法，以便于散发由一个或多个电子部件产生的热量。 这些装置包括例如冷却剂冷却的散热器和恒温器控制的阀。 散热器包括一个或多个冷却剂承载通道和与通道相交的一个或多个阀井。 恒温控制阀至少部分地设置在相应的阀井内，以与相应的冷却剂承载通道相交，并且包括阀盘和机械耦合以旋转阀盘的热敏致动器。 阀盘可以在允许冷却剂流过相应的冷却剂输送通道的打开位置和阻止冷却剂流过相应通道的关闭位置之间旋转。 执行器根据电子部件对热敏致动器的加热，使阀盘在打开位置和关闭位置之间旋转。