SEMICONDUCTOR MEMORY
    82.
    发明公开

    公开(公告)号:US20230154549A1

    公开(公告)日:2023-05-18

    申请号:US17916927

    申请日:2021-04-28

    IPC分类号: G11C16/30 G11C16/26

    CPC分类号: G11C16/30 G11C16/26

    摘要: A semiconductor memory, comprising a negative voltage providing unit, which is used for providing a first negative voltage to a word line during a read operation, and comprises: a clamping unit that comprises an input end, a control end and an output end, wherein the input end is coupled to a common ground end of the memory, and the control end is used for receiving a first signal; an energy storage capacitor, a first end of which is coupled to the output end, and a second end that is used for receiving a second signal; and a negative voltage providing end which is coupled to the first end, wherein the clamping unit is used for: pulling the voltage at the output end to the voltage at the input end when the first signal is “0”; and clamping the output end at a clamping voltage when the first signal is “1”.

    Flash device and manufacturing method thereof

    公开(公告)号:US11605641B2

    公开(公告)日:2023-03-14

    申请号:US17257087

    申请日:2019-10-12

    IPC分类号: H01L27/11521

    摘要: A flash device and a manufacturing method thereof. The method comprises: providing a substrate, and forming, on the substrate, a floating gate polycrystalline layer, a floating gate oxide layer, and a tunneling oxide layer; wherein the floating gate polycrystalline layer is formed on the substrate, the floating gate oxide layer is formed between the substrate and the floating gate polycrystalline layer, a substrate region at one side of the floating gate polycrystalline layer is a first substrate region, a substrate region at the other side of the floating gate polycrystalline layer is a second substrate region; forming, on the tunneling oxide layer, located in the first substrate region, a continuous non-conductive layer, the non-conductive layer extending to the tunneling oxide layer at a side wall of the floating gate polycrystalline layer; and forming, on the tunneling oxide layer, a polysilicon layer.

    ANALOG-TO-DIGITAL CONVERTER AND THERMOPILE ARRAY

    公开(公告)号:US20230067583A1

    公开(公告)日:2023-03-02

    申请号:US17796952

    申请日:2021-05-27

    发明人: Chen LI Hao WANG

    IPC分类号: G01J5/12

    摘要: An analog-to-digital converter and a thermopile array. The analog-to-digital converter comprises: a reference voltage generation circuit comprising a voltage generation unit; a chopping modulation unit used to perform chopping modulation on a voltage signal generated by the voltage generation unit, and to modulate low frequency noise of the voltage signal into high frequency noise; and a low-pass filter used to eliminate the high frequency noise to obtain a reference voltage. The invention employs a simple structure to obtain a low noise reference voltage at low costs.

    Semiconductor device and manufacturing method therefor

    公开(公告)号:US11552164B2

    公开(公告)日:2023-01-10

    申请号:US17265565

    申请日:2019-08-09

    摘要: A semiconductor device comprises: a substrate; a well region provided in the substrate, having a second conductivity type; source regions having a first conductivity type; body tile regions having the second conductivity type, the source regions and the body tie regions being alternately arranged in a conductive channel width direction so as to form a first region extending along the conductive channel width direction, and a boundary where the edges of the source regions and the edges of the body tie regions are alternately arranged being formed on two sides of the first region; and a conductive auxiliary region having the first conductivity type, provided on at least one side of the first region, and directly contacting the boundary, a contact part comprising the edge of at least one source region on the boundary and the edge of at least one body tie region on the boundary.

    MEMS MICROPHONE AND PREPARATION METHOD THEREFOR

    公开(公告)号:US20220386052A1

    公开(公告)日:2022-12-01

    申请号:US17761669

    申请日:2020-05-26

    IPC分类号: H04R31/00 H04R19/04 B81C1/00

    摘要: A preparation method for a micro-electromechanical systems (MEMS) microphone includes the steps of: providing a silicon substrate having a silicon surface; forming an enclosed cavity in the silicon substrate; forming a plurality of spaced apart acoustic holes in the silicon substrate, each acoustic hole having two openings, one of which communicating with the cavity and the other one located on the silicon surface; forming a sacrificial layer on the silicon substrate, which includes a first filling portion, a second filling portion and a shielding portion; forming a polysilicon layer on the shielding portion; forming a recess in the silicon substrate on the side away from the silicon surface; and removing the first filling portion, the second filling portion and part of the shielding portion so that the recess is brought into communication with the cavity to form a back chamber, and that the polysilicon layer, the remainder of the shielding portion and the silicon substrate together delimit a hollow chamber, the hollow chamber communicating with the opening of the plurality of acoustic holes away from the cavity, completing the MEMS microphone.

    Trench gate depletion mode VDMOS device and method for manufacturing the same

    公开(公告)号:US11387349B2

    公开(公告)日:2022-07-12

    申请号:US17265587

    申请日:2019-10-14

    IPC分类号: H01L29/66 H01L29/78

    摘要: A trench gate depletion-type VDMOS device and a method for manufacturing the same are disclosed. The device comprises a drain region; a trench gate including a gate insulating layer on an inner wall of a trench and a gate electrode filled in the trench and surrounded by the gate insulating layer; a channel region located around the gate insulating layer; a well region located on both sides of the trench gate; a source regions located within the well region; a drift region located between the well region and the drain region; a second conductive-type doped region located between the channel region and the drain region; and a first conductive-type doped region located on both sides of the second conductive-type doped region and located between the drift region and the drain region.