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    Thin type semiconductor package
    81.
    发明授权
    Thin type semiconductor package 失效
    薄型半导体封装

    公开(公告)号：US06054774A

    公开(公告)日：2000-04-25

    申请号：US890633

    申请日：1997-07-09

    申请人： Jun Ohmori ,  Hiroshi Iwasaki

    发明人： Jun Ohmori ,  Hiroshi Iwasaki

    IPC分类号： H01L23/12 ,  G06K19/077 ,  H01L23/31 ,  H01L23/498 ,  H01L29/41

    CPC分类号： H01L23/49855 ,  G06K19/07743 ,  H01L23/3121 ,  H01L23/49838 ,  H01L2224/16 ,  H01L2224/48227 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01039 ,  H01L2924/01057 ,  H01L2924/01079 ,  H01L2924/12041 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/181 ,  H01L2924/18161

    摘要： A semiconductor package having a board, at least one semiconductor chip, and flat type external connecting terminals, the board having a wiring circuit including connecting portions on a first main surface, the semiconductor being mounted on the first main surface, the flat type external connecting terminals being electrically connected to the semiconductor chip and formed on a second main surface of the board, wherein the flat type external connecting terminals are disposed in such a manner that any straight line which is arbitrarily drawn across the surface of a region to form the flat type external connecting terminals of the board runs on at least one of the flat type external connecting terminals.

    摘要翻译： 一种具有板，至少一个半导体芯片和平面型外部连接端子的半导体封装，所述板具有布线电路，所述布线电路包括在第一主表面上的连接部分，所述半导体安装在所述第一主表面上，所述平面型外部连接 端子电连接到半导体芯片并形成在板的第二主表面上，其中扁平型外部连接端子以这样的方式设置，即任意直线横过区域的表面而形成平面 板的外部连接端子至少在一个平面型外部连接端子上运行。

    Memory card
    82.
    发明授权
    Memory card 失效
    存储卡

    公开(公告)号：US5892213A

    公开(公告)日：1999-04-06

    申请号：US71961

    申请日：1998-05-05

    申请人： Toshiyasu Ito ,  Hiroshi Iwasaki ,  Minoru Ohara

    发明人： Toshiyasu Ito ,  Hiroshi Iwasaki ,  Minoru Ohara

    IPC分类号： G06K19/077 ,  G06K7/06

    CPC分类号： G06K19/07739 ,  G06K19/077

    摘要： A memory card is to be inserted into an electronic device so as to add a memory function. The memory card comprises a parent card and a child card, the child card including a semiconductor memory element and a lead as an external terminal of the memory element. The parent card includes a child card receiving portion and a child card insert port for inserting the child card into the child card receiving portion through the child card insert port, and a contact to be contacted with the lead of the child card within the child card receiving portion. A contact opening/closing slide is provided for causing a contacting portion of the contact to be shifted to a position in which it can contact with the lead while moving in the child card insert direction pushed by the child card. The parent card also includes a connector element for contacting with the electronic device.

    摘要翻译： 将存储卡插入到电子设备中以增加记忆功能。 存储卡包括母卡和子卡，子卡包括半导体存储元件和作为存储元件的外部端子的引线。 母卡包括儿童卡接收部分和儿童卡插入口，用于通过儿童卡插入口将子卡插入儿童卡接收部分，以及与儿童卡内的儿童卡片的导线接触的联系人 接收部分。 提供触点打开/关闭滑动件，用于使触点的接触部分移动到与儿童卡片推动的儿童卡片插入方向移动时能够与引线接触的位置。 母卡还包括用于与电子设备接触的连接器元件。

    Semiconductor package socket
    83.
    发明授权
    Semiconductor package socket 失效
    半导体封装插座

    公开(公告)号：US5865632A

    公开(公告)日：1999-02-02

    申请号：US870271

    申请日：1997-06-06

    申请人： Hiroshi Iwasaki

    发明人： Hiroshi Iwasaki

    IPC分类号： H01R33/76 ,  G01R1/04 ,  H01L23/32 ,  G01R31/02

    CPC分类号： G01R1/04 ,  H01L2224/48091 ,  H01L2224/48227

    摘要： A semiconductor package socket comprises an insulating support substrate, pin contacts arranged in a constant-pitch lattice-array and which are attached in a manner that permits advance or retreat in a direction which is almost perpendicular to a main surface of the support substrate, a pin contact movement driving mechanism which advances or retreats the pin contacts en bloc, and a guide frame which has spaces to accommodate said pin contacts, which is freely detachable and which can cover areas other than those required by the pin contacts.

    摘要翻译： 半导体封装插座包括绝缘支撑基板，以恒定间距格阵列布置的销触点，其以允许在几乎垂直于支撑基板的主表面的方向上前进或后退的方式附接， 销接触运动驱动机构，其使销触头整体前进或后退;以及引导框架，其具有容纳所述销触点的空间，其可自由拆卸并且可以覆盖除了销触点所需的以外的区域。

    Process for producing polyethylene naphthalate
    84.
    发明授权
    Process for producing polyethylene naphthalate 失效
    生产聚萘二甲酸乙二醇酯的方法

    公开(公告)号：US5811513A

    公开(公告)日：1998-09-22

    申请号：US860701

    申请日：1997-07-09

    申请人： Hiroshi Iwasaki ,  Masayasu Ishibashi ,  Hiromi Ueki ,  Shoji Hiraoka ,  Toru Matsuyoshi ,  Satoshi Inoki

    发明人： Hiroshi Iwasaki ,  Masayasu Ishibashi ,  Hiromi Ueki ,  Shoji Hiraoka ,  Toru Matsuyoshi ,  Satoshi Inoki

    IPC分类号： C08G63/189 ,  C08G63/672 ,  C08G63/78 ,  C08G63/82

    CPC分类号： C08G63/189 ,  C08G63/78 ,  C08G63/82

    摘要： In the production of polyethylene naphthalate of the present invention, the esterification reaction between naphthalenedicarboxylic acid and ethylene glycol is conducted while causing water to be present in a reaction system from a start of reaction, in the presence of at least one catalyst selected from the group consisting of nitric, carboxylic, phosphoric and hydrogenphosphoric acid metal salts and alkyl amines according to necessity, to thereby attain an esterification ratio of 45 to 80%, so that a liquid mixture of naphthalenedicarboxylic acid esterification reaction products containing naphthalenedicarboxylic acid, carboxyl-hydroxyethoxycarbonylnaphthalene and bis(hydroxyethoxycarbonyl)naphthalene is obtained. Subsequently, a crystallized reaction product is separated from this liquid mixture to thereby obtain a mixture of esterification reaction products. Thereafter, this mixture having ethylene glycol added thereto according to necessity is subjected to polycondensation. The polyethylene naphthalate obtained by the process of the present application ensures a low content of naphthalenedicarboxylic acid esters each having diethylene glycol skeleton therein, thereby having excellent quality, for example, in appearance.

    摘要翻译： PCT No.PCT / JP96 / 03116 Sec。 371日期1997年7月9日第 102（e）日期1997年7月9日PCT 1996年10月25日PCT公布。 公开号WO97 / 17391 日期1997年5月15日在本发明的聚萘二甲酸乙二醇酯的制造中，在反应开始时，在存在至少一种催化剂的同时，使反应体系中存在水，进行萘二甲酸与乙二醇的酯化反应 根据需要选自硝酸，羧酸，磷酸和氢磷酸金属盐和烷基胺，从而达到45-80％的酯化比，使得含萘二羧酸的萘二甲酸酯化反应产物的液体混合物， 羧基 - 羟基乙氧基羰基萘和双（羟基乙氧基羰基）萘。 随后，从该液体混合物中分离出结晶的反应产物，由此得到酯化反应产物的混合物。 然后，将根据需要添加有乙二醇的混合物进行缩聚。 通过本申请的方法获得的聚萘二甲酸乙二醇酯确保了在其中具有二甘醇骨架的低含量的萘二羧酸酯，从而具有优异的质量，例如外观。

    Window molding for automobiles
    85.
    发明授权
    Window molding for automobiles 失效
    汽车窗模

    公开(公告)号：US5771652A

    公开(公告)日：1998-06-30

    申请号：US683318

    申请日：1996-07-18

    申请人： Takuji Nagata ,  Masao Kobayashi ,  Shinichi Goto ,  Hiroshi Iwasaki

    发明人： Takuji Nagata ,  Masao Kobayashi ,  Shinichi Goto ,  Hiroshi Iwasaki

    IPC分类号： B60J1/02 ,  B60J10/00 ,  B60J10/02

    CPC分类号： B60J10/24 ,  B60J10/18 ,  B60J10/25 ,  B60J10/70

    摘要： A window molding for automobiles, which is installed around the periphery of a windshield, including a leg and a head. The head is formed to permit the creation of two different water guide portions extending along the molding, one that will function along the roof line and another along the side edge of the windshield. The side water guide portion prevents water from going from the windshield to the side windows. The roof line water guide portion opens toward the window frame and prevents water from flowing from the roof onto the windshield.

    摘要翻译： 一种用于汽车的窗模，其安装在挡风玻璃的周围，包括腿和头部。 头部被形成为允许产生沿着模制件延伸的两个不同的导水部分，这些引导部分将沿着屋顶线而起作用，另一个沿着挡风玻璃的侧边缘起作用。 侧水引导部防止水从挡风玻璃到侧窗。 屋顶导水引导部朝向窗框打开，防止水从屋顶流入挡风玻璃。

    Thin IC card and method for producing the same
    86.
    发明授权
    Thin IC card and method for producing the same 失效
    薄IC卡及其制造方法

    公开(公告)号：US5612532A

    公开(公告)日：1997-03-18

    申请号：US554927

    申请日：1995-11-09

    申请人： Hiroshi Iwasaki

    发明人： Hiroshi Iwasaki

    IPC分类号： B42D15/10 ,  G06K19/07 ,  G06K19/077 ,  G06K19/06

    CPC分类号： G06K19/07769 ,  G06K19/07745 ,  G06K19/07749 ,  G06K19/0775 ,  H01L2224/16 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/01057 ,  H01L2924/01079

    摘要： A thin IC card which is highly reliable, simple in construction and structure, to which a function section relating to main information processing can be easily attached, and which has improved portability, and a method for producing it are disclosed. This thin IC card is characterized by including a plate type IC module in which a semiconductor device having at least memory function and CPU function has its one side sealed or molded with a resin, and flat type externally connecting terminals have their one end connected to the input/output terminals of the semiconductor device and the other end led and exposed to a non-resin sealed or molded side, and a card-like support which has a fitting section for fitting the plate type IC module with the surface of the externally connecting terminals of the plate type IC module exposed to be substantially flush with the surface of the card, a required circuit wiring, an antenna for sending and receiving a signal without contacting, and if necessary an oscillator for specifying a frequency and a power supply battery.

    摘要翻译： 公开了一种高可靠性，结构简单，结构简单的薄型IC卡，可以容易地附加与主信息处理相关的功能部分，并且具有改进的便携性，以及其制造方法。 该薄IC卡的特征在于包括板式IC模块，其中具有至少记忆功能和CPU功能的半导体器件的单面被密封或模制成树脂，并且扁平型外部连接端子的一端连接到 半导体器件的输入/输出端子和另一端引导并暴露于非树脂密封或模制侧;以及卡状支撑件，其具有用于将板式IC模块与外部连接的表面相配合的嵌合部分 暴露于与卡的表面基本齐平的板式IC模块的端子，所需的电路布线，用于不接触地发送和接收信号的天线，以及必要时用于指定频率的振荡器和电源电池。

    Horizontal continuous casting method and apparatus
    88.
    发明授权
    Horizontal continuous casting method and apparatus 失效
    水平连铸方法及装置

    公开(公告)号：US5458183A

    公开(公告)日：1995-10-17

    申请号：US226370

    申请日：1994-04-12

    申请人： Tatsuhito Matsushima ,  Seishiro Saita ,  Masayuki Inoue ,  Hiroyuki Nakashima ,  Shogo Matsumura ,  Hiroshi Iwasaki ,  Ryuuzou Hanzawa ,  Katsuhiko Kawamoto ,  Haruo Ohguro ,  Yukio Morimoto ,  Toshihiro Kosuge

    发明人： Tatsuhito Matsushima ,  Seishiro Saita ,  Masayuki Inoue ,  Hiroyuki Nakashima ,  Shogo Matsumura ,  Hiroshi Iwasaki ,  Ryuuzou Hanzawa ,  Katsuhiko Kawamoto ,  Haruo Ohguro ,  Yukio Morimoto ,  Toshihiro Kosuge

    IPC分类号： B22D11/047 ,  B22D11/00

    CPC分类号： B22D11/047

    摘要： A continuous casting method includes the steps of continuously supplying molten metal into a mold through at least one feed nozzle connected to the mold through a break ring, with the feed nozzle, the mold and the break ring forming at least a portion of a continuous casting apparatus, and intermittently withdrawing a cast piece formed from the molten metal in the mold thereby creating pressure in a space formed at a connecting point between the break ring, the mold and the cast piece as a result of the withdrawal from the mold. A shield means is placed to seal-off space between the at least one feed nozzle, and the mold to prevent entry of gas into the continuous casting apparatus and the pressure is reduced in the sealed-off space to thereby eliminate a pressure differential between the pressure in the sealed-off space and the pressure created in the space formed at the connecting point between the break ring, the mold and the cast piece during the intermittent withdrawal from the mold.

    摘要翻译： 连续铸造方法包括以下步骤：通过穿过断环连接到模具的至少一个进料喷嘴将熔融金属连续供应到模具中，进料喷嘴，模具和断裂环形成至少一部分连续铸造 装置，并且间歇地取出由模具中的熔融金属形成的铸件，从而在由模具退出的结果中形成在断环，模具和铸件之间的连接点处的空间中产生压力。 屏蔽装置被放置成密封至少一个进料喷嘴和模具之间的空间，以防止气体进入连续铸造设备，并且在密封空间中降低压力，从而消除了压力差 在间歇地退出模具期间，密封空间中的压力以及在断环，模具和铸件之间的连接点处形成的空间中产生的压力。