公开(公告)号：US20190229390A1

公开(公告)日：2019-07-25

申请号：US16374768

申请日：2019-04-04

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Kuniaki YOSUI

IPC: H01P3/08 ,  H05K1/02 ,  H05K1/14

Abstract: A multilayer substrate connecting body includes first and second multilayer substrates. The first and second multilayer substrates each include a step portion defined by a difference of a number of stacked layers of insulating base material layers, and a portion of a conductor pattern is exposed to the step portion. An anisotropic conductive film is disposed between the step portions of the first and second multilayer substrates, and portions of conductor patterns that are exposed to the step portions of the first and second multilayer substrates are electrically connected through an electrically connecting portion of the anisotropic conductive film.

公开(公告)号：US20190207077A1

公开(公告)日：2019-07-04

申请号：US16294975

申请日：2019-03-07

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Kuniaki YOSUI ,  Shingo ITO ,  Isamu MORITA ,  Naoki GOUCHI

IPC: H01L41/047 ,  H01L41/083 ,  H01L41/09 ,  H01L41/193 ,  H01F7/20 ,  H01F27/28 ,  H01F27/32 ,  H05K1/18

CPC classification number: H01L41/0475 ,  H01F7/20 ,  H01F27/2804 ,  H01F27/323 ,  H01F2027/2809 ,  H01L41/083 ,  H01L41/0986 ,  H01L41/193 ,  H05K1/02 ,  H05K1/16 ,  H05K1/181 ,  H05K3/46 ,  H05K2201/1003

Abstract: A multilayer substrate includes a stacked body including first and second flexible insulating base material layers, and an actuator conductor pattern on at least the first insulating base material layer. The stacked body includes a first region including stacked first and second insulating base material layers, and a second region including stacked second insulating base material layers. The first region includes an actuator function portion in a portion thereof, the actuator function portion including the actuator conductor pattern. The thickness of the first insulating base material layer including the actuator conductor pattern is smaller than the thickness of one second insulating base material layer.

公开(公告)号：US20190103213A1

公开(公告)日：2019-04-04

申请号：US16205265

申请日：2018-11-30

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Bunta OKAMOTO ,  Kuniaki YOSUI

IPC: H01F27/28 ,  H05K1/16 ,  H05K1/02 ,  H05K1/14 ,  H05K1/11 ,  H01F27/32

Abstract: An electronic device includes an inductor bridge that connects first and second circuits. The inductor bridge includes an insulating base material and a conical coil in the insulating base material. The conical coil includes loop shaped conductors arranged in a winding axis direction. Inner and outer diameters of the loop shaped conductors change is one way in the winding axis direction. A large-diameter loop shaped conductor, which is one of the loop shaped conductors that has the largest inner and outer diameters, is disposed such that the inner and outer diameters thereof relatively extend along the insulating base material compared with the other loop shaped conductors when the inductor bridge is bent.

公开(公告)号：US20190066895A1

公开(公告)日：2019-02-28

申请号：US16174341

申请日：2018-10-30

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Kosuke NISHINO ,  Kuniaki YOSUI

IPC: H01F7/20 ,  G02B27/64 ,  G03B5/00 ,  H01F5/00 ,  G02B7/02 ,  H02K41/035 ,  H02K3/26

CPC classification number: H01F7/20 ,  G02B7/02 ,  G02B27/646 ,  G03B5/00 ,  G03B2205/0007 ,  G03B2205/0069 ,  H01F5/003 ,  H02K3/26 ,  H02K41/0356

Abstract: A stacked body includes a base including insulating base material layers made of thermoplastic resin and stacked, a circuit including a conductive pattern located on the insulating base material layers, and a dummy pattern electrically isolated from the circuit and extending along a portion of the circuit outside of the circuit on the insulating base material layers on which the conductive pattern is located in a plan view. The conductive pattern includes a linear portions at an outermost side of the circuit in a plan view. A bent portion or a wide portion, which has a larger width than the other linear portions in a direction perpendicular or substantially perpendicular to a direction in which a linear portion extends, in a plan view, is located on at least one of the linear portion of the conductive pattern and the dummy pattern extending along the linear portion.

公开(公告)号：US20180145710A1

公开(公告)日：2018-05-24

申请号：US15862688

申请日：2018-01-05

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Kuniaki YOSUI ,  Noboru KATO

IPC: H04B1/12 ,  H04B1/16 ,  H03H7/46 ,  H04B1/525 ,  H04W84/04

CPC classification number: H04B1/126 ,  H03H7/463 ,  H04B1/12 ,  H04B1/16 ,  H04B1/525 ,  H04W84/042

Abstract: A branch circuit includes a common antenna port and separates a first communication signal including a signal in a low band and a signal in a high band and a second communication signal that is a signal in a frequency band between the low band and the high band. The branch circuit includes a first-communication-signal-line-side band elimination filter and a second-communication-signal-line-side band elimination filter and SAW filter.

公开(公告)号：US20180141321A1

公开(公告)日：2018-05-24

申请号：US15874021

申请日：2018-01-18

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Keisuke IKENO ,  Shigeru TAGO ,  Hirohumi SHINAGAWA ,  Kuniaki YOSUI ,  Yuki ITO

IPC: B32B37/06 ,  B32B37/10 ,  H05K3/46

CPC classification number: B32B37/06 ,  B32B37/10 ,  B32B37/182 ,  B32B2307/202 ,  B32B2307/206 ,  C09K19/38 ,  H01L23/5383 ,  H05K3/46 ,  H05K2201/0129

Abstract: A resin multilayer substrate includes insulating base materials integrated by thermocompression bonding and each including a thermoplastic resin as a main material. The insulating base materials include a first insulating base material with a first conductor pattern thereon, and a second insulating base material with a second conductor pattern thereon. The second insulating base material, an intermediate resin material layer, and the first insulating base material are stacked in this order. The intermediate resin material layer includes an intermediate region and an end region in contact with the surface on a first side of the second conductor pattern. The surface on the first side of the intermediate resin material layer is in contact with the first insulating base material, and, when seen in plan view, the first conductor pattern extends over the intermediate region and the end region.

公开(公告)号：US20180115037A1

公开(公告)日：2018-04-26

申请号：US15849996

申请日：2017-12-21

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Kuniaki YOSUI

IPC: H01P1/213 ,  H01F27/00 ,  H01P1/203 ,  H03H7/01 ,  H05K1/16 ,  H04B1/38 ,  H05K1/02 ,  H01F17/00 ,  H03H1/00 ,  H05K1/14 ,  H05K1/18 ,  H05K3/46

CPC classification number: H01P1/2135 ,  H01F17/00 ,  H01F27/00 ,  H01P1/203 ,  H03H7/0115 ,  H03H7/0123 ,  H03H2001/0085 ,  H04B1/38 ,  H05K1/0216 ,  H05K1/0231 ,  H05K1/0239 ,  H05K1/147 ,  H05K1/162 ,  H05K1/165 ,  H05K1/186 ,  H05K3/4635 ,  H05K2201/10098 ,  H05K2201/10189

Abstract: A signal transmission cable including a high-Q value band-elimination filter includes a first signal line conductor pattern including a first capacitor conductor portion and an inductor conductor portion on a first base layer. The first capacitor conductor portion includes a flat conductor, and the inductor conductor portion has a spiral shape. A second signal line conductor pattern including a second capacitor conductor portion is provided on a second base layer. The inductor conductor portion constitutes an inductor, and the first and second capacitor conductor portions and the first base layer constitute a capacitor. The inductor and the capacitor are connected in parallel by transmission conductor portions on the first and second base layers and an interlayer-connector conductor on the first base layer.

公开(公告)号：US20180108976A1

公开(公告)日：2018-04-19

申请号：US15843093

申请日：2017-12-15

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Shinichi NAKANO ,  Kuniaki YOSUI ,  Noboru KATO

IPC: H01Q1/24 ,  G06K19/077 ,  H01Q9/04 ,  H01Q1/48 ,  H01Q1/52 ,  H01Q7/00

CPC classification number: H01Q1/243 ,  G06K19/07794 ,  H01Q1/48 ,  H01Q1/521 ,  H01Q7/00 ,  H01Q9/0407 ,  H01Q9/045

Abstract: An antenna device includes a first conductor plane and a second conductor plane that face each other. The first conductor plane and the second conductor plane are electrically continuous through a first connection conductor, a second connection conductor, and a chip capacitor. A power feed coil is disposed between the first conductor plane and the second conductor plane. The power feed coil includes a magnetic core and a coil conductor. The coil conductor defines a pattern such that the coil conductor winds around the magnetic core. The power feed coil is disposed at a position closer to the first connection conductor and magnetically couples with the first connection conductor.

公开(公告)号：US20180069325A1

公开(公告)日：2018-03-08

申请号：US15807697

申请日：2017-11-09

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Kuniaki YOSUI

IPC: H01Q21/28 ,  H01Q5/371 ,  H01Q5/335 ,  H01Q5/328 ,  H01Q9/42 ,  H01Q7/00 ,  H01Q1/22 ,  H01Q1/24

CPC classification number: H01Q21/28 ,  H01Q1/2208 ,  H01Q1/2216 ,  H01Q1/243 ,  H01Q5/328 ,  H01Q5/335 ,  H01Q5/371 ,  H01Q7/00 ,  H01Q9/42

Abstract: A square bracket-shaped radiation element is in a non-ground region of a board. A first reactance element that equivalently enters a short-circuited state in a second frequency band is connected between a second end of the radiation element and a ground conductor. A second reactance element that equivalently enters a short-circuited state in a first frequency band s connected between a first end of the radiation element and the ground conductor. In the UHF band, the radiation element and the ground conductor function as an inverted F antenna that contributes to field emission. In the HF band, a loop including the radiation element and the ground conductor functions as a loop antenna that contributes to magnetic field emission.

公开(公告)号：US20170294258A1

公开(公告)日：2017-10-12

申请号：US15632415

申请日：2017-06-26

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Shuichi KEZUKA ,  Kuniaki YOSUI

IPC: H01F17/00

CPC classification number: H01F17/0013 ,  H01F2017/002 ,  H01L23/145 ,  H01L23/49822 ,  H05K1/165 ,  H05K3/4632 ,  H05K2201/0129

Abstract: In a built-in coil substrate, coil conductor patterns are provided on insulating base materials. Coil interlayer connection conductors, which provide interlayer connection between the coil conductor patterns, are provided on the insulating base materials and made of conductive paste. First and second external electrodes are provided on a first principal surface of a multilayer body. One of the coil conductor patterns is connected to the first external electrode by first-external-electrode connection conductors made of the conductive paste. Another one of the coil conductor patterns is connected to the second external electrode by a second-external-electrode connection conductor. The second-external-electrode connection conductor is a metal film provided in a through hole that extends through the multilayer body in a stacking direction in which the insulating base materials are stacked.