Abstract:
A micro mechanical component of the present invention comprises a base, and at least one drive portion supported on the base and relatively driving to the base, in which the drive portion is formed from a diamond layer. Thus, because the drive portion has excellent mechanical strength and modulus of elasticity, the operational performance can be greatly improved as a micro mechanical component processed in a fine shape, from the conventional level. Further, because the drive portion exhibits excellent device characteristics under severe circumstances, the range of applications as a micro mechanical component can be widely expanded from the conventional range.
Abstract:
An acceleration detection device is provided which is capable of detecting accelerations in two or more directions. The base end of a beam is fixed to a support section on a board. A weight is provided in the front end of the beam which is formed so as to extend horizontally along the board surface with a gap with it and the surface of the board. The position of the center of gravity G of the weight is set at a position spaced perpendicularly apart from the center axis of the beam in order that the inertial moment acts when an acceleration along the length (in the X direction) of the beam is applied. The front end surface of the weight is formed into an upright surface of a movable electrode, and a fixed electrode is formed at a position facing the movable electrode with a gap therebetween. When an acceleration in the X or Y direction is applied, the beam is flexed upwardly or downwardly in proportion to the magnitude of the acceleration, causing the weight to be inclined upwardly or downwardly while being displaced upwardly or downwardly. Thus, the electrostatic capacity between the movable electrode and the fixed electrode increases or decreases. The magnitude of the acceleration can be detected on the basis of the amount of such change of the electrostatic capacity.
Abstract:
A single mask, low temperature reactive ion etching process for fabricating high aspect ratio, released single crystal microelectromechanical structures independently of crystal orientation.
Abstract:
A symmetrical proof-mass accelerometer with a self-diagnosis capability and its fabrication method are disclosed. The accelerometer has symmetrical mass distribution with respect to the plane of the cantilever beam with an offset between upper and lower masses, so as to minimize cross-axis sensitivity and facilitate self-diagnostic resistor installation. This accelerometer can be applied to automobile electronics systems, consumer electronics, and industrial electrical measurement systems, which require measurements of displacement, velocity, vibration, acceleration, angular acceleration and their changes.
Abstract:
What is described in the present specification are accelerometers using tiny proof masses and piezoresistive force detection. Conventional wisdom would indicate that this approach would not yield useful sensors. However, in fact, according to the invention, such devices are suitable in a wide range of applications. The devices may include deformable hinges to allow the fabrication of three dimensional structures. A new system has been developed which etches silicon highly selectively at moderate temperatures and without hydrodynamic forces potentially damaging to small structures and features. The system is based on the use of the gas phase etchant xenon diflouride, which is an unremarkable white solid at standard temperature and pressure.
Abstract:
Manufacturing method for an acceleration sensor on silicon, whereby, following the manufacture of the doped regions required for the electronic function elements, a polysilicon layer is deposited. The polysilicon layer is structured such that a portion of this polysilicon layer forms an electrode (for example, the emitter electrode (9) and the collector electrode (10) of a transistor) and a sensor layer (17) provided as sensor element.
Abstract:
A semiconductor acceleration sensor includes a substrate, a semiconductor sensor chip with a diaphragm and having one end fixed to a pedestal, the pedestal including at least one thick film layer and disposed on the substrate, and a protrusion of at least one thick film layer on the substrate directly opposite a free end of the sensor chip, shorter than the pedestal. The protrusion protects the semiconductor sensor chip from breakage at the diaphragm due to impacts.
Abstract:
A capacitance acceleration sensor and method of making same are disclosed. A capacitance acceleration sensor includes a movable electrode etched from a silicon plate which is clamped between two solid dielectric plate members of glass, silicon oxides, or oxygen oxides. Static electrodes are secured to surfaces of the dielectric members facing opposite the movable electrode, thereby providing easy manufacturing assessibility for leadout wires from these electrodes. In certain embodiments, the movable electrode is formed integrally with a monocrystalline silicon plate member which also contains an integrated circuit for generating an output acceleration signal in response to movement of the movable electrode when the assembly experiences acceleration forces.
Abstract:
The invention provides a high-reliability inexpensive semiconductor acceleration sensor requiring no special material for a pedestal, making is possible to decrease the number of materials and the number of assembly steps. A semiconductor acceleration sensor includes a circuit substrate having a thick-film circuit including at least a circuit conductor and an insulating layer, a pedestal on the circuit substrate, a flexible acceleration detecting beam supported by the pedestal and deflecting in response to acceleration, a sensor device on the acceleration detecting beam converting deflection of the acceleration detecting beam into an electrical signal, and a conductor connecting the sensor device with the thick-film circuit wherein the pedestal is the same material as at least one of the circuit conductor and the insulating layer.
Abstract:
An acceleration sensor includes a case having a bottom part, a pair of opposed walls substantially perpendicular to the bottom part, and a pair of first projections located on the bottom part. The sensor further includes a detection section attached to the case via the pair of first projections for detecting an acceleration and outputting a signal indicating the acceleration, and a spacer located on the bottom part of the case. In addition, the sensor includes an amplifier circuit board attached to the case in the state of being opposed to the detection section with the spacer interposed therebetween and having an amplifier on a substrate thereof for amplifying the signal output by the detection section. Relay terminals are provided for electrically connecting the detection section and the amplifier circuit board, together with output terminals electrically connected to the amplifier circuit board for supplying the amplified signal to an external circuit. The detection section is surrounded by the case, the spacer and the amplifier circuit board. The case has projections used for attaching the acceleration sensor to the object.