公开(公告)号：US20180294164A1

公开(公告)日：2018-10-11

申请号：US16009352

申请日：2018-06-15

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： SHOGO OKITA ,  ATSUSHI HARIKAI

IPC: H01L21/3065 ,  H01L21/78 ,  H01L21/687 ,  H01L21/683 ,  H01L21/67 ,  H01L21/308 ,  H01L21/677

CPC classification number: H01L21/3065 ,  H01L21/30655 ,  H01L21/308 ,  H01L21/67109 ,  H01L21/67115 ,  H01L21/677 ,  H01L21/6831 ,  H01L21/68742 ,  H01L21/68785 ,  H01L21/78

Abstract: The yield of a product is improved when a substrate held by a conveyance carrier is subjected to a plasma treatment. A method of manufacturing an electronic component includes preparing a substrate which is bonded to a holding sheet of a conveyance carrier, the conveyance carrier including the holding sheet and a frame disposed on an outer peripheral portion of the holding sheet, the substrate having a circuit layer; heating the holding sheet after preparing the substrate; cooling the holding sheet after heating the holding sheet; and plasma etching the substrate to singulate the substrate into the electronic component in a state that the substrate is placed above a stage included in a plasma treatment apparatus and the substrate is in contact with the stage via the holding sheet.

公开(公告)号：US10076896B2

公开(公告)日：2018-09-18

申请号：US15191410

申请日：2016-06-23

Applicant: Alta Devices, Inc.

Inventor： Khurshed Sorabji

IPC: B32B37/10 ,  H01L21/677 ,  H01L31/18 ,  B32B37/06 ,  B32B37/14 ,  B32B38/18

CPC classification number: B32B37/1018 ,  B32B37/06 ,  B32B37/1027 ,  B32B37/14 ,  B32B38/1858 ,  B32B2457/12 ,  H01L21/677 ,  H01L21/67706 ,  H01L21/67748 ,  H01L21/6776 ,  H01L31/043 ,  H01L31/1864 ,  H01L31/1876 ,  Y02E10/50 ,  Y02P70/521

Abstract: A method and system for connecting a plurality of materials using pressure and curing is disclosed. The method provides for: a) receiving the plurality of materials on the vacuum conveyor; b) conveying the received plurality of materials from the first location to a second location along the vacuum conveyor; c) applying a predetermined vacuum pressure; and d) curing the compressed plurality of materials. The system comprises a vacuum conveyor for receiving the plurality of materials at a first location, a moving belt adaptively positioned above the vacuum conveyor at a second location and the vacuum conveyor and the moving belt are arranged to be driven in a predetermined relation to one another, a vacuum pressure source for applying a predetermined vacuum pressure creating a force compressing the plurality of materials; and a curing source at a second location for curing the compressed plurality of materials.

公开(公告)号：US20180208404A1

公开(公告)日：2018-07-26

申请号：US15744415

申请日：2016-06-02

Applicant: MURATA MACHINERY, LTD.

Inventor： Kenji KUMAGAI ,  Atsushi KOBAYASHI

IPC: B65G43/10 ,  H01L21/677

CPC classification number: B65G43/10 ,  B65G43/02 ,  B65G2201/0297 ,  B65G2203/0266 ,  G05D1/0297 ,  G05D2201/0216 ,  H01L21/677 ,  H01L21/6773

Abstract: A conveyance control device according to one aspect of the present invention is configured to control operation of one or more carriages each configured to convey a FOUP. The conveyance control device includes: a basic processing unit that generates basic command data based on basic input data containing a request to convey the FOUP; an optimization processing unit that generates optimization command data based on optimization input data containing the request to convey the FOUP; an output unit that outputs the basic command data or the optimization command data to each of the carriages; and a switching unit that controls operation of at least one of the basic processing unit, the optimization processing unit, and the output unit such that either one of the basic command data and the optimization command data is output by the output unit.

公开(公告)号：US20180100235A1

公开(公告)日：2018-04-12

申请号：US15567148

申请日：2016-04-22

Applicant: SUMCO CORPORATION

Inventor： Shoji NOGAMI ,  Naoyuki WADA ,  Masaya SAKURAI ,  Takayuki KIHARA

IPC: C23C16/458 ,  C30B25/12 ,  H01L21/205

CPC classification number: C23C16/458 ,  C23C16/4586 ,  C30B25/12 ,  C30B29/06 ,  H01L21/205 ,  H01L21/677 ,  H01L21/67739 ,  H01L21/68742

Abstract: Provided is a susceptor, capable of preventing occurrence of scratches on the back surface of a wafer attributable to lift pins, and reducing unevenness of the in-surface temperature distribution of the wafer. A susceptor according to one embodiment of this disclosure has a susceptor main body and a plate-shaped member, and when a wafer is conveyed, the front surface of the plate-shaped member ascended by lift pins supports the central part of the back surface of the wafer by surface contact. A separation space between the plate-shaped member and the susceptor main body, in a state in which the plate-shaped member is placed on the recessed part, enters further into the central side of the plate-shaped member, in a direction from the front surface to the back surface of the susceptor.

公开(公告)号：US20180082874A1

公开(公告)日：2018-03-22

申请号：US15267232

申请日：2016-09-16

Applicant: Applied Materials, Inc.

Inventor： Xinyu BAO ,  Chun YAN ,  Hua CHUNG ,  Schubert S. CHU

IPC: H01L21/673

CPC classification number: H01L21/67 ,  H01L21/673 ,  H01L21/67393 ,  H01L21/677

Abstract: Embodiments disclosed herein generally relate to apparatus and methods for controlling substrate outgassing such that hazardous gasses are eliminated from a surface of a substrate after a Si:As process has been performed on a substrate, and prior to additional processing. The apparatus includes a purge station including an enclosure, a gas supply coupled to the enclosure, an exhaust pump coupled to the enclosure, a first purge gas port formed in the enclosure, a first channel operatively connected to the gas supply at a first end and to the first purge gas port at a second end, a second purge gas port formed in the enclosure, and a second channel operatively connected to the second purge gas port at a third end and to the exhaust pump at a fourth end. The first channel includes a particle filter, a heater, and a flow controller. The second channel includes a dry scrubber.

公开(公告)号：US20170365288A1

公开(公告)日：2017-12-21

申请号：US15627124

申请日：2017-06-19

Applicant: Applied Materials, Inc.

Inventor： Majeed A. Foad ,  Jacob Newman ,  Jose Antonio Marin ,  Daniel J. Hoffman ,  Stephen Moffatt ,  Steven Verhaverbeke

IPC: G11B5/82 ,  C23C16/00 ,  C23F1/00 ,  H01L21/673 ,  G11B5/855 ,  G11B5/84 ,  H01L21/677 ,  H01L21/687 ,  C23C14/48 ,  C23C14/50

CPC classification number: G11B5/82 ,  C23C14/48 ,  C23C14/50 ,  C23C16/00 ,  C23F1/00 ,  G11B5/84 ,  G11B5/855 ,  H01L21/673 ,  H01L21/677 ,  H01L21/687

Abstract: Methods and apparatus for forming substrates having magnetically patterned surfaces is provided. A magnetic layer comprising one or more materials having magnetic properties is formed on a substrate. The magnetic layer is subjected to a patterning process in which selected portions of the surface of the magnetic layer are altered such that the altered portions have different magnetic properties from the non-altered portions without changing the topography of the substrate. A protective layer and a lubricant layer are deposited over the patterned magnetic layer. The patterning is accomplished through a number of processes that expose substrates to energy of varying forms. Apparatus and methods disclosed herein enable processing of two major surfaces of a substrate simultaneously, or sequentially by flipping. In some embodiments, magnetic properties of the substrate surface may be uniformly altered by plasma exposure and then selectively restored by exposure to patterned energy.

公开(公告)号：US20170352556A1

公开(公告)日：2017-12-07

申请号：US15682730

申请日：2017-08-22

Applicant: HITACHI KOKUSAI ELECTRIC INC.

Inventor： Yasuaki KOMAE ,  Takashi NOGAMI ,  Tomoshi TANIYAMA ,  Shigeru ODAKE

IPC: H01L21/677

CPC classification number: H01L21/677 ,  B25J9/104 ,  B25J18/02 ,  B65G49/07 ,  H01L21/67712 ,  H01L21/6773 ,  H01L21/67781 ,  H01L21/68707

Abstract: A substrate processing apparatus includes a process chamber and a transfer device configured to transfer a plurality of substrates to a substrate retainer. The transfer device includes a base; a first moving unit capable of linear motion; a first drive unit to drive the first moving unit. The first drive unit includes a first pulley group; a first motor coupled to a first pulley; and a first connecting member coupling the first belt and the first moving unit. A second moving unit is capable of linear motion. A second drive unit is in an enclosure of the first moving unit and drives the second moving unit. The second drive unit includes a second pulley group; a second belt wound on the second pulley group, a second motor coupled to drive a second pulley; and a second connecting member coupling the second belt and the second moving unit.

公开(公告)号：US20170271193A1

公开(公告)日：2017-09-21

申请号：US15504787

申请日：2015-08-18

Applicant: NITTO DENKO CORPORATION

Inventor： Youhei MAENO

IPC: H01L21/687 ,  D01F9/12 ,  H01L21/677

CPC classification number: H01L21/68757 ,  B82B1/00 ,  B82Y30/00 ,  C01B32/05 ,  C01B32/158 ,  C01B2202/06 ,  C01B2202/34 ,  D01F9/12 ,  H01L21/677 ,  H01L21/683 ,  Y10S977/752 ,  Y10S977/932

Abstract: Provided is a semiconductor transport member that includes a semiconductor mounting member capable of expressing a strong gripping force and unlikely to cause a contaminant to adhere and remain on a semiconductor side. Also provided is a semiconductor mounting member capable of expressing a strong gripping force and unlikely to cause a contaminant to adhere and remain on a semiconductor side. The semiconductor transport member of the present invention includes: a carrying base; and a semiconductor mounting member, in which: the semiconductor mounting member includes a fibrous columnar structure; the fibrous columnar structure includes a fibrous columnar structure including a plurality of fibrous columnar objects; the fibrous columnar objects are each aligned in a direction substantially perpendicular to the carrying base; and a surface of the fibrous columnar structure on an opposite side to the carrying base has a coefficient of static friction against a glass surface of 2.0 or more.

公开(公告)号：US09620397B2

公开(公告)日：2017-04-11

申请号：US14788173

申请日：2015-06-30

Applicant: Murata Machinery Ltd.

Inventor： Brian J. Doherty ,  Thomas R. Mariano ,  Robert P. Sullivan

IPC: H01L21/677 ,  B65G1/04

CPC classification number: H01L21/67733 ,  B65G1/0457 ,  H01L21/677 ,  H01L21/67706 ,  H01L21/67736 ,  H01L21/67769

Abstract: A highly efficient Automated Material Handling System (AMHS) that allows an overhead hoist transport vehicle to load and unload Work-In-Process (WIP) parts directly to/from one or more WIP storage units included in the system. The AMHS includes an overhead hoist transport subsystem and at least one vertical carousel stocker having a plurality of storage bins. The overhead hoist transport subsystem includes an overhead hoist transport vehicle traveling along a suspended track defining a predetermined route, which runs adjacent to the carousel stocker, thereby allowing the overhead hoist transport vehicle to access a WIP part directly from one of the storage bins. At least one of the storage bins includes a movable shelf operative to move laterally from a first position along the carousel path to a second position near the overhead hoist transport vehicle.

公开(公告)号：US09570336B2

公开(公告)日：2017-02-14

申请号：US15016272

申请日：2016-02-05

Applicant: KABUSHIKI KAISHA YASKAWA DENKI

Inventor： Masatoshi Furuichi ,  Yoshiki Kimura

IPC: H01L21/677 ,  H01L21/687

CPC classification number: H01L21/68707 ,  H01L21/677 ,  H01L21/67706 ,  H01L21/67715 ,  H01L21/67766 ,  Y10S414/137

Abstract: A substrate transfer system includes a substrate transfer robot. The substrate transfer robot is provided between a first apparatus and a second apparatus which has a wall provided opposite to the substrate transfer robot and having an opening on the wall. The substrate transfer robot is configured to transfer a substrate from the first apparatus to the second apparatus via the opening and includes a base having a first axis, an arm body, and a hand. The arm body has a proximal end and a distal end and is connected to the base at the proximal end to rotate around the first axis. The substrate transfer robot includes a minimum distance from the first axis to an outermost portion of the arm body and the hand in a radius direction from the first axis being larger than a distance between the first axis and the opening on the wall.

Abstract translation: 基板传送系统包括基板传送机器人。 衬底传送机器人设置在第一设备和第二设备之间，第二设备具有与衬底传送机器人相对设置的壁，并且在壁上具有开口。 基板传送机器人构造成经由开口将基板从第一装置传送到第二装置，并且包括具有第一轴，臂主体和手的基部。 臂体具有近端和远端，并且在近端处连接到基部以围绕第一轴线旋转。 基板传送机器人包括从臂体的第一轴线到最外侧部分的最小距离，并且距离第一轴线的半径方向上的手大于第一轴线与壁上的开口之间的距离。