公开(公告)号：US08232361B2

公开(公告)日：2012-07-31

申请号：US11908888

申请日：2006-02-27

申请人： Takashi Shimizu ,  Toshitsugu Hosokawa ,  Masayuki Satake

发明人： Takashi Shimizu ,  Toshitsugu Hosokawa ,  Masayuki Satake

IPC分类号： C08F120/18 ,  B32B7/12

CPC分类号： C09J133/066 ,  C09J7/385 ,  G02B5/3025 ,  G02B5/3083 ,  G02F2202/28 ,  Y10T156/11 ,  Y10T156/1158 ,  Y10T156/1917 ,  Y10T428/28

摘要： An optical pressure-sensitive adhesive of the invention comprises a base polymer having a functional group (F); and a coupling agent that has a benzyl ester group and is represented by Formula (1): wherein A1 and A2 are different functional groups, one of A1 and A2 shows reactivity or interaction with the functional group (F) of the base polymer, R1 is an optionally substituted alkylene group of 1 to 12 carbon atoms and/or an optionally substituted phenylene group, and R2 and R3 are each a hydrogen atom or an alkyl group of 1 to 12 carbon atoms and may be the same or different. The pressure-sensitive adhesive is use in pressure-sensitive adhesive optical films and so on that is excellent in terms of both durability and release property.

摘要翻译： 本发明的光学粘合剂包括具有官能团（F）的基础聚合物; 和具有苄基酯基并由式（1）表示的偶联剂：其中A1和A2是不同的官能团，A1和A2之一表示与基础聚合物的官能团（F）的反应性或相互作用，R1 是1〜12个碳原子的任选取代的亚烷基和/或任意取代的亚苯基，R 2和R 3各自为氢原子或碳原子数为1〜12的烷基，可以相同也可以不同。 压敏粘合剂用于耐久性和剥离性优异的压敏粘合剂光学膜等中。

公开(公告)号：US20120111496A1

公开(公告)日：2012-05-10

申请号：US13285408

申请日：2011-10-31

申请人： Maxime Cadotte ,  Luc Guerin ,  Van Thanh Truong ,  Steve Whitehead

发明人： Maxime Cadotte ,  Luc Guerin ,  Van Thanh Truong ,  Steve Whitehead

IPC分类号： B32B38/10 ,  B29C35/08

CPC分类号： H01L24/799 ,  B08B7/0042 ,  B23K2103/42 ,  B23K2103/50 ,  B32B38/0008 ,  B32B38/10 ,  B32B43/006 ,  B32B2457/14 ,  H01L21/02076 ,  H01L21/31127 ,  H01L24/27 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/05442 ,  H01L2924/07025 ,  H01L2924/12042 ,  H01L2924/3025 ,  H01L2924/40501 ,  Y10S156/93 ,  Y10S156/941 ,  Y10T156/11 ,  Y10T156/1158 ,  Y10T156/1917 ,  H01L2924/00

摘要： A method for laser ashing of polyimide for a semiconductor manufacturing process using a structure, the structure comprising a supporting material attached to a semiconductor chip by a polyimide glue, includes releasing the supporting material from the polyimide glue, such that the polyimide glue remains on the semiconductor chip; and ashing the polyimide glue on the semiconductor chip using an ablating laser.

摘要翻译： 一种使用结构的半导体制造方法的聚酰亚胺的激光灰化方法，包括通过聚酰亚胺胶粘在半导体芯片上的支撑材料的结构，包括从聚酰亚胺胶释放支撑材料，使得聚酰亚胺胶保持在 半导体芯片; 并使用烧蚀激光将半导体芯片上的聚酰亚胺胶粉化。

公开(公告)号：US20120064735A1

公开(公告)日：2012-03-15

申请号：US13318663

申请日：2010-05-05

申请人： Guoyi Zhang ,  Xinrong Yang ,  Mingkun He ,  Yongiian Sun

发明人： Guoyi Zhang ,  Xinrong Yang ,  Mingkun He ,  Yongiian Sun

IPC分类号： H01L21/268 ,  B32B38/10

CPC分类号： B23K26/0648 ,  B23K26/082 ,  B23K26/40 ,  B23K2101/40 ,  B23K2103/172 ,  B23K2103/50 ,  H01L33/0079 ,  Y10T156/1917

摘要： A solid-state laser lift-off apparatus comprises: a solid-state laser (1), a light beam shaping lens (3), motors of oscillating mirrors (5,7), oscillating mirrors (4,6), a field lens (9), a movable platform (10), an industrial control computer and control software (8). The light beam shaping lens (3) is behind the solid-state laser (1), shaping the laser beam from the solid-state laser (1) into required shape. The motors of oscillating mirrors (5,7) are in front of the field lens (9), controlling the movement of the oscillating mirrors (4,6) according to the instruction of the control software (8) to implement different light beam scanning paths. A lift-off method for applying the solid-state laser lift-off apparatus uses a small laser spot to perform scanning, and enables damage-free separation of GaN from a sapphire substrate.

摘要翻译： 固体激光剥离装置包括：固体激光器（1），光束整形透镜（3），振动反射镜（5,7），振动反射镜（4,6），场透镜 （9），可移动平台（10），工业控制计算机和控制软件（8）。 光束整形透镜（3）在固态激光器（1）的后面，将来自固体激光器（1）的激光束成形为所需形状。 振荡镜（5,7）的电机位于场透镜（9）的前方，根据控制软件（8）的指令控制振动镜（4,6）的移动，以实现不同的光束扫描 路径。 用于施加固态激光剥离装置的剥离方法使用小的激光斑点进行扫描，并且能够使GaN与蓝宝石衬底无损分离。

公开(公告)号：US20110183449A1

公开(公告)日：2011-07-28

申请号：US13049490

申请日：2011-03-16

申请人： Beng So RYU

发明人： Beng So RYU

IPC分类号： H01L21/428 ,  B23K26/06

CPC分类号： H01L33/0079 ,  B23K26/066 ,  H01L21/268 ,  Y10T156/1917

摘要： An apparatus and method for manufacturing a light emitting devices by separating a semiconductor layer from a substrate includes a laser beam source for emitting a laser beam, a mesh-typed mask having a plurality of apertures through which the laser beam passes to provide a plurality of unit beams; and an imaging lens for forming a plurality of beam spots by focusing the plurality of unit beams at an interface between a substrate and a semiconductor layer to separate the substrate from the semiconductor layer.

摘要翻译： 用于通过从衬底分离半导体层来制造发光器件的装置和方法包括用于发射激光束的激光束源，具有多个孔的网状掩模，激光束穿过该孔，以提供多个 单位梁; 以及成像透镜，用于通过在衬底和半导体层之间的界面处聚焦多个单位光束来形成多个光束点，以将衬底与半导体层分离。

公开(公告)号：US20110132549A1

公开(公告)日：2011-06-09

申请号：US12962068

申请日：2010-12-07

申请人： Jeffrey P. Sercel ,  Marco Mendes ,  Jie Fu

发明人： Jeffrey P. Sercel ,  Marco Mendes ,  Jie Fu

IPC分类号： B26F3/16

CPC分类号： H01L21/7813 ,  B23K26/40 ,  B23K2101/40 ,  B23K2103/50 ,  B32B38/0008 ,  B32B38/10 ,  B32B43/006 ,  B32B2457/14 ,  H01L21/67115 ,  Y10S156/93 ,  Y10T156/1158 ,  Y10T156/1917

摘要： Laser lift off systems and methods may be used to provide monolithic laser lift off with minimal cracking by reducing the size of one or more beam spots in one or more dimensions to reduce plume pressure while maintaining sufficient energy to provide separation. By irradiating irradiation zones with various shapes and in various patterns, the laser lift off systems and methods use laser energy more efficiently, reduce cracking when separating layers, and improve productivity. Some laser lift off systems and methods described herein separate layers of material by irradiating non-contiguous irradiation zones with laser lift off zones (LOZs) that extend beyond the irradiation zones. Other laser lift off systems and methods described herein separate layers of material by shaping the irradiation zones and by controlling the overlap of the irradiation zones in a way that avoids uneven exposure of the workpiece. Consistent with at least one embodiment, a laser lift off system and method may be used to provide monolithic lift off of one or more epitaxial layers on a substrate of a semiconductor wafer.

摘要翻译： 激光剥离系统和方法可用于通过在一个或多个维度上减小一个或多个束斑的尺寸来减小羽流压力同时保持足够的能量以提供分离，从而提供具有最小裂纹的单片激光剥离。 通过照射各种形状和各种图案的照射区域，激光剥离系统和方法更有效地使用激光能量，减少分离层时的开裂，并提高生产率。 本文所述的一些激光剥离系统和方法通过用延伸超过照射区域的激光剥离区域（LOZ）照射不连续的照射区域来分离材料层。 本文所述的其它激光剥离系统和方法通过成形照射区域并通过以避免工件不均匀暴露的方式控制照射区域的重叠来分离材料层。 与至少一个实施例一致，可以使用激光剥离系统和方法来提供半导体晶片的衬底上的一个或多个外延层的单片剥离。

公开(公告)号：US20110048630A1

公开(公告)日：2011-03-03

申请号：US12847858

申请日：2010-07-30

申请人： Yukitoshi Hase ,  Masayuki Yamamoto

发明人： Yukitoshi Hase ,  Masayuki Yamamoto

IPC分类号： B32B38/10

CPC分类号： H01L21/67132 ,  Y10T156/1147 ,  Y10T156/1153 ,  Y10T156/1158 ,  Y10T156/1911 ,  Y10T156/1917

摘要： A chuck table adhesively holds a rear face of a mount frame subject to a dicing process with a protective tape joined thereto, and a suction plate having a heater embedded therein contacts and heats the protective tape. Consequently, an adhesion layer of the protective tape reduces its adhesive force due to foaming and expansion. Thereafter, the suction plate moves upward while keeping its suction force to separate the protective tape from all of chips.

摘要翻译： 卡盘台用连接有保护带的切割工艺粘合地保持安装框架的后表面，并且具有嵌入其中的加热器的吸板接触并加热保护带。 因此，保护​​带的粘合层由于发泡和膨胀而降低其粘附力。 此后，吸板向上移动，同时保持其吸力，以将保护带与所有芯片分离。

公开(公告)号：US20110010908A1

公开(公告)日：2011-01-20

申请号：US12760973

申请日：2010-04-15

申请人： GREGORY GEORGE ,  HALE JOHNSON ,  PATRICK GORUN ,  EMMETT HUGHLETT ,  JAMES HERMANOWSKI ,  MATTHEW STILES

发明人： GREGORY GEORGE ,  HALE JOHNSON ,  PATRICK GORUN ,  EMMETT HUGHLETT ,  JAMES HERMANOWSKI ,  MATTHEW STILES

IPC分类号： B23P19/00

CPC分类号： H01L21/6835 ,  B32B38/1858 ,  B32B43/006 ,  B32B2309/105 ,  B32B2457/14 ,  H01L21/67092 ,  H01L21/67132 ,  H01L21/673 ,  H01L2221/68318 ,  H01L2221/68327 ,  Y10S156/93 ,  Y10S156/932 ,  Y10S156/941 ,  Y10S156/942 ,  Y10S156/943 ,  Y10T29/49817 ,  Y10T29/53274 ,  Y10T156/1132 ,  Y10T156/1153 ,  Y10T156/1158 ,  Y10T156/1168 ,  Y10T156/1189 ,  Y10T156/1911 ,  Y10T156/1917 ,  Y10T156/1944 ,  Y10T156/1972 ,  Y10T156/1978 ,  Y10T279/18 ,  Y10T279/21 ,  Y10T279/26 ,  Y10T279/29

摘要： A debonder apparatus for debonding two via an adhesive layer temporary bonded wafers includes a top chuck assembly, a bottom chuck assembly, a static gantry supporting the top chuck assembly, an X-axis carriage drive supporting the bottom chuck assembly, and an X-axis drive control. The top chuck assembly includes a heater and a wafer holder. The X-axis drive control drives horizontally the bottom chuck assembly from a loading zone to a process zone under the top chuck assembly and from the process zone back to the loading zone. A wafer pair comprising a carrier wafer bonded to a device wafer via an adhesive layer is placed upon the bottom chuck assembly at the loading zone oriented so that the unbonded surface of the device wafer is in contact with the bottom assembly and is carried by the X-axis carriage drive to the process zone under the top chuck assembly and the unbonded surface of the carrier wafer is placed in contact with the top chuck assembly. The X-axis drive control initiates horizontal motion of the X-axis carriage drive along the X-axis while heat is applied to the carrier wafer via the heater and while the carrier wafer is held by the top chuck assembly via the wafer holder and thereby causes the device wafer to separate and slide away from the carrier wafer.

摘要翻译： 用于通过粘合剂层临时粘合的晶片脱粘两个的脱粘器装置包括顶部卡盘组件，底部卡盘组件，支撑顶部卡盘组件的静态机架，支撑底部卡盘组件的X轴托架驱动器和X轴 驱动控制。 顶部卡盘组件包括加热器和晶片保持器。 X轴驱动控制器将底部卡盘组件从装载区域水平驱动到顶部卡盘组件下方的过程区域，并从工艺区域向后加载到装载区域。 包括通过粘合剂层结合到器件晶片的载体晶片的晶片对被放置在位于底部卡盘组件处的负载区域处，使得器件晶片的未结合表面与底部组件接触并且由X 驱动到顶部卡盘组件下面的处理区域，并且载体晶片的未结合表面被放置成与顶部卡盘组件接触。 X轴驱动控制器启动X轴托架驱动器沿X轴的水平运动，同时通过加热器将热量施加到载体晶片上，同时通过晶片保持器将托架晶片保持在顶卡盘组件上，从而 使得器件晶片分离并从载体晶片滑离。

公开(公告)号：US20100266373A1

公开(公告)日：2010-10-21

申请号：US12761044

申请日：2010-04-15

申请人： GREGORY GEORGE ,  HALE JOHNSON ,  DENNIS PATRICIO

发明人： GREGORY GEORGE ,  HALE JOHNSON ,  DENNIS PATRICIO

IPC分类号： H01L21/68

CPC分类号： H01L21/6835 ,  B32B38/1858 ,  B32B43/006 ,  B32B2309/105 ,  B32B2457/14 ,  H01L21/67092 ,  H01L21/67132 ,  H01L21/673 ,  H01L2221/68318 ,  H01L2221/68327 ,  Y10S156/93 ,  Y10S156/932 ,  Y10S156/941 ,  Y10S156/942 ,  Y10S156/943 ,  Y10T29/49817 ,  Y10T29/53274 ,  Y10T156/1132 ,  Y10T156/1153 ,  Y10T156/1158 ,  Y10T156/1168 ,  Y10T156/1189 ,  Y10T156/1911 ,  Y10T156/1917 ,  Y10T156/1944 ,  Y10T156/1972 ,  Y10T156/1978 ,  Y10T279/18 ,  Y10T279/21 ,  Y10T279/26 ,  Y10T279/29

摘要： A device for centering circular wafers includes a support chuck for supporting a circular wafer to be centered upon its top surface, left, right and middle centering linkage rods and a cam plate synchronizing the rectilinear motion of the left, right and middle centering linkage rods. The left centering linkage rod includes a first rotating arm at a first end and rectilinear motion of the left centering linkage rod translates into rotational motion of the first rotating arm. The right centering linkage rod comprises a second rotating arm at a first end, and rectilinear motion of the right centering linkage rod translates into rotational motion of the second rotating arm. The first and second rotating arms are rotatable around an axis perpendicular to the top surface of the support chuck and comprise a curved edge surface configured to roll against the curved edge of the circular wafer. The middle centering linkage rod includes a third alignment arm at a first end. The third alignment arm is placed in contact with the curved edge of the circular wafer and linear motion of the middle centering linkage rod in the Y-direction pushes the third alignment arm and the circular wafer toward or away from the center of the support chuck. The cam plate includes first and second linear cam profiles. The first cam profile provides rectilinear motion for the middle centering linkage rod and the second linear cam profile provides rectilinear motion for the left and right centering linkage rods.

摘要翻译： 用于定心圆形晶片的装置包括支撑卡盘，用于将圆形晶片支撑在其顶部中心定位的中心，左右中心对中连杆和中心对中连杆的直线运动同步的凸轮板。 左对中连杆包括在第一端处的第一旋转臂，并且左对中连杆的直线运动转换成第一旋转臂的旋转运动。 右对中连杆包括在第一端的第二旋转臂，右对中连杆的直线运动转换为第二旋转臂的旋转运动。 第一和第二旋转臂可绕垂直于支撑卡盘的顶表面的轴线旋转，并且包括弯曲的边缘表面，该弯曲边缘表面被配置成相对于圆形晶片的弯曲边缘滚动。 中间定心连杆在第一端包括第三对准臂。 第三对准臂被放置成与圆形晶片的弯曲边缘接触，并且Y中心定中心连杆的线性运动将第三对准臂和圆形晶片推向或远离支撑卡盘的中心。 凸轮板包括第一和第二直线凸轮轮廓。 第一凸轮轮廓为中间定心联动杆提供直线运动，第二直线凸轮轮廓为左右对中连杆提供直线运动。

公开(公告)号：US20100243159A1

公开(公告)日：2010-09-30

申请号：US12743523

申请日：2008-11-17

申请人： Akinori Nishio ,  Kazuyuki Kiuchi

发明人： Akinori Nishio ,  Kazuyuki Kiuchi

IPC分类号： C09J5/00 ,  B32B7/10 ,  B32B7/12

CPC分类号： B29C53/32 ,  B29C63/0013 ,  B29K2995/0049 ,  B29L2009/00 ,  B32B7/02 ,  B32B7/06 ,  B32B7/12 ,  B32B25/08 ,  B32B25/14 ,  B32B27/08 ,  B32B27/16 ,  B32B27/18 ,  B32B27/20 ,  B32B27/22 ,  B32B27/281 ,  B32B27/283 ,  B32B27/285 ,  B32B27/30 ,  B32B27/302 ,  B32B27/308 ,  B32B27/32 ,  B32B27/325 ,  B32B27/34 ,  B32B27/36 ,  B32B27/40 ,  B32B37/12 ,  B32B37/144 ,  B32B2038/1891 ,  B32B2250/24 ,  B32B2255/10 ,  B32B2255/26 ,  B32B2255/28 ,  B32B2264/02 ,  B32B2264/101 ,  B32B2270/00 ,  B32B2307/308 ,  B32B2307/50 ,  B32B2307/518 ,  B32B2307/736 ,  B32B2307/748 ,  B32B2307/75 ,  B32B2405/00 ,  B32B2457/00 ,  C09J7/29 ,  C09J2201/162 ,  H01L21/304 ,  H01L21/67132 ,  H01L21/6836 ,  H01L2221/68327 ,  H01L2221/68386 ,  Y10T156/1158 ,  Y10T156/1168 ,  Y10T156/1917 ,  Y10T156/1978 ,  Y10T428/24942 ,  Y10T428/2848

摘要： A pressure sensitive adhesive sheet according to the present invention is a resin laminate, including a high thermally shrinkable base layer having relatively high thermal shrinkage ratio, having a ratio (A:B) of the thermal shrinkage ratio in a main shrinkage direction [A (%)] to the shrinkage ratio in a direction perpendicular to the main shrinkage direction [B (%)] of 1:1 to 10:1, and a low thermally shrinkable base layer having relatively low thermal shrinkage ratio, the high and low thermally shrinkable base layers bonded to each other via a self-adhesive layer, wherein the resin laminate bends toward the high thermally shrinkable base layer side when heated from any one direction and can automatically curl from one terminal unidirectionally to form a tubular roll by further heating. The pressure sensitive adhesive sheet can be separated from an adherend smoothly when heated from any one direction. Thus, it can be used, for example, as a pressure sensitive adhesive sheet for semiconductor wafer polishing.

摘要翻译： 根据本发明的压敏粘合片是具有热收缩率相对较高的热收缩性高的基层，其主收缩方向的热收缩率的比（A:B）为[A（B） ％）]相对于主收缩方向[B（％）]垂直的方向的收缩率为1:1〜10:1，热收缩率比较低的热收缩性低的基底层，高，低热收缩率 通过自粘合层彼此粘合的可收缩的基底层，其中当从任何一个方向加热时，树脂层压板朝向高热收缩基底层弯曲，并且可以通过进一步加热自动地从一个端子卷曲形成管状辊。 当从任何一个方向加热时，压敏粘合片可以平滑地与被粘物分离。 因此，其可以用作例如半导体晶片研磨用压敏粘合片。

公开(公告)号：US20100224320A1

公开(公告)日：2010-09-09

申请号：US12488934

申请日：2009-06-22

申请人： Pao-Ming Tsai ,  Liang-You Jiang ,  Yu-Yang Chang

发明人： Pao-Ming Tsai ,  Liang-You Jiang ,  Yu-Yang Chang

IPC分类号： B32B38/10 ,  B29C63/00

CPC分类号： H01L21/67092 ,  G02F1/1303 ,  G02F1/133305 ,  G09F3/208 ,  Y10T156/1132 ,  Y10T156/1158 ,  Y10T156/1184 ,  Y10T156/1917 ,  Y10T156/1944 ,  Y10T156/1967

摘要： The invention provides an apparatus for de-bonding a flexible device and method thereof. The apparatus for de-bonding a flexible device includes a carrier to mount a carrier substrate thereon, a release layer thereon and a flexible device covering the release layer. A separation device disposed over the carrier is used to separate the flexible device from the release layer and the carrier substrate with air entering into an interface between the flexible device and the release layer. A vacuum device disposed over the carrier is used to suction the flexible device.

摘要翻译： 本发明提供了一种用于去粘合柔性装置的装置及其方法。 用于去粘合柔性装置的装置包括载体，用于在其上安装载体基材，其上具有剥离层，以及覆盖释放层的柔性装置。 设置在载体上的分离装置用于将柔性装置与释放层和载体基板分离，空气进入柔性装置和释放层之间的界面。 使用设置在载体上的真空装置来抽吸柔性装置。